JPWO2021145175A1 - - Google Patents

Info

Publication number
JPWO2021145175A1
JPWO2021145175A1 JP2021571124A JP2021571124A JPWO2021145175A1 JP WO2021145175 A1 JPWO2021145175 A1 JP WO2021145175A1 JP 2021571124 A JP2021571124 A JP 2021571124A JP 2021571124 A JP2021571124 A JP 2021571124A JP WO2021145175 A1 JPWO2021145175 A1 JP WO2021145175A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021571124A
Other versions
JP7485700B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021145175A1 publication Critical patent/JPWO2021145175A1/ja
Application granted granted Critical
Publication of JP7485700B2 publication Critical patent/JP7485700B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
JP2021571124A 2020-01-16 2020-12-23 基板処理方法、記憶媒体、及び基板処理装置 Active JP7485700B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020004972 2020-01-16
JP2020004972 2020-01-16
PCT/JP2020/048136 WO2021145175A1 (ja) 2020-01-16 2020-12-23 基板処理方法、記憶媒体、及び基板処理装置

Publications (2)

Publication Number Publication Date
JPWO2021145175A1 true JPWO2021145175A1 (ja) 2021-07-22
JP7485700B2 JP7485700B2 (ja) 2024-05-16

Family

ID=76863683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021571124A Active JP7485700B2 (ja) 2020-01-16 2020-12-23 基板処理方法、記憶媒体、及び基板処理装置

Country Status (3)

Country Link
JP (1) JP7485700B2 (ja)
TW (1) TW202133223A (ja)
WO (1) WO2021145175A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1092726A (ja) * 1996-09-18 1998-04-10 Toshiba Microelectron Corp レジスト塗布装置及びレジスト塗布方法
JP3831096B2 (ja) * 1997-10-17 2006-10-11 株式会社リコー 塗布膜形成方法及び塗布膜形成装置
JP3453073B2 (ja) * 1998-10-14 2003-10-06 東京エレクトロン株式会社 塗布処理装置
JP3640561B2 (ja) * 1999-02-23 2005-04-20 セントラル硝子株式会社 スピンコート法による薄膜の形成装置及び形成方法
JP4043444B2 (ja) 2004-02-18 2008-02-06 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
JP4184317B2 (ja) * 2004-03-05 2008-11-19 シーケーディ株式会社 液滴塗布方法および液滴塗布装置
JP5109373B2 (ja) * 2007-01-19 2012-12-26 富士通セミコンダクター株式会社 塗布液の塗布方法及び半導体装置の製造方法
JP6299624B2 (ja) * 2015-02-13 2018-03-28 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及び記憶媒体

Also Published As

Publication number Publication date
WO2021145175A1 (ja) 2021-07-22
JP7485700B2 (ja) 2024-05-16
TW202133223A (zh) 2021-09-01

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