JPWO2021132495A1 - - Google Patents

Info

Publication number
JPWO2021132495A1
JPWO2021132495A1 JP2021567633A JP2021567633A JPWO2021132495A1 JP WO2021132495 A1 JPWO2021132495 A1 JP WO2021132495A1 JP 2021567633 A JP2021567633 A JP 2021567633A JP 2021567633 A JP2021567633 A JP 2021567633A JP WO2021132495 A1 JPWO2021132495 A1 JP WO2021132495A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021567633A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021132495A1 publication Critical patent/JPWO2021132495A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
JP2021567633A 2019-12-27 2020-12-24 Pending JPWO2021132495A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019239454 2019-12-27
PCT/JP2020/048522 WO2021132495A1 (ja) 2019-12-27 2020-12-24 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
JPWO2021132495A1 true JPWO2021132495A1 (zh) 2021-07-01

Family

ID=76575965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567633A Pending JPWO2021132495A1 (zh) 2019-12-27 2020-12-24

Country Status (3)

Country Link
JP (1) JPWO2021132495A1 (zh)
TW (1) TW202140672A (zh)
WO (1) WO2021132495A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023074646A1 (ja) * 2021-10-27 2023-05-04 株式会社レゾナック 樹脂付き金属箔、プリント配線板及びその製造方法、並びに半導体パッケージ
WO2023243676A1 (ja) * 2022-06-17 2023-12-21 株式会社レゾナック 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06122765A (ja) * 1992-09-02 1994-05-06 Mitsubishi Kasei Corp 半導体封止用樹脂組成物
JP6503754B2 (ja) * 2015-01-20 2019-04-24 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ
JP6203303B2 (ja) * 2016-02-18 2017-09-27 エア・ウォーター株式会社 熱硬化性樹脂組成物、その製造方法および用途
CN109565931B (zh) * 2016-07-20 2022-04-29 昭和电工材料株式会社 使用高频带的信号的电子设备用复合膜、印刷线路板及其制造方法
JP7169076B2 (ja) * 2018-03-22 2022-11-10 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品

Also Published As

Publication number Publication date
WO2021132495A1 (ja) 2021-07-01
TW202140672A (zh) 2021-11-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231110