JPWO2021106721A1 - - Google Patents
Info
- Publication number
- JPWO2021106721A1 JPWO2021106721A1 JP2021561348A JP2021561348A JPWO2021106721A1 JP WO2021106721 A1 JPWO2021106721 A1 JP WO2021106721A1 JP 2021561348 A JP2021561348 A JP 2021561348A JP 2021561348 A JP2021561348 A JP 2021561348A JP WO2021106721 A1 JPWO2021106721 A1 JP WO2021106721A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019213373 | 2019-11-26 | ||
JP2019213373 | 2019-11-26 | ||
PCT/JP2020/043051 WO2021106721A1 (ja) | 2019-11-26 | 2020-11-18 | プリフォームはんだおよびそれを用いた接合方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021106721A1 true JPWO2021106721A1 (ja) | 2021-06-03 |
JPWO2021106721A5 JPWO2021106721A5 (ja) | 2022-08-10 |
JP7186899B2 JP7186899B2 (ja) | 2022-12-09 |
Family
ID=76128658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021561348A Active JP7186899B2 (ja) | 2019-11-26 | 2020-11-18 | プリフォームはんだおよびそれを用いた接合方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230112020A1 (ja) |
JP (1) | JP7186899B2 (ja) |
DE (1) | DE112020004685B4 (ja) |
WO (1) | WO2021106721A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0846353A (ja) * | 1994-07-26 | 1996-02-16 | Fujitsu Ltd | 部品の接合方法並びにこれに使用される接合部材及び基板 |
US5573859A (en) * | 1995-09-05 | 1996-11-12 | Motorola, Inc. | Auto-regulating solder composition |
JP2849208B2 (ja) * | 1990-01-16 | 1999-01-20 | メトカル・インコーポレーテッド | 誘導加熱によるはんだ付け方法、装置及び組成物 |
US20110210283A1 (en) * | 2010-02-24 | 2011-09-01 | Ainissa G. Ramirez | Low melting temperature alloys with magnetic dispersions |
CN108608130A (zh) * | 2018-05-02 | 2018-10-02 | 大连圣多教育咨询有限公司 | 一种无铅复合焊料球及其制备方法和应用 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2362893A (en) * | 1942-04-04 | 1944-11-14 | Metals & Controls Corp | Solder |
US4035547A (en) * | 1974-02-26 | 1977-07-12 | William C. Heller | Bonding element having separate heating and agitating particles |
JPH07169908A (ja) | 1991-05-18 | 1995-07-04 | Fuji Electric Co Ltd | はんだ付け方法、半導体装置の製造方法及び複合はんだ板 |
US5346775A (en) * | 1993-02-22 | 1994-09-13 | At&T Laboratories | Article comprising solder with improved mechanical properties |
JP3335896B2 (ja) * | 1997-12-26 | 2002-10-21 | 株式会社東芝 | ハンダ材及びハンダ材の製造方法 |
US6519500B1 (en) * | 1999-09-16 | 2003-02-11 | Solidica, Inc. | Ultrasonic object consolidation |
US6186392B1 (en) * | 2000-01-21 | 2001-02-13 | Micron Technology, Inc. | Method and system for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls |
US7361412B2 (en) * | 2000-05-02 | 2008-04-22 | Johns Hopkins University | Nanostructured soldered or brazed joints made with reactive multilayer foils |
US6736942B2 (en) * | 2000-05-02 | 2004-05-18 | Johns Hopkins University | Freestanding reactive multilayer foils |
JP2004174522A (ja) * | 2002-11-25 | 2004-06-24 | Hitachi Ltd | 複合はんだ、その製造方法および電子機器 |
JP2006513041A (ja) * | 2002-12-05 | 2006-04-20 | サーフェクト テクノロジーズ インク. | コーティングされた磁性粒子及びその応用 |
CA2529560C (en) * | 2003-07-07 | 2010-08-17 | Ishikawajima-Harima Heavy Industries Co., Ltd. | Brazing filler metal sheet and method for production thereof |
WO2008148088A1 (en) * | 2007-05-25 | 2008-12-04 | Lucas Milhaupt, Inc. | Brazing material |
US7902060B2 (en) * | 2008-12-23 | 2011-03-08 | Intel Corporation | Attachment using magnetic particle based solder composites |
US9186742B2 (en) * | 2009-01-30 | 2015-11-17 | General Electric Company | Microwave brazing process and assemblies and materials therefor |
US8348139B2 (en) * | 2010-03-09 | 2013-01-08 | Indium Corporation | Composite solder alloy preform |
US9536851B2 (en) * | 2014-09-05 | 2017-01-03 | Infineon Technologies Ag | Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement |
US10087118B2 (en) * | 2014-11-28 | 2018-10-02 | The Johns Hopkins University | Reactive composite foil |
US9969000B2 (en) * | 2015-07-08 | 2018-05-15 | General Electric Company | Additive manufacturing of joining preforms |
WO2017035442A1 (en) * | 2015-08-26 | 2017-03-02 | Arizona Board Of Regents On Behalf Of Arizona State University | Systems and methods for additive manufacturing utilizing localized ultrasound-enhanced material flow and fusioning |
JP7241379B2 (ja) | 2018-02-08 | 2023-03-17 | 国立研究開発法人産業技術総合研究所 | はんだ実装方法及びマイクロ波加熱装置 |
EP3822005A1 (en) * | 2019-11-14 | 2021-05-19 | Rolls-Royce Corporation | Fused filament fabrication of braze alloys |
US20220402057A1 (en) * | 2019-11-26 | 2022-12-22 | Senju Metal Industry Co., Ltd. | Magnetic-field melting solder, and joining method in which same is used |
-
2020
- 2020-11-18 DE DE112020004685.0T patent/DE112020004685B4/de active Active
- 2020-11-18 JP JP2021561348A patent/JP7186899B2/ja active Active
- 2020-11-18 US US17/779,803 patent/US20230112020A1/en active Pending
- 2020-11-18 WO PCT/JP2020/043051 patent/WO2021106721A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2849208B2 (ja) * | 1990-01-16 | 1999-01-20 | メトカル・インコーポレーテッド | 誘導加熱によるはんだ付け方法、装置及び組成物 |
JPH0846353A (ja) * | 1994-07-26 | 1996-02-16 | Fujitsu Ltd | 部品の接合方法並びにこれに使用される接合部材及び基板 |
US5573859A (en) * | 1995-09-05 | 1996-11-12 | Motorola, Inc. | Auto-regulating solder composition |
US20110210283A1 (en) * | 2010-02-24 | 2011-09-01 | Ainissa G. Ramirez | Low melting temperature alloys with magnetic dispersions |
CN108608130A (zh) * | 2018-05-02 | 2018-10-02 | 大连圣多教育咨询有限公司 | 一种无铅复合焊料球及其制备方法和应用 |
Also Published As
Publication number | Publication date |
---|---|
DE112020004685T5 (de) | 2022-08-25 |
US20230112020A1 (en) | 2023-04-13 |
DE112020004685B4 (de) | 2024-07-25 |
JP7186899B2 (ja) | 2022-12-09 |
WO2021106721A1 (ja) | 2021-06-03 |
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