JPWO2021106721A1 - - Google Patents

Info

Publication number
JPWO2021106721A1
JPWO2021106721A1 JP2021561348A JP2021561348A JPWO2021106721A1 JP WO2021106721 A1 JPWO2021106721 A1 JP WO2021106721A1 JP 2021561348 A JP2021561348 A JP 2021561348A JP 2021561348 A JP2021561348 A JP 2021561348A JP WO2021106721 A1 JPWO2021106721 A1 JP WO2021106721A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021561348A
Other versions
JP7186899B2 (ja
JPWO2021106721A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021106721A1 publication Critical patent/JPWO2021106721A1/ja
Publication of JPWO2021106721A5 publication Critical patent/JPWO2021106721A5/ja
Application granted granted Critical
Publication of JP7186899B2 publication Critical patent/JP7186899B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2021561348A 2019-11-26 2020-11-18 プリフォームはんだおよびそれを用いた接合方法 Active JP7186899B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019213373 2019-11-26
JP2019213373 2019-11-26
PCT/JP2020/043051 WO2021106721A1 (ja) 2019-11-26 2020-11-18 プリフォームはんだおよびそれを用いた接合方法

Publications (3)

Publication Number Publication Date
JPWO2021106721A1 true JPWO2021106721A1 (ja) 2021-06-03
JPWO2021106721A5 JPWO2021106721A5 (ja) 2022-08-10
JP7186899B2 JP7186899B2 (ja) 2022-12-09

Family

ID=76128658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561348A Active JP7186899B2 (ja) 2019-11-26 2020-11-18 プリフォームはんだおよびそれを用いた接合方法

Country Status (4)

Country Link
US (1) US20230112020A1 (ja)
JP (1) JP7186899B2 (ja)
DE (1) DE112020004685B4 (ja)
WO (1) WO2021106721A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846353A (ja) * 1994-07-26 1996-02-16 Fujitsu Ltd 部品の接合方法並びにこれに使用される接合部材及び基板
US5573859A (en) * 1995-09-05 1996-11-12 Motorola, Inc. Auto-regulating solder composition
JP2849208B2 (ja) * 1990-01-16 1999-01-20 メトカル・インコーポレーテッド 誘導加熱によるはんだ付け方法、装置及び組成物
US20110210283A1 (en) * 2010-02-24 2011-09-01 Ainissa G. Ramirez Low melting temperature alloys with magnetic dispersions
CN108608130A (zh) * 2018-05-02 2018-10-02 大连圣多教育咨询有限公司 一种无铅复合焊料球及其制备方法和应用

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2362893A (en) * 1942-04-04 1944-11-14 Metals & Controls Corp Solder
US4035547A (en) * 1974-02-26 1977-07-12 William C. Heller Bonding element having separate heating and agitating particles
JPH07169908A (ja) 1991-05-18 1995-07-04 Fuji Electric Co Ltd はんだ付け方法、半導体装置の製造方法及び複合はんだ板
US5346775A (en) * 1993-02-22 1994-09-13 At&T Laboratories Article comprising solder with improved mechanical properties
JP3335896B2 (ja) * 1997-12-26 2002-10-21 株式会社東芝 ハンダ材及びハンダ材の製造方法
US6519500B1 (en) * 1999-09-16 2003-02-11 Solidica, Inc. Ultrasonic object consolidation
US6186392B1 (en) * 2000-01-21 2001-02-13 Micron Technology, Inc. Method and system for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls
US7361412B2 (en) * 2000-05-02 2008-04-22 Johns Hopkins University Nanostructured soldered or brazed joints made with reactive multilayer foils
US6736942B2 (en) * 2000-05-02 2004-05-18 Johns Hopkins University Freestanding reactive multilayer foils
JP2004174522A (ja) * 2002-11-25 2004-06-24 Hitachi Ltd 複合はんだ、その製造方法および電子機器
JP2006513041A (ja) * 2002-12-05 2006-04-20 サーフェクト テクノロジーズ インク． コーティングされた磁性粒子及びその応用
CA2529560C (en) * 2003-07-07 2010-08-17 Ishikawajima-Harima Heavy Industries Co., Ltd. Brazing filler metal sheet and method for production thereof
WO2008148088A1 (en) * 2007-05-25 2008-12-04 Lucas Milhaupt, Inc. Brazing material
US7902060B2 (en) * 2008-12-23 2011-03-08 Intel Corporation Attachment using magnetic particle based solder composites
US9186742B2 (en) * 2009-01-30 2015-11-17 General Electric Company Microwave brazing process and assemblies and materials therefor
US8348139B2 (en) * 2010-03-09 2013-01-08 Indium Corporation Composite solder alloy preform
US9536851B2 (en) * 2014-09-05 2017-01-03 Infineon Technologies Ag Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement
US10087118B2 (en) * 2014-11-28 2018-10-02 The Johns Hopkins University Reactive composite foil
US9969000B2 (en) * 2015-07-08 2018-05-15 General Electric Company Additive manufacturing of joining preforms
WO2017035442A1 (en) * 2015-08-26 2017-03-02 Arizona Board Of Regents On Behalf Of Arizona State University Systems and methods for additive manufacturing utilizing localized ultrasound-enhanced material flow and fusioning
JP7241379B2 (ja) 2018-02-08 2023-03-17 国立研究開発法人産業技術総合研究所 はんだ実装方法及びマイクロ波加熱装置
EP3822005A1 (en) * 2019-11-14 2021-05-19 Rolls-Royce Corporation Fused filament fabrication of braze alloys
US20220402057A1 (en) * 2019-11-26 2022-12-22 Senju Metal Industry Co., Ltd. Magnetic-field melting solder, and joining method in which same is used

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2849208B2 (ja) * 1990-01-16 1999-01-20 メトカル・インコーポレーテッド 誘導加熱によるはんだ付け方法、装置及び組成物
JPH0846353A (ja) * 1994-07-26 1996-02-16 Fujitsu Ltd 部品の接合方法並びにこれに使用される接合部材及び基板
US5573859A (en) * 1995-09-05 1996-11-12 Motorola, Inc. Auto-regulating solder composition
US20110210283A1 (en) * 2010-02-24 2011-09-01 Ainissa G. Ramirez Low melting temperature alloys with magnetic dispersions
CN108608130A (zh) * 2018-05-02 2018-10-02 大连圣多教育咨询有限公司 一种无铅复合焊料球及其制备方法和应用

Also Published As

Publication number Publication date
DE112020004685T5 (de) 2022-08-25
US20230112020A1 (en) 2023-04-13
DE112020004685B4 (de) 2024-07-25
JP7186899B2 (ja) 2022-12-09
WO2021106721A1 (ja) 2021-06-03

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