JPWO2021225162A1 - - Google Patents

Info

Publication number
JPWO2021225162A1
JPWO2021225162A1 JP2022519633A JP2022519633A JPWO2021225162A1 JP WO2021225162 A1 JPWO2021225162 A1 JP WO2021225162A1 JP 2022519633 A JP2022519633 A JP 2022519633A JP 2022519633 A JP2022519633 A JP 2022519633A JP WO2021225162 A1 JPWO2021225162 A1 JP WO2021225162A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022519633A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021225162A1 publication Critical patent/JPWO2021225162A1/ja
Priority to JP2024031255A priority Critical patent/JP2024075592A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2022519633A 2020-05-07 2021-05-07 Pending JPWO2021225162A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024031255A JP2024075592A (ja) 2020-05-07 2024-03-01 転写フィルム、積層体の製造方法、タッチセンサー、プリント配線基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020081803 2020-05-07
PCT/JP2021/017507 WO2021225162A1 (fr) 2020-05-07 2021-05-07 Film de transfert, procédé de fabrication de stratifié, capteur tactile et procédé de fabrication d'une carte de circuit imprimé

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024031255A Division JP2024075592A (ja) 2020-05-07 2024-03-01 転写フィルム、積層体の製造方法、タッチセンサー、プリント配線基板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2021225162A1 true JPWO2021225162A1 (fr) 2021-11-11

Family

ID=78467981

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022519633A Pending JPWO2021225162A1 (fr) 2020-05-07 2021-05-07
JP2024031255A Pending JP2024075592A (ja) 2020-05-07 2024-03-01 転写フィルム、積層体の製造方法、タッチセンサー、プリント配線基板の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024031255A Pending JP2024075592A (ja) 2020-05-07 2024-03-01 転写フィルム、積層体の製造方法、タッチセンサー、プリント配線基板の製造方法

Country Status (3)

Country Link
JP (2) JPWO2021225162A1 (fr)
CN (1) CN115516376A (fr)
WO (1) WO2021225162A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006053390A (ja) * 2004-08-12 2006-02-23 Fuji Photo Film Co Ltd 感光性フィルムの製造ライン
JP2013238837A (ja) * 2011-11-21 2013-11-28 Toyo Ink Sc Holdings Co Ltd 感光性ドライフィルム、ならびにそれを用いた保護膜およびタッチパネル用絶縁膜
JP2015175961A (ja) * 2014-03-14 2015-10-05 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法
WO2016072202A1 (fr) * 2014-11-07 2016-05-12 Dic株式会社 Composition durcissable, matériau de réserve et film de réserve
JP2019031597A (ja) * 2017-08-07 2019-02-28 東レ株式会社 樹脂組成物、硬化膜、半導体装置および半導体装置の製造方法
JP2019121740A (ja) * 2018-01-10 2019-07-22 住友電気工業株式会社 プリント配線板製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019151534A1 (fr) * 2018-02-05 2019-08-08 富士フイルム株式会社 Matériau de transfert photosensible, procédé de fabrication de câblage de circuit, et procédé de fabrication d'écran tactile

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006053390A (ja) * 2004-08-12 2006-02-23 Fuji Photo Film Co Ltd 感光性フィルムの製造ライン
JP2013238837A (ja) * 2011-11-21 2013-11-28 Toyo Ink Sc Holdings Co Ltd 感光性ドライフィルム、ならびにそれを用いた保護膜およびタッチパネル用絶縁膜
JP2015175961A (ja) * 2014-03-14 2015-10-05 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法
WO2016072202A1 (fr) * 2014-11-07 2016-05-12 Dic株式会社 Composition durcissable, matériau de réserve et film de réserve
JP2019031597A (ja) * 2017-08-07 2019-02-28 東レ株式会社 樹脂組成物、硬化膜、半導体装置および半導体装置の製造方法
JP2019121740A (ja) * 2018-01-10 2019-07-22 住友電気工業株式会社 プリント配線板製造方法

Also Published As

Publication number Publication date
JP2024075592A (ja) 2024-06-04
WO2021225162A1 (fr) 2021-11-11
CN115516376A (zh) 2022-12-23

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