JPWO2022034852A1 - - Google Patents

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Publication number
JPWO2022034852A1
JPWO2022034852A1 JP2022542830A JP2022542830A JPWO2022034852A1 JP WO2022034852 A1 JPWO2022034852 A1 JP WO2022034852A1 JP 2022542830 A JP2022542830 A JP 2022542830A JP 2022542830 A JP2022542830 A JP 2022542830A JP WO2022034852 A1 JPWO2022034852 A1 JP WO2022034852A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022542830A
Other languages
Japanese (ja)
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JPWO2022034852A5 (US20020051482A1-20020502-M00057.png
JP7355249B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022034852A1 publication Critical patent/JPWO2022034852A1/ja
Publication of JPWO2022034852A5 publication Critical patent/JPWO2022034852A5/ja
Application granted granted Critical
Publication of JP7355249B2 publication Critical patent/JP7355249B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0036—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/32—Filling or coating with impervious material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2022542830A 2020-08-13 2021-08-05 膜の製造方法および導電性膜 Active JP7355249B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020136824 2020-08-13
JP2020136824 2020-08-13
PCT/JP2021/029149 WO2022034852A1 (ja) 2020-08-13 2021-08-05 膜の製造方法および導電性膜

Publications (3)

Publication Number Publication Date
JPWO2022034852A1 true JPWO2022034852A1 (US20020051482A1-20020502-M00057.png) 2022-02-17
JPWO2022034852A5 JPWO2022034852A5 (US20020051482A1-20020502-M00057.png) 2023-04-21
JP7355249B2 JP7355249B2 (ja) 2023-10-03

Family

ID=80247868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022542830A Active JP7355249B2 (ja) 2020-08-13 2021-08-05 膜の製造方法および導電性膜

Country Status (4)

Country Link
US (1) US20230197317A1 (US20020051482A1-20020502-M00057.png)
JP (1) JP7355249B2 (US20020051482A1-20020502-M00057.png)
CN (1) CN116033971B (US20020051482A1-20020502-M00057.png)
WO (1) WO2022034852A1 (US20020051482A1-20020502-M00057.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023248598A1 (ja) * 2022-06-24 2023-12-28 株式会社村田製作所 膜およびその製造方法
WO2024053336A1 (ja) * 2022-09-07 2024-03-14 株式会社村田製作所 構造体

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5471492A (en) * 1977-11-16 1979-06-08 Ishikawajima Harima Heavy Ind Co Ltd Wet type blast nozzle
JPS58205556A (ja) * 1982-05-27 1983-11-30 Mitsuo Sohgoh Kenkyusho Kk 物質の分散法
JPH0422056U (US20020051482A1-20020502-M00057.png) * 1990-06-18 1992-02-24
JPH0693408A (ja) * 1992-09-10 1994-04-05 Science & Tech Agency 混合粉末の噴射堆積装置
JPH11244738A (ja) * 1997-12-13 1999-09-14 Usbi Co 基板上にコ―ティングをスプレイするための収束スプレイノズル及び方法
JP2003272628A (ja) * 2002-03-18 2003-09-26 Mitsubishi Chemicals Corp リチウム遷移金属複合酸化物の製造方法
JP2004230243A (ja) * 2003-01-29 2004-08-19 Denki Kagaku Kogyo Kk 噴霧方法及び装置
WO2016101450A1 (zh) * 2014-12-26 2016-06-30 中兴通讯股份有限公司 多功率充电器及多功率充电方法
CN107393622A (zh) * 2017-06-27 2017-11-24 宁波墨西科技有限公司 一种石墨烯‑亚氧化钛复合导电剂及其制备方法
WO2018212044A1 (ja) * 2017-05-16 2018-11-22 株式会社村田製作所 電磁シールドを有する電子部品およびその製造方法
US20200009846A1 (en) * 2018-07-09 2020-01-09 Nanotek Instruments, Inc. Process for producing graphene foam laminate-based sealing materials
US20200240000A1 (en) * 2017-10-16 2020-07-30 Drexel University Mxene layers as substrates for growth of highly oriented perovskite thin films

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5845846A (en) * 1969-12-17 1998-12-08 Fujisaki Electric Co., Ltd. Spraying nozzle and method for ejecting liquid as fine particles
US5074244A (en) * 1990-01-23 1991-12-24 Metriguard Inc. Spray marking nozzle
NZ525880A (en) * 2003-05-14 2005-11-25 Methven Ltd Method and apparatus for producing droplet spray
JP4058018B2 (ja) * 2003-12-16 2008-03-05 松下電器産業株式会社 圧電素子及びその製造方法、並びにその圧電素子を備えたインクジェットヘッド、インクジェット式記録装置及び角速度センサ
US7258428B2 (en) * 2004-09-30 2007-08-21 Kimberly-Clark Worldwide, Inc. Multiple head concentric encapsulation system
JP2006164915A (ja) * 2004-12-10 2006-06-22 Nissan Motor Co Ltd 触媒材料の塗布方法及び塗布装置
SE0500647L (sv) * 2005-03-23 2006-09-24 Biosensor Applications Sweden Ab Publ Production of polycrystalline films for shear mode piezoelectric thin film resonators
US20080206616A1 (en) * 2007-02-27 2008-08-28 Cabot Corporation Catalyst coated membranes and sprayable inks and processes for forming same
JP5372456B2 (ja) * 2008-10-09 2013-12-18 株式会社ミマキエンジニアリング インクジェットプリンタ
JP5471492B2 (ja) 2010-01-20 2014-04-16 日本精工株式会社 ラックアンドピニオン式ステアリング装置の製造方法
JP5496761B2 (ja) * 2010-04-21 2014-05-21 株式会社いけうち 二流体ノズル
JP5732376B2 (ja) * 2011-06-21 2015-06-10 東京エレクトロン株式会社 ２流体ノズル及び基板液処理装置並びに基板液処理方法
CN103440995A (zh) * 2013-08-08 2013-12-11 中国科学院宁波材料技术与工程研究所 一种用于超级电容器的电极材料及其制备方法
US10562309B2 (en) * 2014-07-08 2020-02-18 Seiko Epson Corporation Liquid ejecting apparatus and maintenance method of liquid ejecting apparatus
EP3197832B1 (en) * 2014-09-25 2022-06-22 Drexel University Physical forms of mxene materials exhibiting novel electrical and optical characteristics
JP6634776B2 (ja) * 2015-10-22 2020-01-22 株式会社村田製作所 ナノシートによる薄膜の製造方法および製造装置
US11312631B2 (en) * 2017-09-28 2022-04-26 Murata Manufacturing Co., Ltd. Aligned film and method for producing the same
US20200023399A1 (en) * 2018-07-17 2020-01-23 Tti (Macao Commercial Offshore) Limited Painting assembly
WO2020136864A1 (ja) * 2018-12-28 2020-07-02 株式会社アドマテックス ＭＸｅｎｅ粒子材料、スラリー、二次電池、透明電極、ＭＸｅｎｅ粒子材料の製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5471492A (en) * 1977-11-16 1979-06-08 Ishikawajima Harima Heavy Ind Co Ltd Wet type blast nozzle
JPS58205556A (ja) * 1982-05-27 1983-11-30 Mitsuo Sohgoh Kenkyusho Kk 物質の分散法
JPH0422056U (US20020051482A1-20020502-M00057.png) * 1990-06-18 1992-02-24
JPH0693408A (ja) * 1992-09-10 1994-04-05 Science & Tech Agency 混合粉末の噴射堆積装置
JPH11244738A (ja) * 1997-12-13 1999-09-14 Usbi Co 基板上にコ―ティングをスプレイするための収束スプレイノズル及び方法
JP2003272628A (ja) * 2002-03-18 2003-09-26 Mitsubishi Chemicals Corp リチウム遷移金属複合酸化物の製造方法
JP2004230243A (ja) * 2003-01-29 2004-08-19 Denki Kagaku Kogyo Kk 噴霧方法及び装置
WO2016101450A1 (zh) * 2014-12-26 2016-06-30 中兴通讯股份有限公司 多功率充电器及多功率充电方法
WO2018212044A1 (ja) * 2017-05-16 2018-11-22 株式会社村田製作所 電磁シールドを有する電子部品およびその製造方法
CN107393622A (zh) * 2017-06-27 2017-11-24 宁波墨西科技有限公司 一种石墨烯‑亚氧化钛复合导电剂及其制备方法
US20200240000A1 (en) * 2017-10-16 2020-07-30 Drexel University Mxene layers as substrates for growth of highly oriented perovskite thin films
US20200009846A1 (en) * 2018-07-09 2020-01-09 Nanotek Instruments, Inc. Process for producing graphene foam laminate-based sealing materials

Also Published As

Publication number Publication date
CN116033971A (zh) 2023-04-28
US20230197317A1 (en) 2023-06-22
JP7355249B2 (ja) 2023-10-03
CN116033971B (zh) 2024-02-27
WO2022034852A1 (ja) 2022-02-17

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