JPWO2021182413A1 - - Google Patents

Info

Publication number
JPWO2021182413A1
JPWO2021182413A1 JP2022507188A JP2022507188A JPWO2021182413A1 JP WO2021182413 A1 JPWO2021182413 A1 JP WO2021182413A1 JP 2022507188 A JP2022507188 A JP 2022507188A JP 2022507188 A JP2022507188 A JP 2022507188A JP WO2021182413 A1 JPWO2021182413 A1 JP WO2021182413A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022507188A
Other versions
JPWO2021182413A5 (ja
JP7180032B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021182413A1 publication Critical patent/JPWO2021182413A1/ja
Publication of JPWO2021182413A5 publication Critical patent/JPWO2021182413A5/ja
Application granted granted Critical
Publication of JP7180032B2 publication Critical patent/JP7180032B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
JP2022507188A 2020-03-10 2021-03-08 発光装置 Active JP7180032B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020041153 2020-03-10
JP2020041153 2020-03-10
PCT/JP2021/009056 WO2021182413A1 (ja) 2020-03-10 2021-03-08 発光装置

Publications (3)

Publication Number Publication Date
JPWO2021182413A1 true JPWO2021182413A1 (ja) 2021-09-16
JPWO2021182413A5 JPWO2021182413A5 (ja) 2022-08-05
JP7180032B2 JP7180032B2 (ja) 2022-11-29

Family

ID=77672042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022507188A Active JP7180032B2 (ja) 2020-03-10 2021-03-08 発光装置

Country Status (4)

Country Link
US (1) US20230005891A1 (ja)
JP (1) JP7180032B2 (ja)
CN (1) CN115280520B (ja)
WO (1) WO2021182413A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218733A (ja) * 2007-03-05 2008-09-18 Mikku:Kk カラー表示用ｌｅｄパネル
JP2008294224A (ja) * 2007-05-24 2008-12-04 Stanley Electric Co Ltd 半導体発光装置
JP2014045089A (ja) * 2012-08-27 2014-03-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置
JP2016174120A (ja) * 2015-03-18 2016-09-29 日亜化学工業株式会社 発光装置
JP2017143109A (ja) * 2016-02-08 2017-08-17 シチズン電子株式会社 発光装置およびその製造方法
JP2019003978A (ja) * 2017-06-12 2019-01-10 スタンレー電気株式会社 半導体発光装置
US20190371974A1 (en) * 2018-05-30 2019-12-05 Cree, Inc. Led systems, apparatuses, and methods

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151268A (ja) * 2010-01-22 2011-08-04 Sharp Corp 発光装置
JP5049382B2 (ja) * 2010-12-21 2012-10-17 パナソニック株式会社 発光装置及びそれを用いた照明装置
JP2012230967A (ja) * 2011-04-25 2012-11-22 Mitsubishi Chemicals Corp 配線基板、発光ダイオードモジュール
JP6076796B2 (ja) * 2013-03-28 2017-02-08 シチズン電子株式会社 半導体発光装置
JP6773166B2 (ja) * 2019-04-10 2020-10-21 日亜化学工業株式会社 発光装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218733A (ja) * 2007-03-05 2008-09-18 Mikku:Kk カラー表示用ｌｅｄパネル
JP2008294224A (ja) * 2007-05-24 2008-12-04 Stanley Electric Co Ltd 半導体発光装置
JP2014045089A (ja) * 2012-08-27 2014-03-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置
JP2016174120A (ja) * 2015-03-18 2016-09-29 日亜化学工業株式会社 発光装置
JP2017143109A (ja) * 2016-02-08 2017-08-17 シチズン電子株式会社 発光装置およびその製造方法
JP2019003978A (ja) * 2017-06-12 2019-01-10 スタンレー電気株式会社 半導体発光装置
US20190371974A1 (en) * 2018-05-30 2019-12-05 Cree, Inc. Led systems, apparatuses, and methods

Also Published As

Publication number Publication date
WO2021182413A1 (ja) 2021-09-16
CN115280520A (zh) 2022-11-01
CN115280520B (zh) 2023-06-30
JP7180032B2 (ja) 2022-11-29
US20230005891A1 (en) 2023-01-05

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