JPWO2021125138A1 - - Google Patents

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Publication number
JPWO2021125138A1
JPWO2021125138A1 JP2021565573A JP2021565573A JPWO2021125138A1 JP WO2021125138 A1 JPWO2021125138 A1 JP WO2021125138A1 JP 2021565573 A JP2021565573 A JP 2021565573A JP 2021565573 A JP2021565573 A JP 2021565573A JP WO2021125138 A1 JPWO2021125138 A1 JP WO2021125138A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021565573A
Other languages
Japanese (ja)
Other versions
JPWO2021125138A5 (https=
JP7610131B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021125138A1 publication Critical patent/JPWO2021125138A1/ja
Publication of JPWO2021125138A5 publication Critical patent/JPWO2021125138A5/ja
Application granted granted Critical
Publication of JP7610131B2 publication Critical patent/JP7610131B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C17/00Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/08Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements
    • G11C17/10Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM
    • G11C17/12Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards using semiconductor devices, e.g. bipolar elements in which contents are determined during manufacturing by a predetermined arrangement of coupling elements, e.g. mask-programmable ROM using field-effect devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B20/00Read-only memory [ROM] devices
    • H10B20/27ROM only
    • H10B20/30ROM only having the source region and the drain region on the same level, e.g. lateral transistors
    • H10B20/34Source electrode or drain electrode programmed
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6735Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes having gates fully surrounding the channels, e.g. gate-all-around
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10D62/118Nanostructure semiconductor bodies
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/40FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/43FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having one-dimensional [1D] charge carrier gas channels, e.g. quantum wire FETs or transistors having 1D quantum-confined channels
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10D62/118Nanostructure semiconductor bodies
    • H10D62/119Nanowire, nanosheet or nanotube semiconductor bodies
    • H10D62/121Nanowire, nanosheet or nanotube semiconductor bodies oriented parallel to substrates
JP2021565573A 2019-12-20 2020-12-14 半導体記憶装置 Active JP7610131B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019230713 2019-12-20
JP2019230713 2019-12-20
PCT/JP2020/046574 WO2021125138A1 (ja) 2019-12-20 2020-12-14 半導体記憶装置

Publications (3)

Publication Number Publication Date
JPWO2021125138A1 true JPWO2021125138A1 (https=) 2021-06-24
JPWO2021125138A5 JPWO2021125138A5 (https=) 2022-08-15
JP7610131B2 JP7610131B2 (ja) 2025-01-08

Family

ID=76477544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565573A Active JP7610131B2 (ja) 2019-12-20 2020-12-14 半導体記憶装置

Country Status (4)

Country Link
US (1) US12279419B2 (https=)
JP (1) JP7610131B2 (https=)
CN (1) CN114868242B (https=)
WO (1) WO2021125138A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7640861B2 (ja) * 2019-10-18 2025-03-06 株式会社ソシオネクスト 半導体集積回路装置
US20220359545A1 (en) * 2021-05-07 2022-11-10 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor memory devices with dielectric fin structures
US11778803B2 (en) 2021-09-29 2023-10-03 Advanced Micro Devices, Inc. Cross FET SRAM cell layout
US11881393B2 (en) 2021-09-29 2024-01-23 Advanced Micro Devices, Inc. Cross field effect transistor library cell architecture design
US12598741B2 (en) * 2023-01-30 2026-04-07 Arm Limited Multi-stack bitcell architecture
US12580033B2 (en) * 2023-07-03 2026-03-17 Taiwan Semiconductor Manufacturing Company, Ltd. Read-only memory method, layout, and device
WO2026009666A1 (ja) * 2024-07-04 2026-01-08 株式会社ソシオネクスト 半導体記憶装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160329313A1 (en) * 2014-06-23 2016-11-10 Synopsys, Inc. Cells having transistors and interconnects including nanowires or 2d material strips
US20180233508A1 (en) * 2016-06-01 2018-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Read-only memory (rom) device structure and method for forming the same
US20190172828A1 (en) * 2017-12-04 2019-06-06 Tokyo Electron Limited Semiconductor apparatus having stacked gates and method of manufacture thereof
WO2019108366A1 (en) * 2017-11-28 2019-06-06 Board Of Regents, The University Of Texas System Catalyst influenced pattern transfer technology
WO2019116827A1 (ja) * 2017-12-12 2019-06-20 ソニーセミコンダクタソリューションズ株式会社 半導体装置及びその製造方法
WO2019220983A1 (ja) * 2018-05-17 2019-11-21 株式会社ソシオネクスト 半導体集積回路装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009054707A (ja) * 2007-08-24 2009-03-12 Renesas Technology Corp 半導体記憶装置およびその製造方法
JP4751432B2 (ja) * 2008-09-26 2011-08-17 シャープ株式会社 半導体記憶装置
US10381100B2 (en) * 2016-07-01 2019-08-13 Synopsys, Inc. Enhancing memory yield and performance through utilizing nanowire self-heating
CN109390021B (zh) * 2017-08-03 2022-05-03 联华电子股份有限公司 只读存储器
US11355504B2 (en) * 2018-05-31 2022-06-07 Intel Corporation Anti-ferroelectric capacitor memory cell
US11139300B2 (en) * 2019-11-20 2021-10-05 Intel Corporation Three-dimensional memory arrays with layer selector transistors

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160329313A1 (en) * 2014-06-23 2016-11-10 Synopsys, Inc. Cells having transistors and interconnects including nanowires or 2d material strips
US20180233508A1 (en) * 2016-06-01 2018-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Read-only memory (rom) device structure and method for forming the same
WO2019108366A1 (en) * 2017-11-28 2019-06-06 Board Of Regents, The University Of Texas System Catalyst influenced pattern transfer technology
US20190172828A1 (en) * 2017-12-04 2019-06-06 Tokyo Electron Limited Semiconductor apparatus having stacked gates and method of manufacture thereof
WO2019116827A1 (ja) * 2017-12-12 2019-06-20 ソニーセミコンダクタソリューションズ株式会社 半導体装置及びその製造方法
WO2019220983A1 (ja) * 2018-05-17 2019-11-21 株式会社ソシオネクスト 半導体集積回路装置

Also Published As

Publication number Publication date
CN114868242A (zh) 2022-08-05
CN114868242B (zh) 2024-11-12
WO2021125138A1 (ja) 2021-06-24
US20220310634A1 (en) 2022-09-29
JP7610131B2 (ja) 2025-01-08
US12279419B2 (en) 2025-04-15

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