JPWO2021166498A1 - - Google Patents

Info

Publication number
JPWO2021166498A1
JPWO2021166498A1 JP2022501697A JP2022501697A JPWO2021166498A1 JP WO2021166498 A1 JPWO2021166498 A1 JP WO2021166498A1 JP 2022501697 A JP2022501697 A JP 2022501697A JP 2022501697 A JP2022501697 A JP 2022501697A JP WO2021166498 A1 JPWO2021166498 A1 JP WO2021166498A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022501697A
Other versions
JP7432703B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021166498A1 publication Critical patent/JPWO2021166498A1/ja
Application granted granted Critical
Publication of JP7432703B2 publication Critical patent/JP7432703B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528Geometry or layout of the interconnection structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4279Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/06Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/428Electrical aspects containing printed circuit boards [PCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6605High-frequency electrical connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2022501697A 2020-02-18 2021-01-14 配線基体および電子装置 Active JP7432703B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020025378 2020-02-18
JP2020025378 2020-02-18
PCT/JP2021/000936 WO2021166498A1 (ja) 2020-02-18 2021-01-14 配線基体および電子装置

Publications (2)

Publication Number Publication Date
JPWO2021166498A1 true JPWO2021166498A1 (ja) 2021-08-26
JP7432703B2 JP7432703B2 (ja) 2024-02-16

Family

ID=77392105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022501697A Active JP7432703B2 (ja) 2020-02-18 2021-01-14 配線基体および電子装置

Country Status (4)

Country Link
US (1) US20230057427A1 (ja)
EP (1) EP4109517A1 (ja)
JP (1) JP7432703B2 (ja)
WO (1) WO2021166498A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547992A (ja) * 1991-08-07 1993-02-26 Mitsubishi Electric Corp 半導体集積回路装置
JP2011187915A (ja) * 2009-09-28 2011-09-22 Kyocera Corp フレキシブル配線基板とリード端子付き電子部品との接続構造
JP2013074048A (ja) * 2011-09-27 2013-04-22 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
WO2013141013A1 (ja) * 2012-03-22 2013-09-26 京セラ株式会社 素子収納用パッケージ
JP2016146439A (ja) * 2015-02-09 2016-08-12 Ngkエレクトロデバイス株式会社 高周波用半導体素子収納用パッケージ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009260095A (ja) 2008-04-18 2009-11-05 Sumitomo Electric Ind Ltd 光モジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547992A (ja) * 1991-08-07 1993-02-26 Mitsubishi Electric Corp 半導体集積回路装置
JP2011187915A (ja) * 2009-09-28 2011-09-22 Kyocera Corp フレキシブル配線基板とリード端子付き電子部品との接続構造
JP2013074048A (ja) * 2011-09-27 2013-04-22 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
WO2013141013A1 (ja) * 2012-03-22 2013-09-26 京セラ株式会社 素子収納用パッケージ
JP2016146439A (ja) * 2015-02-09 2016-08-12 Ngkエレクトロデバイス株式会社 高周波用半導体素子収納用パッケージ

Also Published As

Publication number Publication date
WO2021166498A1 (ja) 2021-08-26
EP4109517A1 (en) 2022-12-28
JP7432703B2 (ja) 2024-02-16
US20230057427A1 (en) 2023-02-23

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