JPWO2021167060A1 - - Google Patents
Info
- Publication number
- JPWO2021167060A1 JPWO2021167060A1 JP2022501072A JP2022501072A JPWO2021167060A1 JP WO2021167060 A1 JPWO2021167060 A1 JP WO2021167060A1 JP 2022501072 A JP2022501072 A JP 2022501072A JP 2022501072 A JP2022501072 A JP 2022501072A JP WO2021167060 A1 JPWO2021167060 A1 JP WO2021167060A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/151—Geometry or disposition of pixel elements, address lines or gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/157—CCD or CID infrared image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020028024 | 2020-02-21 | ||
| JP2020028024 | 2020-02-21 | ||
| PCT/JP2021/006326 WO2021167060A1 (ja) | 2020-02-21 | 2021-02-19 | 固体撮像装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021167060A1 true JPWO2021167060A1 (https=) | 2021-08-26 |
| JP7691970B2 JP7691970B2 (ja) | 2025-06-12 |
Family
ID=77390825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022501072A Active JP7691970B2 (ja) | 2020-02-21 | 2021-02-19 | 固体撮像装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US12419119B2 (https=) |
| JP (1) | JP7691970B2 (https=) |
| WO (1) | WO2021167060A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09186307A (ja) * | 1995-12-27 | 1997-07-15 | Nec Ic Microcomput Syst Ltd | 光半導体集積回路装置 |
| JP2009124087A (ja) * | 2007-11-19 | 2009-06-04 | Oki Semiconductor Co Ltd | 半導体装置の製造方法 |
| WO2012117931A1 (ja) * | 2011-03-02 | 2012-09-07 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法及び電子機器 |
| WO2014021115A1 (ja) * | 2012-07-30 | 2014-02-06 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法及び電子機器 |
| JP2017224741A (ja) * | 2016-06-16 | 2017-12-21 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3759435B2 (ja) | 2001-07-11 | 2006-03-22 | ソニー株式会社 | Ｘ−ｙアドレス型固体撮像素子 |
| US8274101B2 (en) * | 2009-10-20 | 2012-09-25 | Omnivision Technologies, Inc. | CMOS image sensor with heat management structures |
| KR101934864B1 (ko) * | 2012-05-30 | 2019-03-18 | 삼성전자주식회사 | 관통 실리콘 비아 구조물 및 그 제조 방법, 이를 포함하는 이미지 센서 및 그 제조 방법 |
| JP6725231B2 (ja) * | 2015-10-06 | 2020-07-15 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、および電子装置 |
| KR102549541B1 (ko) * | 2017-01-11 | 2023-06-29 | 삼성전자주식회사 | 이미지 센서 |
| KR102411698B1 (ko) * | 2017-11-13 | 2022-06-22 | 삼성전자주식회사 | 이미지 센서 및 이의 형성 방법 |
-
2021
- 2021-02-19 JP JP2022501072A patent/JP7691970B2/ja active Active
- 2021-02-19 US US17/796,858 patent/US12419119B2/en active Active
- 2021-02-19 WO PCT/JP2021/006326 patent/WO2021167060A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09186307A (ja) * | 1995-12-27 | 1997-07-15 | Nec Ic Microcomput Syst Ltd | 光半導体集積回路装置 |
| JP2009124087A (ja) * | 2007-11-19 | 2009-06-04 | Oki Semiconductor Co Ltd | 半導体装置の製造方法 |
| WO2012117931A1 (ja) * | 2011-03-02 | 2012-09-07 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法及び電子機器 |
| WO2014021115A1 (ja) * | 2012-07-30 | 2014-02-06 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法及び電子機器 |
| JP2017224741A (ja) * | 2016-06-16 | 2017-12-21 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7691970B2 (ja) | 2025-06-12 |
| US12419119B2 (en) | 2025-09-16 |
| WO2021167060A1 (ja) | 2021-08-26 |
| US20230059212A1 (en) | 2023-02-23 |
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