JPWO2021250963A1 - - Google Patents

Info

Publication number
JPWO2021250963A1
JPWO2021250963A1 JP2022530030A JP2022530030A JPWO2021250963A1 JP WO2021250963 A1 JPWO2021250963 A1 JP WO2021250963A1 JP 2022530030 A JP2022530030 A JP 2022530030A JP 2022530030 A JP2022530030 A JP 2022530030A JP WO2021250963 A1 JPWO2021250963 A1 JP WO2021250963A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022530030A
Other versions
JP7328453B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021250963A1 publication Critical patent/JPWO2021250963A1/ja
Application granted granted Critical
Publication of JP7328453B2 publication Critical patent/JP7328453B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2022530030A 2020-06-10 2021-03-12 導電性組成物を用いた電磁波シールドパッケージの製造方法 Active JP7328453B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020101239 2020-06-10
JP2020101239 2020-06-10
PCT/JP2021/010215 WO2021250963A1 (ja) 2020-06-10 2021-03-12 導電性組成物を用いた電磁波シールドパッケージの製造方法

Publications (2)

Publication Number Publication Date
JPWO2021250963A1 true JPWO2021250963A1 (ja) 2021-12-16
JP7328453B2 JP7328453B2 (ja) 2023-08-16

Family

ID=78845521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022530030A Active JP7328453B2 (ja) 2020-06-10 2021-03-12 導電性組成物を用いた電磁波シールドパッケージの製造方法

Country Status (3)

Country Link
JP (1) JP7328453B2 (ja)
TW (1) TWI819278B (ja)
WO (1) WO2021250963A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115954279A (zh) * 2022-12-16 2023-04-11 环维电子(上海)有限公司 封装板块以及其制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202399A (ja) * 1993-12-21 1995-08-04 Internatl Business Mach Corp <Ibm> キャリアに部品を接続する接合剤を塗布するための方法およびノズル，並びに接合剤が塗布された回路基板
JP2002171088A (ja) * 2000-11-29 2002-06-14 Nippon Jitsupaa Chiyuubingu Kk シールド材塗着方法
JP2018093014A (ja) * 2016-12-01 2018-06-14 太陽誘電株式会社 無線モジュール、およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448527B (zh) * 2005-11-08 2014-08-11 Toyo Ink Mfg Co 硬化性電磁波遮蔽性黏著性薄膜，其製造方法，及其使用方法，暨電磁波遮蔽物之製造方法及電磁波遮蔽物
JP2018056186A (ja) * 2016-09-26 2018-04-05 日本特殊陶業株式会社 グリーンシートの製造方法及び配線基板の製造方法
SE544014C2 (en) 2018-06-26 2021-11-02 Powercell Sweden Ab Manufacturing arrangement for a fuel cell stack and method for manufactur-ing a fuel cell stack

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07202399A (ja) * 1993-12-21 1995-08-04 Internatl Business Mach Corp <Ibm> キャリアに部品を接続する接合剤を塗布するための方法およびノズル，並びに接合剤が塗布された回路基板
JP2002171088A (ja) * 2000-11-29 2002-06-14 Nippon Jitsupaa Chiyuubingu Kk シールド材塗着方法
JP2018093014A (ja) * 2016-12-01 2018-06-14 太陽誘電株式会社 無線モジュール、およびその製造方法

Also Published As

Publication number Publication date
JP7328453B2 (ja) 2023-08-16
TWI819278B (zh) 2023-10-21
WO2021250963A1 (ja) 2021-12-16
TW202147468A (zh) 2021-12-16

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112023012656A2 (ja)
BR112021014123A2 (ja)
BR112022009896A2 (ja)
BR112023009656A2 (ja)
BR112022024743A2 (ja)
BR112023006729A2 (ja)
BR102021018859A2 (ja)
BR102021015500A2 (ja)
JPWO2021250963A1 (ja)
BR112023008622A2 (ja)
BR102020022030A2 (ja)
BR112023011738A2 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011610A2 (ja)
BR112023011539A2 (ja)
BR112023008976A2 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)
BR102021016375A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221206

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230801

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230803

R150 Certificate of patent or registration of utility model

Ref document number: 7328453

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150