JPWO2021124386A1 - - Google Patents

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Publication number
JPWO2021124386A1
JPWO2021124386A1 JP2021565158A JP2021565158A JPWO2021124386A1 JP WO2021124386 A1 JPWO2021124386 A1 JP WO2021124386A1 JP 2021565158 A JP2021565158 A JP 2021565158A JP 2021565158 A JP2021565158 A JP 2021565158A JP WO2021124386 A1 JPWO2021124386 A1 JP WO2021124386A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021565158A
Other versions
JP7439129B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021124386A1 publication Critical patent/JPWO2021124386A1/ja
Application granted granted Critical
Publication of JP7439129B2 publication Critical patent/JP7439129B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • G06T1/0007—Image acquisition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021565158A 2019-12-16 2019-12-16 部品装着機 Active JP7439129B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/049135 WO2021124386A1 (ja) 2019-12-16 2019-12-16 部品装着機

Publications (2)

Publication Number Publication Date
JPWO2021124386A1 true JPWO2021124386A1 (ja) 2021-06-24
JP7439129B2 JP7439129B2 (ja) 2024-02-27

Family

ID=76478561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565158A Active JP7439129B2 (ja) 2019-12-16 2019-12-16 部品装着機

Country Status (5)

Country Link
US (1) US20220394893A1 (ja)
EP (1) EP4081010A4 (ja)
JP (1) JP7439129B2 (ja)
CN (1) CN114788436B (ja)
WO (1) WO2021124386A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4110032A4 (en) * 2020-02-21 2023-03-08 Fuji Corporation COMPONENT MOUNTING DEVICE
WO2023188107A1 (ja) * 2022-03-30 2023-10-05 株式会社Fuji 部品装着機および部品装着方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167896A (ja) * 1989-11-28 1991-07-19 Pioneer Electron Corp 画像認識部品装着装置における部品認識方法
JP2016162900A (ja) * 2015-03-02 2016-09-05 富士機械製造株式会社 部品実装機
JP2017150927A (ja) * 2016-02-24 2017-08-31 Juki株式会社 検査装置、実装装置、検査方法及びプログラム
WO2017208325A1 (ja) * 2016-05-31 2017-12-07 富士機械製造株式会社 部品供給システム

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3098847B2 (ja) * 1992-04-24 2000-10-16 松下電器産業株式会社 部品認識方法
JP3161933B2 (ja) * 1995-03-31 2001-04-25 ティーディーケイ株式会社 角チップ部品供給装置
US6584683B2 (en) * 1996-04-18 2003-07-01 Matsushita Electric Industrial Co., Ltd. Mounting electronic component method and apparatus
JP4221630B2 (ja) * 1999-09-02 2009-02-12 ソニー株式会社 部品認識装置及び部品実装機
JP4159762B2 (ja) * 2001-06-21 2008-10-01 松下電器産業株式会社 撮像表示装置
JP4778076B2 (ja) 2009-01-08 2011-09-21 ヤマハ発動機株式会社 部品認識装置および部品移載装置
JP5406682B2 (ja) 2009-11-25 2014-02-05 日東工業株式会社 電子部品供給装置
WO2015186188A1 (ja) * 2014-06-03 2015-12-10 富士機械製造株式会社 ばら部品供給装置および部品実装装置
CN107432111B (zh) * 2015-03-18 2020-05-26 株式会社富士 元件供给装置
JP6528123B2 (ja) 2015-05-15 2019-06-12 パナソニックＩｐマネジメント株式会社 部品取出し装置および部品取出し方法ならびに部品実装装置
EP3300473B1 (en) * 2015-05-21 2024-01-24 FUJI Corporation Component orientation determination data creation device and component orientation determination data creation method
CN104981105B (zh) * 2015-07-09 2018-07-13 广东工业大学 一种快速精确获得元件中心和偏转角度的检测及纠偏方法
WO2018055713A1 (ja) * 2016-09-22 2018-03-29 富士機械製造株式会社 部品供給システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167896A (ja) * 1989-11-28 1991-07-19 Pioneer Electron Corp 画像認識部品装着装置における部品認識方法
JP2016162900A (ja) * 2015-03-02 2016-09-05 富士機械製造株式会社 部品実装機
JP2017150927A (ja) * 2016-02-24 2017-08-31 Juki株式会社 検査装置、実装装置、検査方法及びプログラム
WO2017208325A1 (ja) * 2016-05-31 2017-12-07 富士機械製造株式会社 部品供給システム

Also Published As

Publication number Publication date
EP4081010A1 (en) 2022-10-26
EP4081010A4 (en) 2022-12-28
WO2021124386A1 (ja) 2021-06-24
JP7439129B2 (ja) 2024-02-27
US20220394893A1 (en) 2022-12-08
CN114788436A (zh) 2022-07-22
CN114788436B (zh) 2023-11-10

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