JPWO2021181766A1 - - Google Patents

Info

Publication number
JPWO2021181766A1
JPWO2021181766A1 JP2022505761A JP2022505761A JPWO2021181766A1 JP WO2021181766 A1 JPWO2021181766 A1 JP WO2021181766A1 JP 2022505761 A JP2022505761 A JP 2022505761A JP 2022505761 A JP2022505761 A JP 2022505761A JP WO2021181766 A1 JPWO2021181766 A1 JP WO2021181766A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022505761A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021181766A1 publication Critical patent/JPWO2021181766A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2022505761A 2020-03-11 2020-12-02 Pending JPWO2021181766A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020042084 2020-03-11
PCT/JP2020/044790 WO2021181766A1 (ja) 2020-03-11 2020-12-02 複合材の分断方法

Publications (1)

Publication Number Publication Date
JPWO2021181766A1 true JPWO2021181766A1 (ja) 2021-09-16

Family

ID=77672005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022505761A Pending JPWO2021181766A1 (ja) 2020-03-11 2020-12-02

Country Status (5)

Country Link
JP (1) JPWO2021181766A1 (ja)
KR (1) KR20220148197A (ja)
CN (1) CN115485097A (ja)
TW (1) TW202134702A (ja)
WO (1) WO2021181766A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114609711B (zh) * 2022-03-09 2023-07-18 业成科技（成都）有限公司 光学元件的制造方法、夹持装置、显示模组及电子设备
WO2023211796A1 (en) * 2022-04-28 2023-11-02 Meta Platforms Technologies, Llc Glass-film lamination and cutting method to mitigate orange peel

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013175767A1 (ja) 2012-05-23 2013-11-28 コニカミノルタ株式会社 偏光板、偏光板の製造方法および画像表示装置
JP2014043363A (ja) * 2012-08-24 2014-03-13 Hamamatsu Photonics Kk 強化ガラス部材加工方法
JP6355783B2 (ja) * 2017-03-14 2018-07-11 日東電工株式会社 可撓性フィルムの製造方法
JP6888809B2 (ja) * 2017-03-30 2021-06-16 三星ダイヤモンド工業株式会社 金属膜付き脆性材料基板の分断方法並びに分断装置
JP2019025539A (ja) * 2017-08-04 2019-02-21 株式会社ディスコ レーザー加工装置
JP7182362B2 (ja) 2018-01-12 2022-12-02 日東電工株式会社 複合材の分断方法

Also Published As

Publication number Publication date
KR20220148197A (ko) 2022-11-04
WO2021181766A1 (ja) 2021-09-16
TW202134702A (zh) 2021-09-16
CN115485097A (zh) 2022-12-16

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