JPWO2021090721A1 - - Google Patents

Info

Publication number
JPWO2021090721A1
JPWO2021090721A1 JP2021554897A JP2021554897A JPWO2021090721A1 JP WO2021090721 A1 JPWO2021090721 A1 JP WO2021090721A1 JP 2021554897 A JP2021554897 A JP 2021554897A JP 2021554897 A JP2021554897 A JP 2021554897A JP WO2021090721 A1 JPWO2021090721 A1 JP WO2021090721A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021554897A
Other languages
Japanese (ja)
Other versions
JP7361130B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021090721A1 publication Critical patent/JPWO2021090721A1/ja
Application granted granted Critical
Publication of JP7361130B2 publication Critical patent/JP7361130B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B05B13/0228—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being rotative
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B16/00—Spray booths
    • B05B16/20—Arrangements for spraying in combination with other operations, e.g. drying; Arrangements enabling a combination of spraying operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2021554897A 2019-11-07 2020-10-26 基板処理装置、基板処理方法、及び記憶媒体 Active JP7361130B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019202235 2019-11-07
JP2019202235 2019-11-07
PCT/JP2020/040107 WO2021090721A1 (ja) 2019-11-07 2020-10-26 基板処理装置、基板処理方法、及び記憶媒体

Publications (2)

Publication Number Publication Date
JPWO2021090721A1 true JPWO2021090721A1 (ko) 2021-05-14
JP7361130B2 JP7361130B2 (ja) 2023-10-13

Family

ID=75848590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554897A Active JP7361130B2 (ja) 2019-11-07 2020-10-26 基板処理装置、基板処理方法、及び記憶媒体

Country Status (4)

Country Link
JP (1) JP7361130B2 (ko)
KR (1) KR20220093344A (ko)
CN (1) CN114616056B (ko)
WO (1) WO2021090721A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115346882B (zh) * 2022-10-17 2023-03-17 芯达半导体设备(苏州)有限公司 一种铟柱起球控制方法、装置和设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09267067A (ja) * 1996-01-29 1997-10-14 Dainippon Screen Mfg Co Ltd 処理液供給方法およびその装置
JPH10328608A (ja) * 1997-05-30 1998-12-15 Dainippon Screen Mfg Co Ltd 処理液供給装置
JP2001126975A (ja) * 1999-10-26 2001-05-11 Dainippon Screen Mfg Co Ltd 基板塗布装置
JP2003145017A (ja) * 2001-11-13 2003-05-20 Tokyo Electron Ltd 塗布処理方法および塗布処理装置
JP2003347206A (ja) * 2002-03-19 2003-12-05 Tokyo Electron Ltd 塗布処理方法および塗布処理装置
JP2016134566A (ja) * 2015-01-21 2016-07-25 東京エレクトロン株式会社 液処理方法、液処理装置及び記憶媒体
JP2019165241A (ja) * 2019-05-16 2019-09-26 東京エレクトロン株式会社 処理装置、処理方法および記憶媒体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3410342B2 (ja) * 1997-01-31 2003-05-26 東京エレクトロン株式会社 塗布装置
JP3329720B2 (ja) * 1998-01-19 2002-09-30 東京エレクトロン株式会社 塗布装置
JP2008251890A (ja) 2007-03-30 2008-10-16 Dainippon Screen Mfg Co Ltd 基板処理装置
US9095865B2 (en) * 2011-11-16 2015-08-04 Csl Silicones Inc. Mobile coating system for elastomeric materials
KR102414893B1 (ko) * 2016-12-02 2022-06-30 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP6925872B2 (ja) * 2017-05-31 2021-08-25 東京エレクトロン株式会社 基板液処理装置、処理液供給方法及び記憶媒体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09267067A (ja) * 1996-01-29 1997-10-14 Dainippon Screen Mfg Co Ltd 処理液供給方法およびその装置
JPH10328608A (ja) * 1997-05-30 1998-12-15 Dainippon Screen Mfg Co Ltd 処理液供給装置
JP2001126975A (ja) * 1999-10-26 2001-05-11 Dainippon Screen Mfg Co Ltd 基板塗布装置
JP2003145017A (ja) * 2001-11-13 2003-05-20 Tokyo Electron Ltd 塗布処理方法および塗布処理装置
JP2003347206A (ja) * 2002-03-19 2003-12-05 Tokyo Electron Ltd 塗布処理方法および塗布処理装置
JP2016134566A (ja) * 2015-01-21 2016-07-25 東京エレクトロン株式会社 液処理方法、液処理装置及び記憶媒体
JP2019165241A (ja) * 2019-05-16 2019-09-26 東京エレクトロン株式会社 処理装置、処理方法および記憶媒体

Also Published As

Publication number Publication date
WO2021090721A1 (ja) 2021-05-14
CN114616056A (zh) 2022-06-10
CN114616056B (zh) 2024-01-19
JP7361130B2 (ja) 2023-10-13
KR20220093344A (ko) 2022-07-05

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