JPWO2021251204A1 - - Google Patents
Info
- Publication number
- JPWO2021251204A1 JPWO2021251204A1 JP2022530481A JP2022530481A JPWO2021251204A1 JP WO2021251204 A1 JPWO2021251204 A1 JP WO2021251204A1 JP 2022530481 A JP2022530481 A JP 2022530481A JP 2022530481 A JP2022530481 A JP 2022530481A JP WO2021251204 A1 JPWO2021251204 A1 JP WO2021251204A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/04—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors
- C23G1/06—Cleaning or pickling metallic material with solutions or molten salts with acid solutions using inhibitors organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/10—Other heavy metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020099372 | 2020-06-08 | ||
PCT/JP2021/020778 WO2021251204A1 (ja) | 2020-06-08 | 2021-06-01 | 銅または銅合金の表面処理に用いられる化学研磨液および表面処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021251204A1 true JPWO2021251204A1 (ja) | 2021-12-16 |
Family
ID=78845681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022530481A Pending JPWO2021251204A1 (ja) | 2020-06-08 | 2021-06-01 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2021251204A1 (ja) |
CN (1) | CN115836143A (ja) |
TW (1) | TW202208686A (ja) |
WO (1) | WO2021251204A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115613043A (zh) * | 2022-11-11 | 2023-01-17 | 安徽鑫科铜业有限公司 | 一种铜镍硅合金带材表面处理溶液及铜镍硅合金带材表面处理方法 |
CN116497355B (zh) * | 2023-04-10 | 2024-03-22 | 珠海市裕洲环保科技有限公司 | 一种酸性铜蚀刻液及其应用 |
CN117328066B (zh) * | 2023-10-07 | 2024-03-22 | 江苏贺鸿电子有限公司 | 一种线路板用粗化微蚀剂及其制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5286933A (en) * | 1976-01-14 | 1977-07-20 | Tokai Electro Chemical Co | Method of treating surface of copper and copper alloy |
JPS58197277A (ja) * | 1982-05-08 | 1983-11-16 | Mitsubishi Gas Chem Co Inc | 金属の化学的溶解処理液 |
JP3361680B2 (ja) * | 1995-12-27 | 2003-01-07 | 日本パーオキサイド株式会社 | 銅又は銅合金の表面処理液 |
US7186305B2 (en) * | 2002-11-26 | 2007-03-06 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
JP4431860B2 (ja) * | 2003-10-30 | 2010-03-17 | 三菱瓦斯化学株式会社 | 銅および銅合金の表面処理剤 |
JP2005220365A (ja) * | 2004-02-03 | 2005-08-18 | Mitsubishi Gas Chem Co Inc | 銅および銅合金の化学研磨液 |
JP5715088B2 (ja) * | 2012-05-30 | 2015-05-07 | 四国化成工業株式会社 | 銅のエッチング方法 |
KR102254563B1 (ko) * | 2015-03-31 | 2021-05-21 | 동우 화인켐 주식회사 | 구리계 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법 |
JP6337922B2 (ja) * | 2015-08-03 | 2018-06-06 | 三菱瓦斯化学株式会社 | 銅層およびチタン層を含む多層薄膜をエッチングするためのエッチング液およびこれを用いたエッチング方法、並びに該エッチング方法を用いて得られた基板 |
-
2021
- 2021-06-01 TW TW110119759A patent/TW202208686A/zh unknown
- 2021-06-01 WO PCT/JP2021/020778 patent/WO2021251204A1/ja active Application Filing
- 2021-06-01 JP JP2022530481A patent/JPWO2021251204A1/ja active Pending
- 2021-06-01 CN CN202180040575.4A patent/CN115836143A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN115836143A (zh) | 2023-03-21 |
WO2021251204A1 (ja) | 2021-12-16 |
TW202208686A (zh) | 2022-03-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240404 |