JPWO2022030390A1 - - Google Patents

Info

Publication number
JPWO2022030390A1
JPWO2022030390A1 JP2022541505A JP2022541505A JPWO2022030390A1 JP WO2022030390 A1 JPWO2022030390 A1 JP WO2022030390A1 JP 2022541505 A JP2022541505 A JP 2022541505A JP 2022541505 A JP2022541505 A JP 2022541505A JP WO2022030390 A1 JPWO2022030390 A1 JP WO2022030390A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022541505A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022030390A1 publication Critical patent/JPWO2022030390A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06Joining glass to glass by processes other than fusing
    • C03C27/10Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15Ceramic or glass substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
JP2022541505A 2020-08-06 2021-07-30 Pending JPWO2022030390A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020133874 2020-08-06
PCT/JP2021/028374 WO2022030390A1 (ja) 2020-08-06 2021-07-30 積層体の製造方法、積層体および半導体パッケージの製造方法

Publications (1)

Publication Number Publication Date
JPWO2022030390A1 true JPWO2022030390A1 (ja) 2022-02-10

Family

ID=80117905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022541505A Pending JPWO2022030390A1 (ja) 2020-08-06 2021-07-30

Country Status (4)

Country Link
JP (1) JPWO2022030390A1 (ja)
CN (1) CN116133847A (ja)
TW (1) TW202206388A (ja)
WO (1) WO2022030390A1 (ja)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62167380A (ja) * 1986-01-20 1987-07-23 Fujitsu Ltd 平板接合方法
DE4436561C1 (de) * 1994-10-13 1996-03-14 Deutsche Spezialglas Ag Verfahren zur Veränderung der Durchbiegung von anodisch gebondeten flächigen Verbundkörpern aus Glas und Metall oder Halbleitermaterialien
JPH10338556A (ja) * 1997-06-09 1998-12-22 Sekisui Chem Co Ltd 異種合わせガラス
JP3696084B2 (ja) * 2000-12-25 2005-09-14 株式会社東芝 X線平面検出装置
JP4020097B2 (ja) * 2004-05-11 2007-12-12 セイコーエプソン株式会社 半導体チップ、半導体装置及びその製造方法、並びに電子機器
JP4935163B2 (ja) * 2006-04-11 2012-05-23 日本電気株式会社 半導体チップ搭載用基板
WO2008142814A1 (ja) * 2007-05-23 2008-11-27 Sharp Kabushiki Kaisha 液晶表示素子及びその製造方法
JP2013238678A (ja) * 2012-05-11 2013-11-28 Asahi Glass Co Ltd 反射器
CN102707474B (zh) * 2012-05-11 2013-07-24 京东方科技集团股份有限公司 一种弯曲液晶显示屏及其制造方法和设备
JP2014112606A (ja) * 2012-12-05 2014-06-19 Shinko Electric Ind Co Ltd 半導体パッケージ
JP6259307B2 (ja) * 2014-02-18 2018-01-10 株式会社クラレ 合わせガラス用中間膜およびそれを用いた合わせガラス
JP2015223810A (ja) * 2014-05-29 2015-12-14 旭硝子株式会社 樹脂層付き支持基板およびガラス積層体
KR102651767B1 (ko) * 2015-05-28 2024-03-28 에이지씨 가부시키가이샤 유리 기판 및 적층 기판
JP7013872B2 (ja) * 2016-10-05 2022-02-15 東レ株式会社 樹脂組成物、硬化膜、半導体装置およびそれらの製造方法
JP2018142530A (ja) * 2017-02-27 2018-09-13 大日本印刷株式会社 調光部材、それを備えた建材、及び、建材の製造方法

Also Published As

Publication number Publication date
CN116133847A (zh) 2023-05-16
WO2022030390A1 (ja) 2022-02-10
TW202206388A (zh) 2022-02-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

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Effective date: 20240209