JPWO2021105982A5 - - Google Patents

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JPWO2021105982A5
JPWO2021105982A5 JP2022529088A JP2022529088A JPWO2021105982A5 JP WO2021105982 A5 JPWO2021105982 A5 JP WO2021105982A5 JP 2022529088 A JP2022529088 A JP 2022529088A JP 2022529088 A JP2022529088 A JP 2022529088A JP WO2021105982 A5 JPWO2021105982 A5 JP WO2021105982A5
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Japan
Prior art keywords
polishing
waveguide
alignment sensor
optical alignment
collimated light
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JP2022529088A
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Japanese (ja)
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JP2023503277A (ja
JP7433674B2 (ja
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Priority claimed from PCT/IL2020/051189 external-priority patent/WO2021105982A1/en
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Priority to JP2024013343A priority Critical patent/JP2024059636A/ja
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JP2022529088A 2019-11-25 2020-11-17 導波路の表面を研磨する方法 Active JP7433674B2 (ja)

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JP2024013343A JP2024059636A (ja) 2019-11-25 2024-01-31 導波路の表面を研磨する方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962939708P 2019-11-25 2019-11-25
US62/939,708 2019-11-25
PCT/IL2020/051189 WO2021105982A1 (en) 2019-11-25 2020-11-17 Method of polishing a surface of a waveguide

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JP2024013343A Division JP2024059636A (ja) 2019-11-25 2024-01-31 導波路の表面を研磨する方法

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JP2023503277A JP2023503277A (ja) 2023-01-27
JPWO2021105982A5 true JPWO2021105982A5 (de) 2023-09-05
JP7433674B2 JP7433674B2 (ja) 2024-02-20

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JP2022529088A Active JP7433674B2 (ja) 2019-11-25 2020-11-17 導波路の表面を研磨する方法
JP2024013343A Pending JP2024059636A (ja) 2019-11-25 2024-01-31 導波路の表面を研磨する方法

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US (2) US11667004B2 (de)
EP (1) EP4041491B1 (de)
JP (2) JP7433674B2 (de)
KR (2) KR102622406B1 (de)
CN (2) CN117943933A (de)
IL (1) IL293237B2 (de)
WO (1) WO2021105982A1 (de)

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