JPWO2022014300A1 - - Google Patents
Info
- Publication number
- JPWO2022014300A1 JPWO2022014300A1 JP2022536221A JP2022536221A JPWO2022014300A1 JP WO2022014300 A1 JPWO2022014300 A1 JP WO2022014300A1 JP 2022536221 A JP2022536221 A JP 2022536221A JP 2022536221 A JP2022536221 A JP 2022536221A JP WO2022014300 A1 JPWO2022014300 A1 JP WO2022014300A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
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JP2020119701 | 2020-07-13 | ||
PCT/JP2021/024139 WO2022014300A1 (ja) | 2020-07-13 | 2021-06-25 | 半導体装置、および半導体装置の製造方法 |
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US (1) | US20230245954A1 (ja) |
JP (1) | JPWO2022014300A1 (ja) |
CN (1) | CN115769351A (ja) |
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JP6104098B2 (ja) * | 2013-08-21 | 2017-03-29 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法 |
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2021
- 2021-06-25 JP JP2022536221A patent/JPWO2022014300A1/ja active Pending
- 2021-06-25 CN CN202180047781.8A patent/CN115769351A/zh active Pending
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- 2021-06-25 US US18/004,643 patent/US20230245954A1/en active Pending
- 2021-06-25 DE DE112021002694.1T patent/DE112021002694T5/de active Pending
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