JPWO2021125013A1 - - Google Patents

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Publication number
JPWO2021125013A1
JPWO2021125013A1 JP2021565516A JP2021565516A JPWO2021125013A1 JP WO2021125013 A1 JPWO2021125013 A1 JP WO2021125013A1 JP 2021565516 A JP2021565516 A JP 2021565516A JP 2021565516 A JP2021565516 A JP 2021565516A JP WO2021125013 A1 JPWO2021125013 A1 JP WO2021125013A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021565516A
Other versions
JP7464062B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021125013A1 publication Critical patent/JPWO2021125013A1/ja
Application granted granted Critical
Publication of JP7464062B2 publication Critical patent/JP7464062B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2021565516A 2019-12-19 2020-12-09 弾性波装置 Active JP7464062B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019229477 2019-12-19
JP2019229477 2019-12-19
PCT/JP2020/045845 WO2021125013A1 (ja) 2019-12-19 2020-12-09 弾性波装置

Publications (2)

Publication Number Publication Date
JPWO2021125013A1 true JPWO2021125013A1 (ja) 2021-06-24
JP7464062B2 JP7464062B2 (ja) 2024-04-09

Family

ID=76477498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565516A Active JP7464062B2 (ja) 2019-12-19 2020-12-09 弾性波装置

Country Status (5)

Country Link
US (1) US20220302897A1 (ja)
JP (1) JP7464062B2 (ja)
KR (1) KR102722448B1 (ja)
CN (1) CN114830533A (ja)
WO (1) WO2021125013A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN216721288U (zh) * 2019-02-27 2022-06-10 株式会社村田制作所 声表面波装置
WO2023013742A1 (ja) * 2021-08-04 2023-02-09 株式会社村田製作所 弾性波装置
WO2024106123A1 (ja) * 2022-11-14 2024-05-23 株式会社村田製作所 弾性波装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163668A (ja) * 1997-11-28 1999-06-18 Matsushita Electric Ind Co Ltd 積層圧電単結晶基板及びそれを用いた圧電デバイス
JP2003198322A (ja) * 2001-12-21 2003-07-11 Kyocera Corp 弾性表面波素子用基板及びそれを用いた弾性表面波素子
JP2003209457A (ja) * 2002-01-15 2003-07-25 Mitsubishi Electric Corp 弾性表面波装置及びその製造方法
JP2006246050A (ja) * 2005-03-03 2006-09-14 Tdk Corp 複合圧電ウエハ及び弾性表面波装置
JP2011182220A (ja) * 2010-03-02 2011-09-15 Panasonic Corp 弾性波共振器及びこれを用いた縦結合二重モードフィルタ、ラダー型フィルタ
JP2012165132A (ja) * 2011-02-04 2012-08-30 Taiyo Yuden Co Ltd 弾性波デバイスの製造方法
WO2013031651A1 (ja) * 2011-09-02 2013-03-07 株式会社村田製作所 弾性波装置及びその製造方法
WO2017013968A1 (ja) * 2015-07-17 2017-01-26 株式会社村田製作所 弾性波装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012086639A1 (ja) 2010-12-24 2012-06-28 株式会社村田製作所 弾性波装置及びその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163668A (ja) * 1997-11-28 1999-06-18 Matsushita Electric Ind Co Ltd 積層圧電単結晶基板及びそれを用いた圧電デバイス
JP2003198322A (ja) * 2001-12-21 2003-07-11 Kyocera Corp 弾性表面波素子用基板及びそれを用いた弾性表面波素子
JP2003209457A (ja) * 2002-01-15 2003-07-25 Mitsubishi Electric Corp 弾性表面波装置及びその製造方法
JP2006246050A (ja) * 2005-03-03 2006-09-14 Tdk Corp 複合圧電ウエハ及び弾性表面波装置
JP2011182220A (ja) * 2010-03-02 2011-09-15 Panasonic Corp 弾性波共振器及びこれを用いた縦結合二重モードフィルタ、ラダー型フィルタ
JP2012165132A (ja) * 2011-02-04 2012-08-30 Taiyo Yuden Co Ltd 弾性波デバイスの製造方法
WO2013031651A1 (ja) * 2011-09-02 2013-03-07 株式会社村田製作所 弾性波装置及びその製造方法
WO2017013968A1 (ja) * 2015-07-17 2017-01-26 株式会社村田製作所 弾性波装置

Also Published As

Publication number Publication date
JP7464062B2 (ja) 2024-04-09
US20220302897A1 (en) 2022-09-22
KR20220082034A (ko) 2022-06-16
KR102722448B1 (ko) 2024-10-25
CN114830533A (zh) 2022-07-29
WO2021125013A1 (ja) 2021-06-24

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