JPWO2021193304A1 - - Google Patents

Info

Publication number
JPWO2021193304A1
JPWO2021193304A1 JP2022510012A JP2022510012A JPWO2021193304A1 JP WO2021193304 A1 JPWO2021193304 A1 JP WO2021193304A1 JP 2022510012 A JP2022510012 A JP 2022510012A JP 2022510012 A JP2022510012 A JP 2022510012A JP WO2021193304 A1 JPWO2021193304 A1 JP WO2021193304A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022510012A
Other versions
JP7556022B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021193304A1 publication Critical patent/JPWO2021193304A1/ja
Application granted granted Critical
Publication of JP7556022B2 publication Critical patent/JP7556022B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Surgical Instruments (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
JP2022510012A 2020-03-24 2021-03-17 プローブユニット Active JP7556022B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020053388 2020-03-24
JP2020053388 2020-03-24
PCT/JP2021/010922 WO2021193304A1 (ja) 2020-03-24 2021-03-17 プローブユニット

Publications (2)

Publication Number Publication Date
JPWO2021193304A1 true JPWO2021193304A1 (ja) 2021-09-30
JP7556022B2 JP7556022B2 (ja) 2024-09-25

Family

ID=77890268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022510012A Active JP7556022B2 (ja) 2020-03-24 2021-03-17 プローブユニット

Country Status (6)

Country Link
US (1) US20230138105A1 (ja)
JP (1) JP7556022B2 (ja)
KR (1) KR20220136403A (ja)
CN (1) CN115335708A (ja)
TW (1) TWI778549B (ja)
WO (1) WO2021193304A1 (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999010748A1 (fr) * 1997-08-21 1999-03-04 Ibiden Co., Ltd. Tete de verification
US6917525B2 (en) 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
JP2010175371A (ja) 2009-01-29 2010-08-12 Yokowo Co Ltd 検査ソケット
JP2012098219A (ja) 2010-11-04 2012-05-24 Yamaichi Electronics Co Ltd 半導体装置用ソケット
JP6520179B2 (ja) * 2015-02-13 2019-05-29 日本電産リード株式会社 中継コネクタ、及び基板検査装置
SG11201911857UA (en) * 2017-06-14 2020-01-30 Nhk Spring Co Ltd Conductive contactor unit
SG11202000654VA (en) * 2017-07-28 2020-02-27 Nhk Spring Co Ltd Contact probe and probe unit
TWI650561B (zh) * 2018-04-13 2019-02-11 中國探針股份有限公司 應用於探針基座之絕緣件及其探針基座
SG11202105529RA (en) * 2018-11-27 2021-06-29 Nhk Spring Co Ltd Probe unit
SG11202105474UA (en) * 2018-11-27 2021-06-29 Nhk Spring Co Ltd Probe unit

Also Published As

Publication number Publication date
KR20220136403A (ko) 2022-10-07
WO2021193304A1 (ja) 2021-09-30
CN115335708A (zh) 2022-11-11
US20230138105A1 (en) 2023-05-04
TW202136789A (zh) 2021-10-01
TWI778549B (zh) 2022-09-21
JP7556022B2 (ja) 2024-09-25

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