JPWO2021166498A1 - - Google Patents

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Publication number
JPWO2021166498A1
JPWO2021166498A1 JP2022501697A JP2022501697A JPWO2021166498A1 JP WO2021166498 A1 JPWO2021166498 A1 JP WO2021166498A1 JP 2022501697 A JP2022501697 A JP 2022501697A JP 2022501697 A JP2022501697 A JP 2022501697A JP WO2021166498 A1 JPWO2021166498 A1 JP WO2021166498A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022501697A
Other versions
JP7432703B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021166498A1 publication Critical patent/JPWO2021166498A1/ja
Application granted granted Critical
Publication of JP7432703B2 publication Critical patent/JP7432703B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
JP2022501697A 2020-02-18 2021-01-14 配線基体および電子装置 Active JP7432703B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020025378 2020-02-18
JP2020025378 2020-02-18
PCT/JP2021/000936 WO2021166498A1 (ja) 2020-02-18 2021-01-14 配線基体および電子装置

Publications (2)

Publication Number Publication Date
JPWO2021166498A1 true JPWO2021166498A1 (ja) 2021-08-26
JP7432703B2 JP7432703B2 (ja) 2024-02-16

Family

ID=77392105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022501697A Active JP7432703B2 (ja) 2020-02-18 2021-01-14 配線基体および電子装置

Country Status (4)

Country Link
US (1) US20230057427A1 (ja)
EP (1) EP4109517A1 (ja)
JP (1) JP7432703B2 (ja)
WO (1) WO2021166498A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547992A (ja) * 1991-08-07 1993-02-26 Mitsubishi Electric Corp 半導体集積回路装置
JP2011187915A (ja) * 2009-09-28 2011-09-22 Kyocera Corp フレキシブル配線基板とリード端子付き電子部品との接続構造
JP2013074048A (ja) * 2011-09-27 2013-04-22 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
WO2013141013A1 (ja) * 2012-03-22 2013-09-26 京セラ株式会社 素子収納用パッケージ
JP2016146439A (ja) * 2015-02-09 2016-08-12 Ｎｇｋエレクトロデバイス株式会社 高周波用半導体素子収納用パッケージ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009260095A (ja) 2008-04-18 2009-11-05 Sumitomo Electric Ind Ltd 光モジュール
JP5769474B2 (ja) * 2011-04-06 2015-08-26 京セラ株式会社 端子構造体、電子部品収納用パッケージおよび電子装置
JP6093020B2 (ja) * 2013-08-28 2017-03-08 京セラ株式会社 素子収納用パッケージおよび実装構造体
WO2015088028A1 (ja) * 2013-12-13 2015-06-18 京セラ株式会社 素子収納用パッケージおよび実装構造体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547992A (ja) * 1991-08-07 1993-02-26 Mitsubishi Electric Corp 半導体集積回路装置
JP2011187915A (ja) * 2009-09-28 2011-09-22 Kyocera Corp フレキシブル配線基板とリード端子付き電子部品との接続構造
JP2013074048A (ja) * 2011-09-27 2013-04-22 Kyocera Corp 半導体素子収納用パッケージおよび半導体装置
WO2013141013A1 (ja) * 2012-03-22 2013-09-26 京セラ株式会社 素子収納用パッケージ
JP2016146439A (ja) * 2015-02-09 2016-08-12 Ｎｇｋエレクトロデバイス株式会社 高周波用半導体素子収納用パッケージ

Also Published As

Publication number Publication date
EP4109517A1 (en) 2022-12-28
WO2021166498A1 (ja) 2021-08-26
US20230057427A1 (en) 2023-02-23
JP7432703B2 (ja) 2024-02-16

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