JPWO2022045140A1 - - Google Patents

Info

Publication number
JPWO2022045140A1
JPWO2022045140A1 JP2022544630A JP2022544630A JPWO2022045140A1 JP WO2022045140 A1 JPWO2022045140 A1 JP WO2022045140A1 JP 2022544630 A JP2022544630 A JP 2022544630A JP 2022544630 A JP2022544630 A JP 2022544630A JP WO2022045140 A1 JPWO2022045140 A1 JP WO2022045140A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022544630A
Other languages
Japanese (ja)
Other versions
JPWO2022045140A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022045140A1 publication Critical patent/JPWO2022045140A1/ja
Publication of JPWO2022045140A5 publication Critical patent/JPWO2022045140A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
    • B28B11/12—Apparatus or processes for treating or working the shaped or preshaped articles for removing parts of the articles by cutting
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
JP2022544630A 2020-08-25 2021-08-24 Pending JPWO2022045140A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020141699 2020-08-25
PCT/JP2021/031003 WO2022045140A1 (ja) 2020-08-25 2021-08-24 セラミック板及びその製造方法、接合基板及びその製造方法、並びに、回路基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2022045140A1 true JPWO2022045140A1 (https=) 2022-03-03
JPWO2022045140A5 JPWO2022045140A5 (https=) 2022-12-08

Family

ID=80353954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022544630A Pending JPWO2022045140A1 (https=) 2020-08-25 2021-08-24

Country Status (2)

Country Link
JP (1) JPWO2022045140A1 (https=)
WO (1) WO2022045140A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08174244A (ja) * 1994-12-20 1996-07-09 Hitachi Cable Ltd 基板材料の切断方法及びその装置
JP2001053443A (ja) * 1999-08-06 2001-02-23 Hitachi Ltd 電子回路基板の製造方法，電子回路基板の製造装置及び電子回路基板
JP2008198905A (ja) * 2007-02-15 2008-08-28 Hitachi Metals Ltd セラミックス基板及びセラミックス回路基板の製造方法並びに集合基板と半導体モジュール
JP2011199236A (ja) * 2010-02-24 2011-10-06 Kyocera Corp 多数個取り配線基板
JP2014107460A (ja) * 2012-11-29 2014-06-09 Kyocera Corp 配線基板およびそれを用いた実装構造体
JP2017065935A (ja) * 2015-09-28 2017-04-06 デンカ株式会社 セラミックス回路基板
JP2021072374A (ja) * 2019-10-31 2021-05-06 デンカ株式会社 セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08174244A (ja) * 1994-12-20 1996-07-09 Hitachi Cable Ltd 基板材料の切断方法及びその装置
JP2001053443A (ja) * 1999-08-06 2001-02-23 Hitachi Ltd 電子回路基板の製造方法，電子回路基板の製造装置及び電子回路基板
JP2008198905A (ja) * 2007-02-15 2008-08-28 Hitachi Metals Ltd セラミックス基板及びセラミックス回路基板の製造方法並びに集合基板と半導体モジュール
JP2011199236A (ja) * 2010-02-24 2011-10-06 Kyocera Corp 多数個取り配線基板
JP2014107460A (ja) * 2012-11-29 2014-06-09 Kyocera Corp 配線基板およびそれを用いた実装構造体
JP2017065935A (ja) * 2015-09-28 2017-04-06 デンカ株式会社 セラミックス回路基板
JP2021072374A (ja) * 2019-10-31 2021-05-06 デンカ株式会社 セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法
WO2021085490A1 (ja) * 2019-10-31 2021-05-06 デンカ株式会社 セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法

Also Published As

Publication number Publication date
WO2022045140A1 (ja) 2022-03-03

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