JPWO2022059629A5 - - Google Patents

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JPWO2022059629A5
JPWO2022059629A5 JP2022550537A JP2022550537A JPWO2022059629A5 JP WO2022059629 A5 JPWO2022059629 A5 JP WO2022059629A5 JP 2022550537 A JP2022550537 A JP 2022550537A JP 2022550537 A JP2022550537 A JP 2022550537A JP WO2022059629 A5 JPWO2022059629 A5 JP WO2022059629A5
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JP2022550537A 2020-09-16 2021-09-13 非接触材料同定方法、非接触温度同定方法、及び熱処理加工進行度同定方法 Active JP7460202B2 (ja)

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Application Number Priority Date Filing Date Title
JP2020155085 2020-09-16
JP2020155085 2020-09-16
PCT/JP2021/033443 WO2022059629A1 (ja) 2020-09-16 2021-09-13 非接触材料同定方法、非接触温度同定方法、及び熱処理加工進行度同定方法

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JPWO2022059629A1 JPWO2022059629A1 (https=) 2022-03-24
JPWO2022059629A5 true JPWO2022059629A5 (https=) 2023-06-05
JP7460202B2 JP7460202B2 (ja) 2024-04-02

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JP2022550537A Active JP7460202B2 (ja) 2020-09-16 2021-09-13 非接触材料同定方法、非接触温度同定方法、及び熱処理加工進行度同定方法

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US (1) US12345648B2 (https=)
JP (1) JP7460202B2 (https=)
WO (1) WO2022059629A1 (https=)

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CN117169273B (zh) * 2023-09-07 2024-04-26 华南理工大学 一种基于反射法测量材料常温方向发射率的装置及方法
CN118443156B (zh) * 2024-07-08 2024-10-18 深圳查尔孟科技有限公司 一种精确测温控制系统及方法

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JPS60169742A (ja) * 1984-02-13 1985-09-03 Shinkawa Ltd ダイボンド接着状態の検査装置
US4561786A (en) 1984-03-15 1985-12-31 Williamson Corporation Temperature measuring apparatus
US6333501B1 (en) 2000-01-27 2001-12-25 Perkin-Elmer Corporation Methods, apparatus, and articles of manufacture for performing spectral calibration
JP4689093B2 (ja) 2001-06-29 2011-05-25 浜松ホトニクス株式会社 レーザ照射領域監視装置、レーザ照射領域監視方法、レーザ加工装置及びレーザ加工方法
US9297749B2 (en) * 2012-03-27 2016-03-29 Innovative Science Tools, Inc. Optical analyzer for identification of materials using transmission spectroscopy
US8829437B2 (en) 2012-07-04 2014-09-09 Apple Inc. Method for quantifying amorphous content in bulk metallic glass parts using thermal emissivity
JP6831350B2 (ja) 2018-06-20 2021-02-17 日立グローバルライフソリューションズ株式会社 誘導加熱調理器

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