JPWO2021216822A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2021216822A5 JPWO2021216822A5 JP2022564488A JP2022564488A JPWO2021216822A5 JP WO2021216822 A5 JPWO2021216822 A5 JP WO2021216822A5 JP 2022564488 A JP2022564488 A JP 2022564488A JP 2022564488 A JP2022564488 A JP 2022564488A JP WO2021216822 A5 JPWO2021216822 A5 JP WO2021216822A5
- Authority
- JP
- Japan
- Prior art keywords
- images
- features
- pairwise
- classifier
- image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063013737P | 2020-04-22 | 2020-04-22 | |
| US63/013,737 | 2020-04-22 | ||
| PCT/US2021/028563 WO2021216822A1 (en) | 2020-04-22 | 2021-04-22 | Abnormal wafer image classification |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023523426A JP2023523426A (ja) | 2023-06-05 |
| JPWO2021216822A5 true JPWO2021216822A5 (https=) | 2024-05-02 |
| JP2023523426A5 JP2023523426A5 (https=) | 2024-05-02 |
Family
ID=78222360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022564488A Ceased JP2023523426A (ja) | 2020-04-22 | 2021-04-22 | 異常ウェハ画像分類 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11972552B2 (https=) |
| JP (1) | JP2023523426A (https=) |
| KR (1) | KR20230006822A (https=) |
| CN (1) | CN115485740A (https=) |
| TW (1) | TW202147250A (https=) |
| WO (1) | WO2021216822A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12450520B2 (en) * | 2021-03-01 | 2025-10-21 | Hitachi High-Tech Corporation | Experiment point recommendation device, experiment point recommendation method, and semiconductor device manufacturing device |
| US12080042B2 (en) * | 2021-07-16 | 2024-09-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for retrieving images from database |
| TWI801038B (zh) * | 2021-12-16 | 2023-05-01 | 新加坡商鴻運科股份有限公司 | 瑕疵檢測方法、系統、電子設備及介質 |
| CN118633090A (zh) * | 2022-01-26 | 2024-09-10 | 康斯坦茨大学 | 训练神经网络以执行机器学习任务 |
| US12449379B2 (en) * | 2023-05-25 | 2025-10-21 | Applied Materials, Inc. | Machine learning model training |
| US12462369B2 (en) * | 2023-08-16 | 2025-11-04 | Applied Materials, Inc. | Method for image-based sensor trace analysis |
| TWI886645B (zh) * | 2023-11-21 | 2025-06-11 | 環球晶圓股份有限公司 | 產生標記結果檔的方法及電子裝置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6456899B1 (en) | 1999-12-07 | 2002-09-24 | Ut-Battelle, Llc | Context-based automated defect classification system using multiple morphological masks |
| SG189840A1 (en) * | 2010-10-19 | 2013-06-28 | 3M Innovative Properties Co | Computer-aided assignment of ratings to digital samples of a manufactured web product |
| JP5608575B2 (ja) * | 2011-01-19 | 2014-10-15 | 株式会社日立ハイテクノロジーズ | 画像分類方法および画像分類装置 |
| US9715723B2 (en) * | 2012-04-19 | 2017-07-25 | Applied Materials Israel Ltd | Optimization of unknown defect rejection for automatic defect classification |
| US10650508B2 (en) * | 2014-12-03 | 2020-05-12 | Kla-Tencor Corporation | Automatic defect classification without sampling and feature selection |
| JP7144244B2 (ja) * | 2018-08-31 | 2022-09-29 | 株式会社日立ハイテク | パターン検査システム |
-
2021
- 2021-04-22 TW TW110114543A patent/TW202147250A/zh unknown
- 2021-04-22 WO PCT/US2021/028563 patent/WO2021216822A1/en not_active Ceased
- 2021-04-22 JP JP2022564488A patent/JP2023523426A/ja not_active Ceased
- 2021-04-22 CN CN202180029759.0A patent/CN115485740A/zh active Pending
- 2021-04-22 US US17/237,516 patent/US11972552B2/en active Active
- 2021-04-22 KR KR1020227038349A patent/KR20230006822A/ko active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109241903B (zh) | 样本数据清洗方法、装置、计算机设备及存储介质 | |
| US11972552B2 (en) | Abnormal wafer image classification | |
| CN107408209A (zh) | 无需取样及特征选择的自动缺陷分类 | |
| US12254621B2 (en) | Method, electronic device and operating method of electronic device and manufacture of semiconductor device | |
| CN112055863A (zh) | 用于确定神经网络的网络配置的方法和设备 | |
| WO2022015594A1 (en) | Machine learning feature recommendation | |
| US20190041202A1 (en) | Inspection-guided critical site selection for critical dimension measurement | |
| JP2021135977A (ja) | 情報処理装置及び方法 | |
| JP2020191012A5 (https=) | ||
| JP7679558B2 (ja) | 複数の基板ダイからのスペクトルデータに基づく半導体基板歩留まり予測 | |
| JPWO2021216822A5 (https=) | ||
| CN114863159A (zh) | 信息处理方法、信息处理装置及计算机程序 | |
| JP7549736B2 (ja) | 外観検査方法および外観検査システム | |
| CN116883417A (zh) | 基于机器视觉的工件质检方法及装置 | |
| US12057336B2 (en) | Estimating heights of defects in a wafer by scaling a 3D model using an artificial neural network | |
| JP2023006279A (ja) | 機械学習モデルを用いて検査データの良否を判定する方法、情報処理装置、及び、コンピュータープログラム | |
| JP2002099916A (ja) | パターン分類方法及びその装置、コンピュータにより読み取り可能な記憶媒体 | |
| KR20230110355A (ko) | 계층별 분석을 통한 신경망 프루닝 방법 및 시스템 | |
| CN113658183B (zh) | 工件质检方法、装置及计算机设备 | |
| WO2025022781A1 (ja) | データ分析装置、データ分析方法およびプログラム | |
| JP6618661B2 (ja) | 識別分類装置および識別分類方法 | |
| JP7290133B2 (ja) | 情報処理装置、重要ノード特定方法、及び重要ノード特定プログラム | |
| CN113393023A (zh) | 模具质量评估方法、装置、设备及存储介质 | |
| US20210143038A1 (en) | Semiconductor process analysis device, semiconductor process analysis method, and storage medium | |
| CN112528500A (zh) | 一种场景图构造模型的评估方法及评估设备 |