JPWO2021131453A1 - - Google Patents

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Publication number
JPWO2021131453A1
JPWO2021131453A1 JP2021567081A JP2021567081A JPWO2021131453A1 JP WO2021131453 A1 JPWO2021131453 A1 JP WO2021131453A1 JP 2021567081 A JP2021567081 A JP 2021567081A JP 2021567081 A JP2021567081 A JP 2021567081A JP WO2021131453 A1 JPWO2021131453 A1 JP WO2021131453A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021567081A
Other versions
JP7220809B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021131453A1 publication Critical patent/JPWO2021131453A1/ja
Application granted granted Critical
Publication of JP7220809B2 publication Critical patent/JP7220809B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005Other compounding ingredients characterised by their effect
    • C11D3/0073Anticorrosion compositions
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D11/00Special methods for preparing compositions containing mixtures of detergents
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/26Organic compounds containing nitrogen
    • C11D3/30Amines; Substituted amines ; Quaternized amines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2021567081A 2019-12-26 2020-11-20 洗浄液、洗浄方法 Active JP7220809B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019237175 2019-12-26
JP2019237175 2019-12-26
JP2020116075 2020-07-06
JP2020116075 2020-07-06
PCT/JP2020/043488 WO2021131453A1 (ja) 2019-12-26 2020-11-20 洗浄液、洗浄方法

Publications (2)

Publication Number Publication Date
JPWO2021131453A1 true JPWO2021131453A1 (ja) 2021-07-01
JP7220809B2 JP7220809B2 (ja) 2023-02-10

Family

ID=76575222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567081A Active JP7220809B2 (ja) 2019-12-26 2020-11-20 洗浄液、洗浄方法

Country Status (4)

Country Link
US (1) US20220403300A1 (ja)
JP (1) JP7220809B2 (ja)
TW (1) TW202124693A (ja)
WO (1) WO2021131453A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI800025B (zh) * 2021-10-07 2023-04-21 德揚科技股份有限公司 清洗水溶液
JP7290195B1 (ja) 2022-10-19 2023-06-13 Jsr株式会社 半導体処理用組成物及び処理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013162020A1 (ja) * 2012-04-27 2013-10-31 和光純薬工業株式会社 半導体基板用洗浄剤および半導体基板表面の処理方法
JP2015165562A (ja) * 2014-02-06 2015-09-17 三菱化学株式会社 半導体デバイス用基板洗浄液及び半導体デバイス用基板の洗浄方法
JP2015165561A (ja) * 2014-02-06 2015-09-17 三菱化学株式会社 半導体デバイス用基板洗浄液及び半導体デバイス用基板の洗浄方法
JP2018507540A (ja) * 2015-01-13 2018-03-15 キャボット マイクロエレクトロニクス コーポレイション 洗浄用組成物及びcmp後の半導体ウエハーの洗浄方法
JP2018107353A (ja) * 2016-12-27 2018-07-05 関東化學株式会社 洗浄液組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013162020A1 (ja) * 2012-04-27 2013-10-31 和光純薬工業株式会社 半導体基板用洗浄剤および半導体基板表面の処理方法
JP2015165562A (ja) * 2014-02-06 2015-09-17 三菱化学株式会社 半導体デバイス用基板洗浄液及び半導体デバイス用基板の洗浄方法
JP2015165561A (ja) * 2014-02-06 2015-09-17 三菱化学株式会社 半導体デバイス用基板洗浄液及び半導体デバイス用基板の洗浄方法
JP2018507540A (ja) * 2015-01-13 2018-03-15 キャボット マイクロエレクトロニクス コーポレイション 洗浄用組成物及びcmp後の半導体ウエハーの洗浄方法
JP2018107353A (ja) * 2016-12-27 2018-07-05 関東化學株式会社 洗浄液組成物

Also Published As

Publication number Publication date
JP7220809B2 (ja) 2023-02-10
WO2021131453A1 (ja) 2021-07-01
TW202124693A (zh) 2021-07-01
US20220403300A1 (en) 2022-12-22

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