JPWO2021132384A1 - - Google Patents

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Publication number
JPWO2021132384A1
JPWO2021132384A1 JP2021567571A JP2021567571A JPWO2021132384A1 JP WO2021132384 A1 JPWO2021132384 A1 JP WO2021132384A1 JP 2021567571 A JP2021567571 A JP 2021567571A JP 2021567571 A JP2021567571 A JP 2021567571A JP WO2021132384 A1 JPWO2021132384 A1 JP WO2021132384A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021567571A
Other languages
Japanese (ja)
Other versions
JPWO2021132384A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021132384A1 publication Critical patent/JPWO2021132384A1/ja
Publication of JPWO2021132384A5 publication Critical patent/JPWO2021132384A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Electromagnetism (AREA)
  • Materials For Photolithography (AREA)
JP2021567571A 2019-12-25 2020-12-23 Pending JPWO2021132384A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019234519 2019-12-25
PCT/JP2020/048262 WO2021132384A1 (ja) 2019-12-25 2020-12-23 導電性基板の製造方法、導電性基板、タッチセンサー、アンテナ、電磁波シールド材料

Publications (2)

Publication Number Publication Date
JPWO2021132384A1 true JPWO2021132384A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2021-07-01
JPWO2021132384A5 JPWO2021132384A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2022-08-26

Family

ID=76574270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567571A Pending JPWO2021132384A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2019-12-25 2020-12-23

Country Status (6)

Country Link
US (1) US20220334492A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPWO2021132384A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR20220106784A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN114868462A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TWI867132B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO2021132384A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023020485A (ja) * 2021-07-30 2023-02-09 富士フイルム株式会社 感光性組成物、感光性組成物層、転写フィルム、導体パターンを有する積層体の製造方法

Citations (11)

* Cited by examiner, † Cited by third party
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JP2004103969A (ja) * 2002-09-12 2004-04-02 Dainippon Printing Co Ltd 導電性パターン基板の製造方法
JP2005116999A (ja) * 2003-09-19 2005-04-28 Jsr Corp 造形物の製造方法
JP2011114286A (ja) * 2009-11-30 2011-06-09 Asahi Glass Co Ltd 導電性パターン付き基板の製造方法
WO2012060284A1 (ja) * 2010-11-01 2012-05-10 Ｄｏｗａエレクトロニクス株式会社 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法
JP2013111692A (ja) * 2011-11-28 2013-06-10 Nihon Univ 微細金属構造体およびその製造方法
JP6275903B1 (ja) * 2017-05-29 2018-02-07 株式会社アルファ・ジャパン 金属皮膜形成品及び金属皮膜形成品の製造方法
JP2018074055A (ja) * 2016-11-01 2018-05-10 エレファンテック株式会社 プリント配線板の製造方法
WO2019065113A1 (ja) * 2017-09-29 2019-04-04 富士フイルム株式会社 回路配線の製造方法及びタッチパネルの製造方法
WO2019074112A1 (ja) * 2017-10-13 2019-04-18 富士フイルム株式会社 回路配線の製造方法、タッチパネルの製造方法及びパターン付き基材の製造方法
JP2019083347A (ja) * 2019-03-04 2019-05-30 大日本印刷株式会社 導電パターン基板の製造方法
JP2019160844A (ja) * 2018-03-07 2019-09-19 愛三工業株式会社 導電体の製造方法及び導電体

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TW473459B (en) * 1998-12-10 2002-01-21 Ibm Method for forming transparent conductive film using chemically amplified resist
JP3632043B2 (ja) * 2002-09-06 2005-03-23 株式会社日立製作所 半導体装置
KR100690929B1 (ko) 2006-05-03 2007-03-09 한국기계연구원 건식필름레지스트를 이용하여 원하는 패턴두께 또는 높은종횡비를 가지는 고해상도패턴 형성 방법
JP4745358B2 (ja) * 2008-03-04 2011-08-10 株式会社東芝 回転塗布方法、および回転塗布装置
JP2011014848A (ja) * 2009-07-06 2011-01-20 Mitsui Mining & Smelting Co Ltd プリント配線基板及びその製造方法
EP2620814B1 (en) * 2011-10-03 2014-12-10 Hitachi Chemical Company, Ltd. Method for forming conductive pattern
JPWO2016031404A1 (ja) * 2014-08-28 2017-04-27 富士フイルム株式会社 導電膜形成用組成物およびこれを用いる導電膜の製造方法
JP2018103460A (ja) * 2016-12-26 2018-07-05 富士フイルム株式会社 導電性パターン形成方法、導電性パターン形成用印刷版及びその製造方法
CN110325917A (zh) * 2017-02-22 2019-10-11 富士胶片株式会社 感光性转印材料、电路配线的制造方法及触摸面板的制造方法
JP7140964B2 (ja) * 2017-06-05 2022-09-22 セントラル硝子株式会社 含フッ素単量体、含フッ素重合体およびそれを用いたパターン形成用組成物、並びにそのパターン形成方法
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JP6825580B2 (ja) * 2018-01-12 2021-02-03 味の素株式会社 プリント配線板の製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004103969A (ja) * 2002-09-12 2004-04-02 Dainippon Printing Co Ltd 導電性パターン基板の製造方法
JP2005116999A (ja) * 2003-09-19 2005-04-28 Jsr Corp 造形物の製造方法
JP2011114286A (ja) * 2009-11-30 2011-06-09 Asahi Glass Co Ltd 導電性パターン付き基板の製造方法
WO2012060284A1 (ja) * 2010-11-01 2012-05-10 Ｄｏｗａエレクトロニクス株式会社 低温焼結性導電性ペーストおよびそれを用いた導電膜と導電膜の形成方法
JP2013111692A (ja) * 2011-11-28 2013-06-10 Nihon Univ 微細金属構造体およびその製造方法
JP2018074055A (ja) * 2016-11-01 2018-05-10 エレファンテック株式会社 プリント配線板の製造方法
JP6275903B1 (ja) * 2017-05-29 2018-02-07 株式会社アルファ・ジャパン 金属皮膜形成品及び金属皮膜形成品の製造方法
WO2019065113A1 (ja) * 2017-09-29 2019-04-04 富士フイルム株式会社 回路配線の製造方法及びタッチパネルの製造方法
WO2019074112A1 (ja) * 2017-10-13 2019-04-18 富士フイルム株式会社 回路配線の製造方法、タッチパネルの製造方法及びパターン付き基材の製造方法
JP2019160844A (ja) * 2018-03-07 2019-09-19 愛三工業株式会社 導電体の製造方法及び導電体
JP2019083347A (ja) * 2019-03-04 2019-05-30 大日本印刷株式会社 導電パターン基板の製造方法

Also Published As

Publication number Publication date
KR20220106784A (ko) 2022-07-29
TWI867132B (zh) 2024-12-21
TW202147027A (zh) 2021-12-16
US20220334492A1 (en) 2022-10-20
CN114868462A (zh) 2022-08-05
WO2021132384A1 (ja) 2021-07-01

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