JPWO2021261070A1 - - Google Patents

Info

Publication number
JPWO2021261070A1
JPWO2021261070A1 JP2022532355A JP2022532355A JPWO2021261070A1 JP WO2021261070 A1 JPWO2021261070 A1 JP WO2021261070A1 JP 2022532355 A JP2022532355 A JP 2022532355A JP 2022532355 A JP2022532355 A JP 2022532355A JP WO2021261070 A1 JPWO2021261070 A1 JP WO2021261070A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022532355A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021261070A1 publication Critical patent/JPWO2021261070A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/57—Control of the dynamic range
    • H04N25/571—Control of the dynamic range involving a non-linear response
    • H04N25/573—Control of the dynamic range involving a non-linear response the logarithmic type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/47—Image sensors with pixel address output; Event-driven image sensors; Selection of pixels to be read out based on image data
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/42—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by switching between different modes of operation using different resolutions or aspect ratios, e.g. switching between interlaced and non-interlaced mode
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2022532355A 2020-06-26 2021-04-26 Pending JPWO2021261070A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020110957 2020-06-26
PCT/JP2021/016652 WO2021261070A1 (ja) 2020-06-26 2021-04-26 固体撮像装置及び撮像装置

Publications (1)

Publication Number Publication Date
JPWO2021261070A1 true JPWO2021261070A1 (ja) 2021-12-30

Family

ID=79282416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022532355A Pending JPWO2021261070A1 (ja) 2020-06-26 2021-04-26

Country Status (8)

Country Link
US (1) US20230209218A1 (ja)
EP (1) EP4175287A4 (ja)
JP (1) JPWO2021261070A1 (ja)
KR (1) KR20230028404A (ja)
CN (1) CN116057956A (ja)
DE (1) DE112021003436T5 (ja)
TW (1) TW202205644A (ja)
WO (1) WO2021261070A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12003870B2 (en) 2022-04-15 2024-06-04 Sony Semiconductor Solutions Corporation Binning in hybrid pixel structure of image pixels and event vision sensor (EVS) pixels

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0468278B1 (en) 1990-07-12 1996-04-10 DAIDO MACHINERY, Ltd. A forging lubricant and a method for forming a lubricant coat on the surface of a linear material
JP5244587B2 (ja) 2005-06-03 2013-07-24 ウニヴェルズィテート チューリッヒ 時間依存性の画像データを検出するフォトアレイ
TW202408216A (zh) * 2018-01-23 2024-02-16 日商索尼半導體解決方案公司 光檢測裝置
JP2019134202A (ja) * 2018-01-29 2019-08-08 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像素子の制御方法
JP2020053827A (ja) * 2018-09-27 2020-04-02 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、および、撮像装置
JP2020072317A (ja) * 2018-10-30 2020-05-07 ソニーセミコンダクタソリューションズ株式会社 センサ及び制御方法
JP2020088676A (ja) * 2018-11-28 2020-06-04 ソニーセミコンダクタソリューションズ株式会社 センサ及び制御方法
JP7489189B2 (ja) * 2019-08-30 2024-05-23 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法

Also Published As

Publication number Publication date
WO2021261070A1 (ja) 2021-12-30
EP4175287A1 (en) 2023-05-03
KR20230028404A (ko) 2023-02-28
CN116057956A (zh) 2023-05-02
EP4175287A4 (en) 2023-08-02
TW202205644A (zh) 2022-02-01
US20230209218A1 (en) 2023-06-29
DE112021003436T5 (de) 2023-04-20

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Legal Events

Date Code Title Description
A621 Written request for application examination

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Effective date: 20240418