JPWO2021106921A1 - - Google Patents

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Publication number
JPWO2021106921A1
JPWO2021106921A1 JP2021561447A JP2021561447A JPWO2021106921A1 JP WO2021106921 A1 JPWO2021106921 A1 JP WO2021106921A1 JP 2021561447 A JP2021561447 A JP 2021561447A JP 2021561447 A JP2021561447 A JP 2021561447A JP WO2021106921 A1 JPWO2021106921 A1 JP WO2021106921A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021561447A
Other languages
Japanese (ja)
Other versions
JP7466568B2 (ja
JPWO2021106921A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021106921A1 publication Critical patent/JPWO2021106921A1/ja
Publication of JPWO2021106921A5 publication Critical patent/JPWO2021106921A5/ja
Application granted granted Critical
Publication of JP7466568B2 publication Critical patent/JP7466568B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
    • H03H9/02023—Characteristics of piezoelectric layers, e.g. cutting angles consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02062—Details relating to the vibration mode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0504—Holders or supports for bulk acoustic wave devices
    • H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • H03H9/0519—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2021561447A 2019-11-26 2020-11-25 水晶素子の製造方法 Active JP7466568B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019212985 2019-11-26
JP2019212985 2019-11-26
PCT/JP2020/043779 WO2021106921A1 (ja) 2019-11-26 2020-11-25 水晶素子、水晶デバイス及び電子機器並びに水晶素子の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021106921A1 true JPWO2021106921A1 (https=) 2021-06-03
JPWO2021106921A5 JPWO2021106921A5 (https=) 2022-07-19
JP7466568B2 JP7466568B2 (ja) 2024-04-12

Family

ID=76128691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561447A Active JP7466568B2 (ja) 2019-11-26 2020-11-25 水晶素子の製造方法

Country Status (4)

Country Link
US (1) US20230006124A1 (https=)
JP (1) JP7466568B2 (https=)
CN (1) CN114788176B (https=)
WO (1) WO2021106921A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006114936A1 (ja) * 2005-04-18 2006-11-02 Daishinku Corporation 圧電振動片及び圧電振動デバイス
JP2012119856A (ja) * 2010-11-30 2012-06-21 Seiko Epson Corp 圧電振動片、圧電振動子、電子デバイス
JP2018056860A (ja) * 2016-09-30 2018-04-05 京セラ株式会社 水晶素子、水晶デバイスおよび水晶素子の製造方法
JP2018164193A (ja) * 2017-03-27 2018-10-18 京セラクリスタルデバイス株式会社 水晶素子および水晶デバイス

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004165743A (ja) * 2002-11-08 2004-06-10 Toyo Commun Equip Co Ltd 圧電基板、圧電振動素子、圧電振動子、圧電発振器、圧電基板ウェハ、圧電基板ウェハの構造、及び製造方法
JP5593979B2 (ja) * 2009-11-11 2014-09-24 セイコーエプソン株式会社 振動片、振動子、発振器、センサー及び電子機器
JP5591053B2 (ja) * 2010-10-01 2014-09-17 セイコーエプソン株式会社 振動素子、振動子、発振器及びウェハ
US8963402B2 (en) * 2010-11-30 2015-02-24 Seiko Epson Corporation Piezoelectric vibrator element, piezoelectric module, and electronic device
JP2013046085A (ja) * 2011-08-22 2013-03-04 Seiko Epson Corp 圧電振動素子、圧電振動子、電子デバイス、及び電子機器
JP2013110658A (ja) * 2011-11-24 2013-06-06 Nippon Dempa Kogyo Co Ltd 圧電振動片、及び圧電デバイス
JP6386298B2 (ja) * 2014-08-28 2018-09-05 京セラ株式会社 水晶素子の製造方法
JP6787735B2 (ja) * 2016-09-30 2020-11-18 京セラ株式会社 水晶素子および水晶デバイス

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006114936A1 (ja) * 2005-04-18 2006-11-02 Daishinku Corporation 圧電振動片及び圧電振動デバイス
JP2012119856A (ja) * 2010-11-30 2012-06-21 Seiko Epson Corp 圧電振動片、圧電振動子、電子デバイス
JP2018056860A (ja) * 2016-09-30 2018-04-05 京セラ株式会社 水晶素子、水晶デバイスおよび水晶素子の製造方法
JP2018164193A (ja) * 2017-03-27 2018-10-18 京セラクリスタルデバイス株式会社 水晶素子および水晶デバイス

Also Published As

Publication number Publication date
US20230006124A1 (en) 2023-01-05
WO2021106921A1 (ja) 2021-06-03
JP7466568B2 (ja) 2024-04-12
CN114788176B (zh) 2025-08-22
CN114788176A (zh) 2022-07-22

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