JPWO2021153461A1 - - Google Patents

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Publication number
JPWO2021153461A1
JPWO2021153461A1 JP2021573998A JP2021573998A JPWO2021153461A1 JP WO2021153461 A1 JPWO2021153461 A1 JP WO2021153461A1 JP 2021573998 A JP2021573998 A JP 2021573998A JP 2021573998 A JP2021573998 A JP 2021573998A JP WO2021153461 A1 JPWO2021153461 A1 JP WO2021153461A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021573998A
Other languages
Japanese (ja)
Other versions
JPWO2021153461A5 (https=
JP7351938B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021153461A1 publication Critical patent/JPWO2021153461A1/ja
Publication of JPWO2021153461A5 publication Critical patent/JPWO2021153461A5/ja
Application granted granted Critical
Publication of JP7351938B2 publication Critical patent/JP7351938B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/02—Details
    • H05B3/03—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/16—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2021573998A 2020-01-30 2021-01-22 ヒータ基板、プローブカード用基板及びプローブカード Active JP7351938B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020013086 2020-01-30
JP2020013086 2020-01-30
PCT/JP2021/002299 WO2021153461A1 (ja) 2020-01-30 2021-01-22 ヒータ基板、プローブカード用基板及びプローブカード

Publications (3)

Publication Number Publication Date
JPWO2021153461A1 true JPWO2021153461A1 (https=) 2021-08-05
JPWO2021153461A5 JPWO2021153461A5 (https=) 2022-10-27
JP7351938B2 JP7351938B2 (ja) 2023-09-27

Family

ID=77079077

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021573998A Active JP7351938B2 (ja) 2020-01-30 2021-01-22 ヒータ基板、プローブカード用基板及びプローブカード

Country Status (4)

Country Link
US (1) US12174220B2 (https=)
JP (1) JP7351938B2 (https=)
KR (1) KR102829930B1 (https=)
WO (1) WO2021153461A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117157744A (zh) * 2022-03-30 2023-12-01 日本碍子株式会社 半导体制造装置用部件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020017916A1 (en) * 1999-01-26 2002-02-14 Simon Costello Termperature-controlled semiconductor wafer chuck system
JP2002184558A (ja) * 2000-12-12 2002-06-28 Ibiden Co Ltd ヒータ
JP2011069759A (ja) * 2009-09-28 2011-04-07 Kyocera Corp プローブカード用基板，プローブカードおよびこれを用いた半導体ウエハ検査装置
JP2017201669A (ja) * 2016-05-06 2017-11-09 日本特殊陶業株式会社 加熱部材及び静電チャック

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5895591A (en) * 1994-07-06 1999-04-20 Ngk Spark Plug Co., Ltd. Ceramic heater and oxygen sensor
JP2002246152A (ja) * 2001-02-20 2002-08-30 Ibiden Co Ltd セラミックヒータ
JP2003077783A (ja) 2001-09-03 2003-03-14 Ibiden Co Ltd 半導体製造・検査装置用セラミックヒータおよびその製造方法
WO2005103730A1 (ja) * 2004-04-27 2005-11-03 Jsr Corporation シート状プローブおよびその製造方法並びにその応用
DE102008013978B4 (de) * 2007-03-16 2021-08-12 Cascade Microtech, Inc. Chuck mit triaxialem Aufbau
KR100891384B1 (ko) * 2007-06-14 2009-04-02 삼성모바일디스플레이주식회사 플렉서블 기판 접합 및 탈착장치
JP5074878B2 (ja) * 2007-10-15 2012-11-14 東京エレクトロン株式会社 検査装置
CN104523071A (zh) * 2008-07-18 2015-04-22 金瑟姆股份公司 气候受控床组件
JP5199859B2 (ja) 2008-12-24 2013-05-15 株式会社日本マイクロニクス プローブカード
US9224626B2 (en) * 2012-07-03 2015-12-29 Watlow Electric Manufacturing Company Composite substrate for layered heaters
JP6463938B2 (ja) * 2014-10-08 2019-02-06 日本特殊陶業株式会社 静電チャック
JP6703367B2 (ja) * 2014-12-05 2020-06-03 デクセリアルズ株式会社 加熱基板、保護素子および電子機器
JP7773910B2 (ja) * 2019-07-01 2025-11-20 クアーズテック・インコーポレイテッド 腐食保護層を有するマルチゾーンシリコン窒化物ウエハヒータアセンブリ、並びにその製造方法および使用方法
US12392802B2 (en) * 2019-11-27 2025-08-19 Kyocera Corporation Circuit board, probe card substrate, and probe card

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020017916A1 (en) * 1999-01-26 2002-02-14 Simon Costello Termperature-controlled semiconductor wafer chuck system
JP2002184558A (ja) * 2000-12-12 2002-06-28 Ibiden Co Ltd ヒータ
JP2011069759A (ja) * 2009-09-28 2011-04-07 Kyocera Corp プローブカード用基板，プローブカードおよびこれを用いた半導体ウエハ検査装置
JP2017201669A (ja) * 2016-05-06 2017-11-09 日本特殊陶業株式会社 加熱部材及び静電チャック

Also Published As

Publication number Publication date
WO2021153461A1 (ja) 2021-08-05
US12174220B2 (en) 2024-12-24
KR20220119693A (ko) 2022-08-30
US20230085111A1 (en) 2023-03-16
JP7351938B2 (ja) 2023-09-27
KR102829930B1 (ko) 2025-07-04

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