JPWO2021145332A5 - - Google Patents

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Publication number
JPWO2021145332A5
JPWO2021145332A5 JP2021571201A JP2021571201A JPWO2021145332A5 JP WO2021145332 A5 JPWO2021145332 A5 JP WO2021145332A5 JP 2021571201 A JP2021571201 A JP 2021571201A JP 2021571201 A JP2021571201 A JP 2021571201A JP WO2021145332 A5 JPWO2021145332 A5 JP WO2021145332A5
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JP
Japan
Prior art keywords
hole
vicinity
heat
surface layer
conductor
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021571201A
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Japanese (ja)
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JPWO2021145332A1 (en
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2021/000779 external-priority patent/WO2021145332A1/en
Publication of JPWO2021145332A1 publication Critical patent/JPWO2021145332A1/ja
Publication of JPWO2021145332A5 publication Critical patent/JPWO2021145332A5/ja
Pending legal-status Critical Current

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Description

バスバー１０Ａの面１０ａの、貫通穴１０ｃの近傍には、第一実施形態と同様の構成を有した表層２０が設けられている。貫通穴１０ｃは、他の導体との接続部分であるため、通電により導体自体の抵抗により発熱する。さらに、貫通穴１０ｃの近傍において、他の導体との間の接触抵抗等により発熱することがある。すなわち、貫通穴１０ｃの近傍は、発熱部位とも称されうる。この点、本実施形態によれば、貫通穴１０ｃの近傍領域において、当該貫通穴１０ｃから隙間をあけて離れた位置に、表層２０が設けられているため、接触抵抗に基づくバスバー１０Ａあるいは当該バスバー１０Ａと接続される導体の温度の過度な上昇を、抑制することができる。すなわち、本実施形態によれば、表層２０により、伝熱部材としてのバスバー１０Ａの温度上昇を抑制することができる。 A surface layer 20 having the same configuration as that of the first embodiment is provided in the vicinity of the through hole 10c on the surface 10a of the busbar 10A. Since the through-hole 10c is a connection portion with another conductor, heat is generated by the resistance of the conductor itself when energized. Furthermore, in the vicinity of the through hole 10c, heat may be generated due to contact resistance with other conductors or the like. That is, the vicinity of through hole 10c can also be referred to as a heat generation site. In this respect, according to the present embodiment, the surface layer 20 is provided at a position spaced apart from the through hole 10c in the vicinity of the through hole 10c. An excessive rise in temperature of the conductor connected to 10A can be suppressed. That is, according to this embodiment, the surface layer 20 can suppress the temperature rise of the bus bar 10A as a heat transfer member.

JP2021571201A 2020-01-15 2021-01-13 Pending JPWO2021145332A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020004435 2020-01-15
PCT/JP2021/000779 WO2021145332A1 (en) 2020-01-15 2021-01-13 Heat transfer member and method for producing heat transfer member

Publications (2)

Publication Number Publication Date
JPWO2021145332A1 JPWO2021145332A1 (en) 2021-07-22
JPWO2021145332A5 true JPWO2021145332A5 (en) 2022-09-07

Family

ID=76863222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021571201A Pending JPWO2021145332A1 (en) 2020-01-15 2021-01-13

Country Status (3)

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JP (1) JPWO2021145332A1 (en)
TW (1) TW202134586A (en)
WO (1) WO2021145332A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024035713A (en) * 2022-09-02 2024-03-14 住友精密工業株式会社 Boiling type cooler and method of manufacturing the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137630A (en) * 1975-05-24 1976-11-27 Inoue Japax Res Production method for heat exchanger components
CN104342734B (en) * 2013-08-06 2017-07-18 中国科学院苏州纳米技术与纳米仿生研究所 Aluminium with enhanced foam nucleate boiling heat transfer function and preparation method thereof
CN104201160A (en) * 2014-09-09 2014-12-10 东南大学 Enhanced boiling heat exchange structure with porous foam metal
US9844134B2 (en) * 2015-01-29 2017-12-12 Infineon Technologies Ag Device including a metallization layer and method of manufacturing a device
JP6526500B2 (en) * 2015-06-29 2019-06-05 昭和電工株式会社 Boiling heat transfer member and boil cooling apparatus using the same
JP6693480B2 (en) * 2017-06-22 2020-05-13 株式会社デンソー Terminal cooling device
CN107979953A (en) * 2017-11-22 2018-05-01 上海交通大学 Graded metal foam and fin combined radiator

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