JPWO2021157362A1 - - Google Patents

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Publication number
JPWO2021157362A1
JPWO2021157362A1 JP2021575705A JP2021575705A JPWO2021157362A1 JP WO2021157362 A1 JPWO2021157362 A1 JP WO2021157362A1 JP 2021575705 A JP2021575705 A JP 2021575705A JP 2021575705 A JP2021575705 A JP 2021575705A JP WO2021157362 A1 JPWO2021157362 A1 JP WO2021157362A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021575705A
Other languages
Japanese (ja)
Other versions
JP7259093B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021157362A1 publication Critical patent/JPWO2021157362A1/ja
Application granted granted Critical
Publication of JP7259093B2 publication Critical patent/JP7259093B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2021575705A 2020-02-04 2021-01-20 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board Active JP7259093B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020016980 2020-02-04
JP2020016980 2020-02-04
PCT/JP2021/001902 WO2021157362A1 (en) 2020-02-04 2021-01-20 Roughened copper foil, carrier-attached copper foil, copper clad laminate plate, and printed wiring board

Publications (2)

Publication Number Publication Date
JPWO2021157362A1 true JPWO2021157362A1 (en) 2021-08-12
JP7259093B2 JP7259093B2 (en) 2023-04-17

Family

ID=77199339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021575705A Active JP7259093B2 (en) 2020-02-04 2021-01-20 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board

Country Status (5)

Country Link
JP (1) JP7259093B2 (en)
KR (1) KR20220106200A (en)
CN (1) CN115038819A (en)
TW (1) TWI756039B (en)
WO (1) WO2021157362A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022153580A1 (en) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
WO2023281759A1 (en) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11317574A (en) * 1998-01-19 1999-11-16 Mitsui Mining & Smelting Co Ltd Composite copper foil, manufacture thereof, copper-plated laminate and printed wiring board provided therewith
JP2001089892A (en) * 1999-09-21 2001-04-03 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil with carrier foil, its producing method and copper-covered laminated sheet using the electrolytic copper foil with carrier foil
JP2005048277A (en) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil with carrier foil, and manufacturing method therefor
JP2014506202A (en) * 2010-12-14 2014-03-13 スリーエム イノベイティブ プロパティズ カンパニー Image and method for making it
WO2016117587A1 (en) * 2015-01-22 2016-07-28 三井金属鉱業株式会社 Ultrathin copper foil with carrier and method for manufacturing same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016174998A1 (en) * 2015-04-28 2016-11-03 三井金属鉱業株式会社 Roughened copper foil and printed wiring board
WO2017006739A1 (en) * 2015-07-03 2017-01-12 三井金属鉱業株式会社 Roughened copper foil, copper-clad laminate and printed wiring board
JP6200042B2 (en) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
WO2017179416A1 (en) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
JP6462961B2 (en) 2016-12-14 2019-01-30 古河電気工業株式会社 Surface treated copper foil and copper clad laminate
KR102340473B1 (en) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 surface treatment copper foil
CN111886367B (en) * 2018-03-27 2023-05-16 三井金属矿业株式会社 Roughened copper foil, copper foil with carrier, copper-clad laminate, and printed wiring board
JP6905157B2 (en) * 2018-08-10 2021-07-21 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11317574A (en) * 1998-01-19 1999-11-16 Mitsui Mining & Smelting Co Ltd Composite copper foil, manufacture thereof, copper-plated laminate and printed wiring board provided therewith
JP2001089892A (en) * 1999-09-21 2001-04-03 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil with carrier foil, its producing method and copper-covered laminated sheet using the electrolytic copper foil with carrier foil
JP2005048277A (en) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil with carrier foil, and manufacturing method therefor
JP2014506202A (en) * 2010-12-14 2014-03-13 スリーエム イノベイティブ プロパティズ カンパニー Image and method for making it
WO2016117587A1 (en) * 2015-01-22 2016-07-28 三井金属鉱業株式会社 Ultrathin copper foil with carrier and method for manufacturing same

Also Published As

Publication number Publication date
TWI756039B (en) 2022-02-21
KR20220106200A (en) 2022-07-28
WO2021157362A1 (en) 2021-08-12
JP7259093B2 (en) 2023-04-17
TW202146711A (en) 2021-12-16
CN115038819A (en) 2022-09-09

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