JPWO2021111715A1 - - Google Patents
Info
- Publication number
- JPWO2021111715A1 JPWO2021111715A1 JP2021562471A JP2021562471A JPWO2021111715A1 JP WO2021111715 A1 JPWO2021111715 A1 JP WO2021111715A1 JP 2021562471 A JP2021562471 A JP 2021562471A JP 2021562471 A JP2021562471 A JP 2021562471A JP WO2021111715 A1 JPWO2021111715 A1 JP WO2021111715A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
- H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/652—Cross-sectional shapes
- H10W70/6528—Cross-sectional shapes of the portions that connect to chips, wafers or package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
- H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
- H10W72/255—Materials of outermost layers of multilayered bumps, e.g. material of a coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019219543 | 2019-12-04 | ||
| JP2019219543 | 2019-12-04 | ||
| PCT/JP2020/037159 WO2021111715A1 (ja) | 2019-12-04 | 2020-09-30 | 撮像装置および撮像装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021111715A1 true JPWO2021111715A1 (https=) | 2021-06-10 |
| JP7740990B2 JP7740990B2 (ja) | 2025-09-17 |
Family
ID=76222505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021562471A Active JP7740990B2 (ja) | 2019-12-04 | 2020-09-30 | 撮像装置および撮像装置の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12356753B2 (https=) |
| EP (1) | EP4071795B1 (https=) |
| JP (1) | JP7740990B2 (https=) |
| WO (1) | WO2021111715A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025158775A1 (ja) * | 2024-01-24 | 2025-07-31 | ソニーセミコンダクタソリューションズ株式会社 | 半導体パッケージ、半導体装置、および、半導体パッケージの製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226080A (ja) * | 1988-07-14 | 1990-01-29 | Olympus Optical Co Ltd | 半導体素子 |
| JPH0321859U (https=) * | 1989-07-12 | 1991-03-05 | ||
| JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
| WO2016129409A1 (ja) * | 2015-02-13 | 2016-08-18 | ソニー株式会社 | 撮像素子、製造方法、および電子機器 |
| WO2017094777A1 (ja) * | 2015-12-02 | 2017-06-08 | マイクロモジュールテクノロジー株式会社 | 光学装置及び光学装置の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0321859A (ja) * | 1989-06-20 | 1991-01-30 | Nippondenso Co Ltd | 酸素センサー |
| TWI662670B (zh) * | 2013-08-30 | 2019-06-11 | Xintec Inc. | 電子元件封裝體及其製造方法 |
| CN106033753B (zh) * | 2015-03-12 | 2019-07-12 | 恒劲科技股份有限公司 | 封装模块及其基板结构 |
| US10763286B2 (en) * | 2015-07-23 | 2020-09-01 | Sony Corporation | Semiconductor device, manufacturing method thereof, and electronic apparatus |
| CN106571377A (zh) | 2016-09-20 | 2017-04-19 | 苏州科阳光电科技有限公司 | 图像传感器模组及其制作方法 |
| US10424540B2 (en) * | 2016-10-06 | 2019-09-24 | Xintec Inc. | Chip package and method for forming the same |
| JP2018078274A (ja) | 2016-11-10 | 2018-05-17 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | イメージセンサー装置及びそれを含むイメージセンサーモジュール |
| KR102605618B1 (ko) * | 2016-11-14 | 2023-11-23 | 삼성전자주식회사 | 이미지 센서 패키지 |
| US12356737B2 (en) | 2019-12-04 | 2025-07-08 | Sony Semisconductor Solutions Corporation | Imaging apparatus and manufacturing method of the same |
-
2020
- 2020-09-30 WO PCT/JP2020/037159 patent/WO2021111715A1/ja not_active Ceased
- 2020-09-30 JP JP2021562471A patent/JP7740990B2/ja active Active
- 2020-09-30 US US17/780,293 patent/US12356753B2/en active Active
- 2020-09-30 EP EP20897091.3A patent/EP4071795B1/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226080A (ja) * | 1988-07-14 | 1990-01-29 | Olympus Optical Co Ltd | 半導体素子 |
| JPH0321859U (https=) * | 1989-07-12 | 1991-03-05 | ||
| JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
| WO2016129409A1 (ja) * | 2015-02-13 | 2016-08-18 | ソニー株式会社 | 撮像素子、製造方法、および電子機器 |
| WO2017094777A1 (ja) * | 2015-12-02 | 2017-06-08 | マイクロモジュールテクノロジー株式会社 | 光学装置及び光学装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7740990B2 (ja) | 2025-09-17 |
| US20220415953A1 (en) | 2022-12-29 |
| EP4071795A4 (en) | 2023-01-11 |
| US12356753B2 (en) | 2025-07-08 |
| EP4071795B1 (en) | 2026-04-29 |
| WO2021111715A1 (ja) | 2021-06-10 |
| EP4071795A1 (en) | 2022-10-12 |
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