JPWO2021149286A1 - - Google Patents

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Publication number
JPWO2021149286A1
JPWO2021149286A1 JP2021572959A JP2021572959A JPWO2021149286A1 JP WO2021149286 A1 JPWO2021149286 A1 JP WO2021149286A1 JP 2021572959 A JP2021572959 A JP 2021572959A JP 2021572959 A JP2021572959 A JP 2021572959A JP WO2021149286 A1 JPWO2021149286 A1 JP WO2021149286A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021572959A
Other versions
JP7254216B2 (ja
JPWO2021149286A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021149286A1 publication Critical patent/JPWO2021149286A1/ja
Publication of JPWO2021149286A5 publication Critical patent/JPWO2021149286A5/ja
Application granted granted Critical
Publication of JP7254216B2 publication Critical patent/JP7254216B2/ja
Active legal-status Critical Current
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Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP2021572959A 2020-01-22 2020-08-13 半導体装置の製造方法 Active JP7254216B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020008140 2020-01-22
JP2020008140 2020-01-22
PCT/JP2020/030762 WO2021149286A1 (ja) 2020-01-22 2020-08-13 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021149286A1 true JPWO2021149286A1 (ja) 2021-07-29
JPWO2021149286A5 JPWO2021149286A5 (ja) 2022-07-14
JP7254216B2 JP7254216B2 (ja) 2023-04-07

Family

ID=76991847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021572959A Active JP7254216B2 (ja) 2020-01-22 2020-08-13 半導体装置の製造方法

Country Status (3)

Country Link
JP (1) JP7254216B2 (ja)
CN (1) CN114981937A (ja)
WO (1) WO2021149286A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124064U (ja) * 1984-01-31 1985-08-21 松下電器産業株式会社 はんだ層印刷用マスク
JPH06196516A (ja) * 1992-10-26 1994-07-15 Sanyo Electric Co Ltd 半田塗布方法、半導体装置の製造方法およびスキージ
JPH08153962A (ja) * 1994-11-28 1996-06-11 Hitachi Ltd 半田ペースト印刷方法及び半田ペースト印刷装置
JPH1178274A (ja) * 1997-09-10 1999-03-23 Mitsui High Tec Inc エラストマー塗布用マスク
JP2010143227A (ja) * 2010-02-05 2010-07-01 Bonmaaku:Kk スクリーン印刷版
JP2016127219A (ja) * 2015-01-08 2016-07-11 三菱電機株式会社 半導体デバイスの製造方法および半導体デバイス
JP2016190182A (ja) * 2015-03-31 2016-11-10 Ｄｏｗａエレクトロニクス株式会社 接合材の塗布方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3896285B2 (ja) * 2002-01-24 2007-03-22 三菱電機株式会社 半導体装置の製造方法
JP2008066344A (ja) * 2006-09-04 2008-03-21 Toyota Industries Corp 多層基板と金属接合材料の印刷方法
JP6196516B2 (ja) 2013-09-24 2017-09-13 昭和電工ガスプロダクツ株式会社 ショットブラスト装置
JP6265693B2 (ja) * 2013-11-12 2018-01-24 三菱電機株式会社 半導体装置およびその製造方法
SG11201801845WA (en) * 2015-09-07 2018-04-27 Hitachi Chemical Co Ltd Assembly and semiconductor device
JP6741548B2 (ja) * 2016-10-14 2020-08-19 日本碍子株式会社 半導体製造装置用部材及びその製法
WO2018173275A1 (ja) * 2017-03-24 2018-09-27 三菱電機株式会社 半導体装置の製造方法および半導体装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124064U (ja) * 1984-01-31 1985-08-21 松下電器産業株式会社 はんだ層印刷用マスク
JPH06196516A (ja) * 1992-10-26 1994-07-15 Sanyo Electric Co Ltd 半田塗布方法、半導体装置の製造方法およびスキージ
JPH08153962A (ja) * 1994-11-28 1996-06-11 Hitachi Ltd 半田ペースト印刷方法及び半田ペースト印刷装置
JPH1178274A (ja) * 1997-09-10 1999-03-23 Mitsui High Tec Inc エラストマー塗布用マスク
JP2010143227A (ja) * 2010-02-05 2010-07-01 Bonmaaku:Kk スクリーン印刷版
JP2016127219A (ja) * 2015-01-08 2016-07-11 三菱電機株式会社 半導体デバイスの製造方法および半導体デバイス
JP2016190182A (ja) * 2015-03-31 2016-11-10 Ｄｏｗａエレクトロニクス株式会社 接合材の塗布方法

Also Published As

Publication number Publication date
CN114981937A (zh) 2022-08-30
JP7254216B2 (ja) 2023-04-07
WO2021149286A1 (ja) 2021-07-29

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