JPWO2022009451A1 - - Google Patents

Info

Publication number
JPWO2022009451A1
JPWO2022009451A1 JP2022534894A JP2022534894A JPWO2022009451A1 JP WO2022009451 A1 JPWO2022009451 A1 JP WO2022009451A1 JP 2022534894 A JP2022534894 A JP 2022534894A JP 2022534894 A JP2022534894 A JP 2022534894A JP WO2022009451 A1 JPWO2022009451 A1 JP WO2022009451A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022534894A
Other versions
JP7400976B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022009451A1 publication Critical patent/JPWO2022009451A1/ja
Application granted granted Critical
Publication of JP7400976B2 publication Critical patent/JP7400976B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00—Machines for separating superposed webs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
JP2022534894A 2020-07-06 2021-01-05 高分子フィルムの剥離方法、電子デバイスの製造方法、及び、剥離装置 Active JP7400976B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2020116410 2020-07-06
JP2020116410 2020-07-06
JP2020119902 2020-07-13
JP2020119902 2020-07-13
JP2020140438 2020-08-21
JP2020140438 2020-08-21
JP2020168831 2020-10-06
JP2020168831 2020-10-06
PCT/JP2021/000071 WO2022009451A1 (ja) 2020-07-06 2021-01-05 高分子フィルムの剥離方法、電子デバイスの製造方法、及び、剥離装置

Publications (2)

Publication Number Publication Date
JPWO2022009451A1 true JPWO2022009451A1 (ja) 2022-01-13
JP7400976B2 JP7400976B2 (ja) 2023-12-19

Family

ID=79552849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022534894A Active JP7400976B2 (ja) 2020-07-06 2021-01-05 高分子フィルムの剥離方法、電子デバイスの製造方法、及び、剥離装置

Country Status (5)

Country Link
JP (1) JP7400976B2 (ja)
KR (1) KR20220163475A (ja)
CN (1) CN115697871A (ja)
TW (1) TW202202347A (ja)
WO (1) WO2022009451A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4331816A1 (en) * 2021-04-28 2024-03-06 Toyobo Co., Ltd. Polymer film releasing method, method for manufacturing electronic device, and releasing device
CN117246621B (zh) * 2023-11-10 2024-01-23 四川英创力电子科技股份有限公司 一种高效剥离电路板镀金层表面保护胶带的装置及方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6256248A (ja) * 1985-09-04 1987-03-11 Somar Corp 薄膜剥離方法及びその実施装置
JP2003335454A (ja) * 2002-05-15 2003-11-25 Sharp Corp フィルム剥離装置およびフィルム剥離方法
JP2004031486A (ja) * 2002-06-24 2004-01-29 Daiichi:Kk フィルム状基板の保護スペーサ及びその製造方法
JP2004142878A (ja) * 2002-10-24 2004-05-20 Toray Ind Inc 可撓性フィルムの剥離方法および剥離装置並びに回路基板
JP2013119447A (ja) * 2011-12-06 2013-06-17 Canon Machinery Inc 剥離装置および剥離方法
WO2015008658A1 (ja) * 2013-07-16 2015-01-22 東洋紡株式会社 フレキシブル電子デバイスの製造方法
JP2015145306A (ja) * 2014-02-04 2015-08-13 旭硝子株式会社 積層体の剥離開始部作成方法及び剥離開始部作成装置並びに電子デバイスの製造方法
JP2016018839A (ja) * 2014-07-07 2016-02-01 凸版印刷株式会社 剥離きっかけ作製装置及び方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4619462B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜素子の転写方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6256248A (ja) * 1985-09-04 1987-03-11 Somar Corp 薄膜剥離方法及びその実施装置
JP2003335454A (ja) * 2002-05-15 2003-11-25 Sharp Corp フィルム剥離装置およびフィルム剥離方法
JP2004031486A (ja) * 2002-06-24 2004-01-29 Daiichi:Kk フィルム状基板の保護スペーサ及びその製造方法
JP2004142878A (ja) * 2002-10-24 2004-05-20 Toray Ind Inc 可撓性フィルムの剥離方法および剥離装置並びに回路基板
JP2013119447A (ja) * 2011-12-06 2013-06-17 Canon Machinery Inc 剥離装置および剥離方法
WO2015008658A1 (ja) * 2013-07-16 2015-01-22 東洋紡株式会社 フレキシブル電子デバイスの製造方法
JP2015145306A (ja) * 2014-02-04 2015-08-13 旭硝子株式会社 積層体の剥離開始部作成方法及び剥離開始部作成装置並びに電子デバイスの製造方法
JP2016018839A (ja) * 2014-07-07 2016-02-01 凸版印刷株式会社 剥離きっかけ作製装置及び方法

Also Published As

Publication number Publication date
JP7400976B2 (ja) 2023-12-19
CN115697871A (zh) 2023-02-03
TW202202347A (zh) 2022-01-16
KR20220163475A (ko) 2022-12-09
WO2022009451A1 (ja) 2022-01-13

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112023012656A2 (ja)
BR112021014123A2 (ja)
JPWO2022009451A1 (ja)
BR112022024743A2 (ja)
BR102021018859A2 (ja)
BR102021015500A2 (ja)
BR112022009896A2 (ja)
BR102021007058A2 (ja)
BR102020022030A2 (ja)
BR112023011738A2 (ja)
JPWO2022230505A1 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011610A2 (ja)
BR112023011539A2 (ja)
BR112023008976A2 (ja)
BR112023009656A2 (ja)
BR112023006729A2 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220527

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230509

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230613

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230810

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231107

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231120

R151 Written notification of patent or utility model registration

Ref document number: 7400976

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151