JPWO2021245948A1 - - Google Patents

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Publication number
JPWO2021245948A1
JPWO2021245948A1 JP2022528403A JP2022528403A JPWO2021245948A1 JP WO2021245948 A1 JPWO2021245948 A1 JP WO2021245948A1 JP 2022528403 A JP2022528403 A JP 2022528403A JP 2022528403 A JP2022528403 A JP 2022528403A JP WO2021245948 A1 JPWO2021245948 A1 JP WO2021245948A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022528403A
Other versions
JPWO2021245948A5 (ja
JP7290201B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021245948A1 publication Critical patent/JPWO2021245948A1/ja
Publication of JPWO2021245948A5 publication Critical patent/JPWO2021245948A5/ja
Priority to JP2023088644A priority Critical patent/JP2023105033A/ja
Application granted granted Critical
Publication of JP7290201B2 publication Critical patent/JP7290201B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H10N60/81—Containers; Mountings
    • H10N60/815—Containers; Mountings for Josephson-effect devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
    • G06N10/40—Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49888—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing superconducting material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/08—Strip line resonators
    • H01P7/082—Microstripline resonators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/20—Permanent superconducting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/80—Constructional details
    • H10N60/85—Superconducting active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Physics (AREA)
  • Computational Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Software Systems (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
JP2022528403A 2020-06-05 2020-06-05 量子デバイス Active JP7290201B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023088644A JP2023105033A (ja) 2020-06-05 2023-05-30 量子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/022435 WO2021245948A1 (ja) 2020-06-05 2020-06-05 量子デバイス

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023088644A Division JP2023105033A (ja) 2020-06-05 2023-05-30 量子デバイス

Publications (3)

Publication Number Publication Date
JPWO2021245948A1 true JPWO2021245948A1 (ja) 2021-12-09
JPWO2021245948A5 JPWO2021245948A5 (ja) 2023-02-14
JP7290201B2 JP7290201B2 (ja) 2023-06-13

Family

ID=78830746

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022528403A Active JP7290201B2 (ja) 2020-06-05 2020-06-05 量子デバイス
JP2023088644A Pending JP2023105033A (ja) 2020-06-05 2023-05-30 量子デバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023088644A Pending JP2023105033A (ja) 2020-06-05 2023-05-30 量子デバイス

Country Status (3)

Country Link
US (1) US20230345844A1 (ja)
JP (2) JP7290201B2 (ja)
WO (1) WO2021245948A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE2230067A1 (en) * 2022-03-10 2023-06-07 Scalinq Ab A packaging arrangement for a quantum processor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01258457A (ja) * 1988-04-08 1989-10-16 Nec Corp 半導体集積回路の実装構造およびその製造方法
JPH04338683A (ja) * 1991-05-16 1992-11-25 Fujitsu Ltd 超伝導集積回路素子とその実装方法
JP2000114608A (ja) * 1998-10-06 2000-04-21 Idotai Tsushin Sentan Gijutsu Kenkyusho:Kk 回路基板の実装方法および回路基板の実装構造
JP2016040799A (ja) * 2014-08-12 2016-03-24 国立研究開発法人産業技術総合研究所 実装基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4338683B2 (ja) 2005-08-18 2009-10-07 三菱電機株式会社 撮像システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01258457A (ja) * 1988-04-08 1989-10-16 Nec Corp 半導体集積回路の実装構造およびその製造方法
JPH04338683A (ja) * 1991-05-16 1992-11-25 Fujitsu Ltd 超伝導集積回路素子とその実装方法
JP2000114608A (ja) * 1998-10-06 2000-04-21 Idotai Tsushin Sentan Gijutsu Kenkyusho:Kk 回路基板の実装方法および回路基板の実装構造
JP2016040799A (ja) * 2014-08-12 2016-03-24 国立研究開発法人産業技術総合研究所 実装基板

Also Published As

Publication number Publication date
JP7290201B2 (ja) 2023-06-13
WO2021245948A1 (ja) 2021-12-09
US20230345844A1 (en) 2023-10-26
JP2023105033A (ja) 2023-07-28

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