JPWO2021182193A1 - - Google Patents

Info

Publication number
JPWO2021182193A1
JPWO2021182193A1 JP2022505946A JP2022505946A JPWO2021182193A1 JP WO2021182193 A1 JPWO2021182193 A1 JP WO2021182193A1 JP 2022505946 A JP2022505946 A JP 2022505946A JP 2022505946 A JP2022505946 A JP 2022505946A JP WO2021182193 A1 JPWO2021182193 A1 JP WO2021182193A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022505946A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021182193A1 publication Critical patent/JPWO2021182193A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2022505946A 2020-03-11 2021-03-02 Pending JPWO2021182193A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020042145 2020-03-11
PCT/JP2021/007998 WO2021182193A1 (ja) 2020-03-11 2021-03-02 プローブカード

Publications (1)

Publication Number Publication Date
JPWO2021182193A1 true JPWO2021182193A1 (ja) 2021-09-16

Family

ID=77670667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022505946A Pending JPWO2021182193A1 (ja) 2020-03-11 2021-03-02

Country Status (6)

Country Link
US (1) US20230107255A1 (ja)
JP (1) JPWO2021182193A1 (ja)
KR (1) KR20220132632A (ja)
CN (1) CN115244408A (ja)
TW (1) TWI830006B (ja)
WO (1) WO2021182193A1 (ja)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53133149A (en) 1977-04-25 1978-11-20 Matsushita Electric Works Ltd Facial treatment tool
JP2000227443A (ja) * 1999-02-05 2000-08-15 Mitsubishi Electric Corp プローブカード
JP4420290B2 (ja) * 2005-08-11 2010-02-24 日鐵住金建材株式会社 横桟取付金具及び防護柵
JP4979214B2 (ja) * 2005-08-31 2012-07-18 日本発條株式会社 プローブカード
EP2128630A4 (en) * 2007-03-14 2014-05-14 Nhk Spring Co Ltd PROBE CARD
CN101526553A (zh) * 2008-03-07 2009-09-09 旺矽科技股份有限公司 探针卡
KR20100019885A (ko) * 2008-08-11 2010-02-19 삼성전기주식회사 프로브 카드 제조 방법
US8534302B2 (en) * 2008-12-09 2013-09-17 Microchip Technology Incorporated Prober cleaning block assembly
KR101134662B1 (ko) * 2010-01-27 2012-04-09 (주)엠투엔 평탄 조절 수단을 구비하는 프로브 카드
TWI417549B (zh) * 2010-07-12 2013-12-01 Mpi Corp The method of making the probe head of the vertical probe card and its composite board
JP2013200266A (ja) 2012-03-26 2013-10-03 Micronics Japan Co Ltd 電気的接続装置とそれを備えるプローブカード並びに半導体検査装置
TWI479158B (zh) * 2013-01-28 2015-04-01 Mpi Corp 晶圓測試探針卡
JP6245876B2 (ja) * 2013-07-26 2017-12-13 株式会社日本マイクロニクス プローブカード
US10247756B2 (en) * 2014-05-20 2019-04-02 Hermes-Epitek Corp. Probe card structure
JP6275567B2 (ja) * 2014-06-26 2018-02-07 日本電子材料株式会社 プローブカード
TW201606314A (zh) * 2014-08-14 2016-02-16 漢民科技股份有限公司 台北巿大安區敦化南路2 段38 號14 樓 探針卡結構及其組裝與更換方法

Also Published As

Publication number Publication date
WO2021182193A1 (ja) 2021-09-16
TW202143353A (zh) 2021-11-16
CN115244408A (zh) 2022-10-25
TWI830006B (zh) 2024-01-21
US20230107255A1 (en) 2023-04-06
KR20220132632A (ko) 2022-09-30

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230801