JPWO2021167053A1 - - Google Patents

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Publication number
JPWO2021167053A1
JPWO2021167053A1 JP2022502008A JP2022502008A JPWO2021167053A1 JP WO2021167053 A1 JPWO2021167053 A1 JP WO2021167053A1 JP 2022502008 A JP2022502008 A JP 2022502008A JP 2022502008 A JP2022502008 A JP 2022502008A JP WO2021167053 A1 JPWO2021167053 A1 JP WO2021167053A1
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JP
Japan
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JP2022502008A
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JP7648334B2 (ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/14—Unsaturated oxiranes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
JP2022502008A 2020-02-21 2021-02-19 無溶剤型の光硬化性液状組成物、その硬化物、それを含む光学充填剤、およびその硬化物からなる層を含む表示装置 Active JP7648334B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020028128 2020-02-21
JP2020028128 2020-02-21
PCT/JP2021/006287 WO2021167053A1 (ja) 2020-02-21 2021-02-19 無溶剤型の光硬化性液状組成物、その硬化物、それを含む光学充填剤、およびその硬化物からなる層を含む表示装置

Publications (2)

Publication Number Publication Date
JPWO2021167053A1 true JPWO2021167053A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2021-08-26
JP7648334B2 JP7648334B2 (ja) 2025-03-18

Family

ID=77392007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022502008A Active JP7648334B2 (ja) 2020-02-21 2021-02-19 無溶剤型の光硬化性液状組成物、その硬化物、それを含む光学充填剤、およびその硬化物からなる層を含む表示装置

Country Status (6)

Country Link
US (1) US20230107203A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP4108699A4 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP7648334B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR20220146520A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN115244100A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO2021167053A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7533331B2 (ja) * 2020-11-26 2024-08-14 信越化学工業株式会社 低誘電化剤、これを含む低誘電性樹脂組成物および樹脂の低誘電化方法、並びに低誘電化剤としての使用
US20220162396A1 (en) * 2020-11-26 2022-05-26 Shin-Etsu Chemical Co., Ltd. Dielectric property-lowering agent, low-dielectric resin composition containing same and method for lowering dielectric properties of resin
TW202344657A (zh) * 2022-04-21 2023-11-16 美商元平台技術有限公司 用於連結光學基材的低應力loca添加物及loca處理
CN119968415A (zh) * 2022-09-27 2025-05-09 陶氏东丽株式会社 紫外线固化性组合物及其用途
CN115894934A (zh) * 2022-11-21 2023-04-04 江南大学 一种含磷聚硅氧烷及其制备方法与改性环氧树脂的应用
CN117363215A (zh) * 2023-09-20 2024-01-09 广东工业大学 一种光固化涂料、涂层及其应用
WO2025107121A1 (en) * 2023-11-20 2025-05-30 Dow Global Technologies Llc Low dielectric constant uv-curable silicone composition
WO2025179484A1 (en) * 2024-02-28 2025-09-04 Dow Global Technologies Llc Low dielectric constant uv-curable silicone composition with di-epoxy and alkene functional cyclohexane
WO2025179487A1 (en) * 2024-02-28 2025-09-04 Dow Global Technologies Llc Low dielectric constant uv-curable silicone composition with tri-epoxy functional silane
WO2025179483A1 (en) * 2024-02-28 2025-09-04 Dow Global Technologies Llc Low dielectric constant uv-curable silicone composition with tri-epoxy functional cyclohexane

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1185734A (en) * 1981-11-12 1985-04-16 Susan E. Hayes Solventless ultraviolet curable pressure-sensitive silicone adhesive
JP2007246894A (ja) * 2006-02-20 2007-09-27 Shin Etsu Chem Co Ltd 加熱硬化性シリコーン組成物
US20070299165A1 (en) * 2006-06-27 2007-12-27 Gelcore Llc Phenyl-containing silicone epoxy formulations useful as encapsulants for LED applications
JP2008303343A (ja) * 2007-06-11 2008-12-18 Toray Ind Inc 活性エネルギー線硬化組成物、及びそれを用いたディスプレイ用フィルター並びにディスプレイ
JP2012001668A (ja) * 2010-06-18 2012-01-05 Shin-Etsu Chemical Co Ltd シルフェニレン含有光硬化性組成物、それを用いたパターン形成方法およびその方法により得られる光半導体素子
WO2013047620A1 (ja) * 2011-09-27 2013-04-04 日本化薬株式会社 光半導体素子封止用硬化性樹脂組成物およびその硬化物
JP2016084373A (ja) * 2014-10-22 2016-05-19 信越化学工業株式会社 シリコーン変性エポキシ樹脂と多価カルボン酸化合物を含有するエポキシ樹脂およびその硬化物
JP2018090806A (ja) * 2012-07-26 2018-06-14 デンカ株式会社 樹脂組成物
CN110894361A (zh) * 2019-12-12 2020-03-20 浙江福斯特新材料研究院有限公司 光固化封装组合物、封装结构及半导体器件

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GB2057476B (en) * 1979-08-29 1983-06-22 Shinetsu Chemical Co Photocurable organopolysiloxane compositions
JP5392805B2 (ja) 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP6404110B2 (ja) * 2014-12-18 2018-10-10 信越化学工業株式会社 シリコーン変性エポキシ樹脂と多価カルボン酸化合物を含有するエポキシ樹脂およびその硬化物
JP6477049B2 (ja) 2015-03-09 2019-03-06 セイコーエプソン株式会社 放電灯駆動装置、光源装置、プロジェクターおよび放電灯駆動方法
TWI695059B (zh) 2015-04-17 2020-06-01 日商積水化學工業股份有限公司 電子裝置用密封劑及電子裝置之製造方法
JP6410158B2 (ja) 2016-10-07 2018-10-24 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
JP6904245B2 (ja) 2017-12-27 2021-07-14 信越化学工業株式会社 感光性樹脂組成物、パターン形成方法、及び光半導体素子の製造方法
KR20230161492A (ko) * 2021-03-26 2023-11-27 다우 도레이 캄파니 리미티드 자외선 경화성 조성물 및 그의 용도

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1185734A (en) * 1981-11-12 1985-04-16 Susan E. Hayes Solventless ultraviolet curable pressure-sensitive silicone adhesive
JP2007246894A (ja) * 2006-02-20 2007-09-27 Shin Etsu Chem Co Ltd 加熱硬化性シリコーン組成物
US20070299165A1 (en) * 2006-06-27 2007-12-27 Gelcore Llc Phenyl-containing silicone epoxy formulations useful as encapsulants for LED applications
JP2008303343A (ja) * 2007-06-11 2008-12-18 Toray Ind Inc 活性エネルギー線硬化組成物、及びそれを用いたディスプレイ用フィルター並びにディスプレイ
JP2012001668A (ja) * 2010-06-18 2012-01-05 Shin-Etsu Chemical Co Ltd シルフェニレン含有光硬化性組成物、それを用いたパターン形成方法およびその方法により得られる光半導体素子
WO2013047620A1 (ja) * 2011-09-27 2013-04-04 日本化薬株式会社 光半導体素子封止用硬化性樹脂組成物およびその硬化物
JP2018090806A (ja) * 2012-07-26 2018-06-14 デンカ株式会社 樹脂組成物
JP2016084373A (ja) * 2014-10-22 2016-05-19 信越化学工業株式会社 シリコーン変性エポキシ樹脂と多価カルボン酸化合物を含有するエポキシ樹脂およびその硬化物
CN110894361A (zh) * 2019-12-12 2020-03-20 浙江福斯特新材料研究院有限公司 光固化封装组合物、封装结构及半导体器件

Also Published As

Publication number Publication date
WO2021167053A1 (ja) 2021-08-26
EP4108699A4 (en) 2024-06-19
KR20220146520A (ko) 2022-11-01
JP7648334B2 (ja) 2025-03-18
US20230107203A1 (en) 2023-04-06
EP4108699A1 (en) 2022-12-28
CN115244100A (zh) 2022-10-25

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