JPWO2021131453A1 - - Google Patents
Info
- Publication number
- JPWO2021131453A1 JPWO2021131453A1 JP2021567081A JP2021567081A JPWO2021131453A1 JP WO2021131453 A1 JPWO2021131453 A1 JP WO2021131453A1 JP 2021567081 A JP2021567081 A JP 2021567081A JP 2021567081 A JP2021567081 A JP 2021567081A JP WO2021131453 A1 JPWO2021131453 A1 JP WO2021131453A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D11/00—Special methods for preparing compositions containing mixtures of detergents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019237175 | 2019-12-26 | ||
JP2019237175 | 2019-12-26 | ||
JP2020116075 | 2020-07-06 | ||
JP2020116075 | 2020-07-06 | ||
PCT/JP2020/043488 WO2021131453A1 (ja) | 2019-12-26 | 2020-11-20 | 洗浄液、洗浄方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021131453A1 true JPWO2021131453A1 (ja) | 2021-07-01 |
JP7220809B2 JP7220809B2 (ja) | 2023-02-10 |
Family
ID=76575222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021567081A Active JP7220809B2 (ja) | 2019-12-26 | 2020-11-20 | 洗浄液、洗浄方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220403300A1 (ja) |
JP (1) | JP7220809B2 (ja) |
TW (1) | TW202124693A (ja) |
WO (1) | WO2021131453A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI800025B (zh) * | 2021-10-07 | 2023-04-21 | 德揚科技股份有限公司 | 清洗水溶液 |
JP7290195B1 (ja) | 2022-10-19 | 2023-06-13 | Jsr株式会社 | 半導体処理用組成物及び処理方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013162020A1 (ja) * | 2012-04-27 | 2013-10-31 | 和光純薬工業株式会社 | 半導体基板用洗浄剤および半導体基板表面の処理方法 |
JP2015165562A (ja) * | 2014-02-06 | 2015-09-17 | 三菱化学株式会社 | 半導体デバイス用基板洗浄液及び半導体デバイス用基板の洗浄方法 |
JP2015165561A (ja) * | 2014-02-06 | 2015-09-17 | 三菱化学株式会社 | 半導体デバイス用基板洗浄液及び半導体デバイス用基板の洗浄方法 |
JP2018507540A (ja) * | 2015-01-13 | 2018-03-15 | キャボット マイクロエレクトロニクス コーポレイション | 洗浄用組成物及びcmp後の半導体ウエハーの洗浄方法 |
JP2018107353A (ja) * | 2016-12-27 | 2018-07-05 | 関東化學株式会社 | 洗浄液組成物 |
-
2020
- 2020-11-20 JP JP2021567081A patent/JP7220809B2/ja active Active
- 2020-11-20 WO PCT/JP2020/043488 patent/WO2021131453A1/ja active Application Filing
- 2020-12-18 TW TW109145083A patent/TW202124693A/zh unknown
-
2022
- 2022-06-24 US US17/849,027 patent/US20220403300A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013162020A1 (ja) * | 2012-04-27 | 2013-10-31 | 和光純薬工業株式会社 | 半導体基板用洗浄剤および半導体基板表面の処理方法 |
JP2015165562A (ja) * | 2014-02-06 | 2015-09-17 | 三菱化学株式会社 | 半導体デバイス用基板洗浄液及び半導体デバイス用基板の洗浄方法 |
JP2015165561A (ja) * | 2014-02-06 | 2015-09-17 | 三菱化学株式会社 | 半導体デバイス用基板洗浄液及び半導体デバイス用基板の洗浄方法 |
JP2018507540A (ja) * | 2015-01-13 | 2018-03-15 | キャボット マイクロエレクトロニクス コーポレイション | 洗浄用組成物及びcmp後の半導体ウエハーの洗浄方法 |
JP2018107353A (ja) * | 2016-12-27 | 2018-07-05 | 関東化學株式会社 | 洗浄液組成物 |
Also Published As
Publication number | Publication date |
---|---|
JP7220809B2 (ja) | 2023-02-10 |
WO2021131453A1 (ja) | 2021-07-01 |
TW202124693A (zh) | 2021-07-01 |
US20220403300A1 (en) | 2022-12-22 |
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