JPWO2021106921A1 - - Google Patents
Info
- Publication number
- JPWO2021106921A1 JPWO2021106921A1 JP2021561447A JP2021561447A JPWO2021106921A1 JP WO2021106921 A1 JPWO2021106921 A1 JP WO2021106921A1 JP 2021561447 A JP2021561447 A JP 2021561447A JP 2021561447 A JP2021561447 A JP 2021561447A JP WO2021106921 A1 JPWO2021106921 A1 JP WO2021106921A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
- H03H9/02023—Characteristics of piezoelectric layers, e.g. cutting angles consisting of quartz
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02062—Details relating to the vibration mode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
- H03H9/0519—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019212985 | 2019-11-26 | ||
JP2019212985 | 2019-11-26 | ||
PCT/JP2020/043779 WO2021106921A1 (ja) | 2019-11-26 | 2020-11-25 | 水晶素子、水晶デバイス及び電子機器並びに水晶素子の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021106921A1 true JPWO2021106921A1 (ja) | 2021-06-03 |
JPWO2021106921A5 JPWO2021106921A5 (ja) | 2022-07-19 |
JP7466568B2 JP7466568B2 (ja) | 2024-04-12 |
Family
ID=76128691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021561447A Active JP7466568B2 (ja) | 2019-11-26 | 2020-11-25 | 水晶素子の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230006124A1 (ja) |
JP (1) | JP7466568B2 (ja) |
CN (1) | CN114788176A (ja) |
WO (1) | WO2021106921A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006114936A1 (ja) * | 2005-04-18 | 2006-11-02 | Daishinku Corporation | 圧電振動片及び圧電振動デバイス |
JP2018056860A (ja) * | 2016-09-30 | 2018-04-05 | 京セラ株式会社 | 水晶素子、水晶デバイスおよび水晶素子の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004165743A (ja) * | 2002-11-08 | 2004-06-10 | Toyo Commun Equip Co Ltd | 圧電基板、圧電振動素子、圧電振動子、圧電発振器、圧電基板ウェハ、圧電基板ウェハの構造、及び製造方法 |
JP5674241B2 (ja) | 2010-11-30 | 2015-02-25 | セイコーエプソン株式会社 | 圧電振動片、圧電振動子、電子デバイス |
JP6853085B2 (ja) | 2017-03-27 | 2021-03-31 | 京セラ株式会社 | 水晶素子および水晶デバイス |
-
2020
- 2020-11-25 WO PCT/JP2020/043779 patent/WO2021106921A1/ja active Application Filing
- 2020-11-25 US US17/779,613 patent/US20230006124A1/en active Pending
- 2020-11-25 JP JP2021561447A patent/JP7466568B2/ja active Active
- 2020-11-25 CN CN202080080367.2A patent/CN114788176A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006114936A1 (ja) * | 2005-04-18 | 2006-11-02 | Daishinku Corporation | 圧電振動片及び圧電振動デバイス |
JP2018056860A (ja) * | 2016-09-30 | 2018-04-05 | 京セラ株式会社 | 水晶素子、水晶デバイスおよび水晶素子の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20230006124A1 (en) | 2023-01-05 |
WO2021106921A1 (ja) | 2021-06-03 |
CN114788176A (zh) | 2022-07-22 |
JP7466568B2 (ja) | 2024-04-12 |
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