JPWO2021260972A1 - - Google Patents

Info

Publication number
JPWO2021260972A1
JPWO2021260972A1 JP2022532249A JP2022532249A JPWO2021260972A1 JP WO2021260972 A1 JPWO2021260972 A1 JP WO2021260972A1 JP 2022532249 A JP2022532249 A JP 2022532249A JP 2022532249 A JP2022532249 A JP 2022532249A JP WO2021260972 A1 JPWO2021260972 A1 JP WO2021260972A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022532249A
Other versions
JP7336087B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021260972A1 publication Critical patent/JPWO2021260972A1/ja
Application granted granted Critical
Publication of JP7336087B2 publication Critical patent/JP7336087B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
JP2022532249A 2020-06-22 2020-12-11 高分子フィルムの剥離方法、電子デバイスの製造方法、及び、剥離装置 Active JP7336087B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020106725 2020-06-22
JP2020106725 2020-06-22
PCT/JP2020/046212 WO2021260972A1 (ja) 2020-06-22 2020-12-11 高分子フィルムの剥離方法、電子デバイスの製造方法、及び、剥離装置

Publications (2)

Publication Number Publication Date
JPWO2021260972A1 true JPWO2021260972A1 (ja) 2021-12-30
JP7336087B2 JP7336087B2 (ja) 2023-08-31

Family

ID=79282228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022532249A Active JP7336087B2 (ja) 2020-06-22 2020-12-11 高分子フィルムの剥離方法、電子デバイスの製造方法、及び、剥離装置

Country Status (5)

Country Link
JP (1) JP7336087B2 (ja)
KR (1) KR20220162792A (ja)
CN (1) CN115697870A (ja)
TW (1) TW202200392A (ja)
WO (1) WO2021260972A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004142878A (ja) * 2002-10-24 2004-05-20 Toray Ind Inc 可撓性フィルムの剥離方法および剥離装置並びに回路基板
JP2013056774A (ja) * 2009-08-31 2013-03-28 Asahi Glass Co Ltd 電子デバイスの製造方法
JP2016190698A (ja) * 2015-03-31 2016-11-10 株式会社Ｓｃｒｅｅｎホールディングス 剥離装置
JP2020093873A (ja) * 2018-12-11 2020-06-18 凸版印刷株式会社 フィルム剥離装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4619462B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜素子の転写方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004142878A (ja) * 2002-10-24 2004-05-20 Toray Ind Inc 可撓性フィルムの剥離方法および剥離装置並びに回路基板
JP2013056774A (ja) * 2009-08-31 2013-03-28 Asahi Glass Co Ltd 電子デバイスの製造方法
JP2016190698A (ja) * 2015-03-31 2016-11-10 株式会社Ｓｃｒｅｅｎホールディングス 剥離装置
JP2020093873A (ja) * 2018-12-11 2020-06-18 凸版印刷株式会社 フィルム剥離装置

Also Published As

Publication number Publication date
CN115697870A (zh) 2023-02-03
TW202200392A (zh) 2022-01-01
KR20220162792A (ko) 2022-12-08
JP7336087B2 (ja) 2023-08-31
WO2021260972A1 (ja) 2021-12-30

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