JPWO2022045140A1 - - Google Patents
Info
- Publication number
- JPWO2022045140A1 JPWO2022045140A1 JP2022544630A JP2022544630A JPWO2022045140A1 JP WO2022045140 A1 JPWO2022045140 A1 JP WO2022045140A1 JP 2022544630 A JP2022544630 A JP 2022544630A JP 2022544630 A JP2022544630 A JP 2022544630A JP WO2022045140 A1 JPWO2022045140 A1 JP WO2022045140A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/12—Apparatus or processes for treating or working the shaped or preshaped articles for removing parts of the articles by cutting
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020141699 | 2020-08-25 | ||
PCT/JP2021/031003 WO2022045140A1 (ja) | 2020-08-25 | 2021-08-24 | セラミック板及びその製造方法、接合基板及びその製造方法、並びに、回路基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022045140A1 true JPWO2022045140A1 (ja) | 2022-03-03 |
JPWO2022045140A5 JPWO2022045140A5 (ja) | 2022-12-08 |
Family
ID=80353954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022544630A Pending JPWO2022045140A1 (ja) | 2020-08-25 | 2021-08-24 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2022045140A1 (ja) |
WO (1) | WO2022045140A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08174244A (ja) * | 1994-12-20 | 1996-07-09 | Hitachi Cable Ltd | 基板材料の切断方法及びその装置 |
JP2001053443A (ja) * | 1999-08-06 | 2001-02-23 | Hitachi Ltd | 電子回路基板の製造方法,電子回路基板の製造装置及び電子回路基板 |
JP2008198905A (ja) * | 2007-02-15 | 2008-08-28 | Hitachi Metals Ltd | セラミックス基板及びセラミックス回路基板の製造方法並びに集合基板と半導体モジュール |
JP2011199236A (ja) * | 2010-02-24 | 2011-10-06 | Kyocera Corp | 多数個取り配線基板 |
JP2014107460A (ja) * | 2012-11-29 | 2014-06-09 | Kyocera Corp | 配線基板およびそれを用いた実装構造体 |
JP2017065935A (ja) * | 2015-09-28 | 2017-04-06 | デンカ株式会社 | セラミックス回路基板 |
JP2021072374A (ja) * | 2019-10-31 | 2021-05-06 | デンカ株式会社 | セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 |
-
2021
- 2021-08-24 JP JP2022544630A patent/JPWO2022045140A1/ja active Pending
- 2021-08-24 WO PCT/JP2021/031003 patent/WO2022045140A1/ja active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08174244A (ja) * | 1994-12-20 | 1996-07-09 | Hitachi Cable Ltd | 基板材料の切断方法及びその装置 |
JP2001053443A (ja) * | 1999-08-06 | 2001-02-23 | Hitachi Ltd | 電子回路基板の製造方法,電子回路基板の製造装置及び電子回路基板 |
JP2008198905A (ja) * | 2007-02-15 | 2008-08-28 | Hitachi Metals Ltd | セラミックス基板及びセラミックス回路基板の製造方法並びに集合基板と半導体モジュール |
JP2011199236A (ja) * | 2010-02-24 | 2011-10-06 | Kyocera Corp | 多数個取り配線基板 |
JP2014107460A (ja) * | 2012-11-29 | 2014-06-09 | Kyocera Corp | 配線基板およびそれを用いた実装構造体 |
JP2017065935A (ja) * | 2015-09-28 | 2017-04-06 | デンカ株式会社 | セラミックス回路基板 |
JP2021072374A (ja) * | 2019-10-31 | 2021-05-06 | デンカ株式会社 | セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 |
WO2021085490A1 (ja) * | 2019-10-31 | 2021-05-06 | デンカ株式会社 | セラミックス基板及びその製造方法、複合基板及びその製造方法、並びに、回路基板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2022045140A1 (ja) | 2022-03-03 |
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