JPWO2022074719A1 - - Google Patents
Info
- Publication number
- JPWO2022074719A1 JPWO2022074719A1 JP2022554990A JP2022554990A JPWO2022074719A1 JP WO2022074719 A1 JPWO2022074719 A1 JP WO2022074719A1 JP 2022554990 A JP2022554990 A JP 2022554990A JP 2022554990 A JP2022554990 A JP 2022554990A JP WO2022074719 A1 JPWO2022074719 A1 JP WO2022074719A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07152—Means for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W80/00—Direct bonding of chips, wafers or substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W80/00—Direct bonding of chips, wafers or substrates
- H10W80/301—Bonding techniques, e.g. hybrid bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W80/00—Direct bonding of chips, wafers or substrates
- H10W80/301—Bonding techniques, e.g. hybrid bonding
- H10W80/312—Bonding techniques, e.g. hybrid bonding characterised by the direct bonding of electrically conductive pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W80/00—Direct bonding of chips, wafers or substrates
- H10W80/301—Bonding techniques, e.g. hybrid bonding
- H10W80/327—Bonding techniques, e.g. hybrid bonding characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/037776 WO2022074719A1 (ja) | 2020-10-05 | 2020-10-05 | 表面処理装置および半導体装置の製造装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022074719A1 true JPWO2022074719A1 (https=) | 2022-04-14 |
| JPWO2022074719A5 JPWO2022074719A5 (https=) | 2023-07-14 |
| JP7470457B2 JP7470457B2 (ja) | 2024-04-18 |
Family
ID=81126739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022554990A Active JP7470457B2 (ja) | 2020-10-05 | 2020-10-05 | 表面処理装置および半導体装置の製造装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12489004B2 (https=) |
| EP (1) | EP4227980A4 (https=) |
| JP (1) | JP7470457B2 (https=) |
| KR (1) | KR102894616B1 (https=) |
| CN (1) | CN116325100A (https=) |
| WO (1) | WO2022074719A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022150172A (ja) * | 2021-03-26 | 2022-10-07 | 株式会社ディスコ | ウエーハの貼り合わせ方法 |
| FR3144695B1 (fr) * | 2022-12-28 | 2026-04-03 | Commissariat Energie Atomique | Procédé de collage hybride direct de puce à plaque |
| JP2024097401A (ja) * | 2023-01-06 | 2024-07-19 | ヤマハロボティクスホールディングス株式会社 | 半導体チップのアライメント方法、接合方法、半導体装置、並びに電子部品製造システム |
| JP7659910B2 (ja) * | 2023-04-24 | 2025-04-10 | ヤマハロボティクスホールディングス株式会社 | プラズマ処理方法及び接合システム |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015211130A (ja) * | 2014-04-25 | 2015-11-24 | ボンドテック株式会社 | 基板接合装置および基板接合方法 |
| WO2017155002A1 (ja) * | 2016-03-11 | 2017-09-14 | ボンドテック株式会社 | 基板接合方法 |
| WO2018062467A1 (ja) * | 2016-09-30 | 2018-04-05 | ボンドテック株式会社 | 基板接合方法および基板接合装置 |
| JP2018201022A (ja) * | 2014-04-25 | 2018-12-20 | 須賀 唯知 | 基板接合装置および基板接合方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012175043A (ja) | 2011-02-24 | 2012-09-10 | Tokyo Electron Ltd | 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体 |
| JP2013243333A (ja) * | 2012-04-24 | 2013-12-05 | Tadatomo Suga | チップオンウエハ接合方法及び接合装置並びにチップとウエハとを含む構造体 |
| JP6337400B2 (ja) | 2012-04-24 | 2018-06-06 | 須賀 唯知 | チップオンウエハ接合方法及び接合装置並びにチップとウエハとを含む構造体 |
| US10964664B2 (en) * | 2018-04-20 | 2021-03-30 | Invensas Bonding Technologies, Inc. | DBI to Si bonding for simplified handle wafer |
-
2020
- 2020-10-05 KR KR1020237010403A patent/KR102894616B1/ko active Active
- 2020-10-05 WO PCT/JP2020/037776 patent/WO2022074719A1/ja not_active Ceased
- 2020-10-05 US US18/029,663 patent/US12489004B2/en active Active
- 2020-10-05 CN CN202080105720.8A patent/CN116325100A/zh active Pending
- 2020-10-05 EP EP20956668.6A patent/EP4227980A4/en active Pending
- 2020-10-05 JP JP2022554990A patent/JP7470457B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015211130A (ja) * | 2014-04-25 | 2015-11-24 | ボンドテック株式会社 | 基板接合装置および基板接合方法 |
| JP2018201022A (ja) * | 2014-04-25 | 2018-12-20 | 須賀 唯知 | 基板接合装置および基板接合方法 |
| WO2017155002A1 (ja) * | 2016-03-11 | 2017-09-14 | ボンドテック株式会社 | 基板接合方法 |
| WO2018062467A1 (ja) * | 2016-09-30 | 2018-04-05 | ボンドテック株式会社 | 基板接合方法および基板接合装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7470457B2 (ja) | 2024-04-18 |
| EP4227980A1 (en) | 2023-08-16 |
| US20230369079A1 (en) | 2023-11-16 |
| WO2022074719A1 (ja) | 2022-04-14 |
| EP4227980A4 (en) | 2024-09-25 |
| KR20230054731A (ko) | 2023-04-25 |
| CN116325100A (zh) | 2023-06-23 |
| US12489004B2 (en) | 2025-12-02 |
| KR102894616B1 (ko) | 2025-12-02 |
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