JPWO2021220672A1 - - Google Patents

Info

Publication number
JPWO2021220672A1
JPWO2021220672A1 JP2022517555A JP2022517555A JPWO2021220672A1 JP WO2021220672 A1 JPWO2021220672 A1 JP WO2021220672A1 JP 2022517555 A JP2022517555 A JP 2022517555A JP 2022517555 A JP2022517555 A JP 2022517555A JP WO2021220672 A1 JPWO2021220672 A1 JP WO2021220672A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022517555A
Other versions
JP7400956B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021220672A1 publication Critical patent/JPWO2021220672A1/ja
Application granted granted Critical
Publication of JP7400956B2 publication Critical patent/JP7400956B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2022517555A 2020-04-27 2021-03-24 セリウム系研磨材スラリー原液及びその製造方法、並びに研磨液 Active JP7400956B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020078220 2020-04-27
JP2020078220 2020-04-27
PCT/JP2021/012102 WO2021220672A1 (ja) 2020-04-27 2021-03-24 セリウム系研磨材スラリー原液及びその製造方法、並びに研磨液

Publications (2)

Publication Number Publication Date
JPWO2021220672A1 true JPWO2021220672A1 (ja) 2021-11-04
JP7400956B2 JP7400956B2 (ja) 2023-12-19

Family

ID=78373488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022517555A Active JP7400956B2 (ja) 2020-04-27 2021-03-24 セリウム系研磨材スラリー原液及びその製造方法、並びに研磨液

Country Status (4)

Country Link
JP (1) JP7400956B2 (ja)
KR (1) KR20220148919A (ja)
CN (1) CN115461427B (ja)
WO (1) WO2021220672A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008001907A (ja) * 2007-07-26 2008-01-10 Mitsui Mining & Smelting Co Ltd セリウム系研摩材スラリー及びセリウム系研摩材スラリーの製造方法
JP2010199595A (ja) * 2004-09-28 2010-09-09 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
JP2012038361A (ja) * 2010-08-03 2012-02-23 Showa Denko Kk 酸化セリウム系研磨剤及びガラス製ハードディスク基板の製造方法
WO2017051629A1 (ja) * 2015-09-25 2017-03-30 昭和電工株式会社 セリウム系研磨材及びその製造方法
WO2019049932A1 (ja) * 2017-09-11 2019-03-14 昭和電工株式会社 セリウム系研磨材用原料の製造方法、及びセリウム系研磨材の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005353681A (ja) * 2004-06-08 2005-12-22 Hitachi Chem Co Ltd 半導体絶縁膜用ｃｍｐ研磨剤、その製造方法及び基板の研磨方法
EP1793359A4 (en) * 2004-08-31 2010-05-19 Panasonic Corp TERMINAL FOR PROCESSING PURCHASE OF CONTENT, ITS METHOD, AND CORRESPONDING PROGRAM
JP2011142284A (ja) * 2009-12-10 2011-07-21 Hitachi Chem Co Ltd Ｃｍｐ研磨液、基板の研磨方法及び電子部品
JPWO2015182756A1 (ja) 2014-05-30 2017-05-25 日立化成株式会社 Ｃｍｐ用研磨液、ｃｍｐ用研磨液セット、及び研磨方法
WO2017051029A1 (en) * 2015-09-25 2017-03-30 Addifab Aps Additive manufacturing device and system, modular build platform and build platform unit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010199595A (ja) * 2004-09-28 2010-09-09 Hitachi Chem Co Ltd Ｃｍｐ研磨剤及び基板の研磨方法
JP2008001907A (ja) * 2007-07-26 2008-01-10 Mitsui Mining & Smelting Co Ltd セリウム系研摩材スラリー及びセリウム系研摩材スラリーの製造方法
JP2012038361A (ja) * 2010-08-03 2012-02-23 Showa Denko Kk 酸化セリウム系研磨剤及びガラス製ハードディスク基板の製造方法
WO2017051629A1 (ja) * 2015-09-25 2017-03-30 昭和電工株式会社 セリウム系研磨材及びその製造方法
WO2019049932A1 (ja) * 2017-09-11 2019-03-14 昭和電工株式会社 セリウム系研磨材用原料の製造方法、及びセリウム系研磨材の製造方法

Also Published As

Publication number Publication date
JP7400956B2 (ja) 2023-12-19
TW202142669A (zh) 2021-11-16
CN115461427A (zh) 2022-12-09
WO2021220672A1 (ja) 2021-11-04
KR20220148919A (ko) 2022-11-07
CN115461427B (zh) 2024-01-09

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