JPWO2021090542A1 - - Google Patents

Info

Publication number
JPWO2021090542A1
JPWO2021090542A1 JP2021554819A JP2021554819A JPWO2021090542A1 JP WO2021090542 A1 JPWO2021090542 A1 JP WO2021090542A1 JP 2021554819 A JP2021554819 A JP 2021554819A JP 2021554819 A JP2021554819 A JP 2021554819A JP WO2021090542 A1 JPWO2021090542 A1 JP WO2021090542A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021554819A
Other versions
JP7188615B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021090542A1 publication Critical patent/JPWO2021090542A1/ja
Application granted granted Critical
Publication of JP7188615B2 publication Critical patent/JP7188615B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/0457—Storage devices mechanical with suspended load carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021554819A 2019-11-05 2020-07-27 搬送車システム Active JP7188615B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019200737 2019-11-05
JP2019200737 2019-11-05
PCT/JP2020/028768 WO2021090542A1 (ja) 2019-11-05 2020-07-27 搬送車システム

Publications (2)

Publication Number Publication Date
JPWO2021090542A1 true JPWO2021090542A1 (ja) 2021-05-14
JP7188615B2 JP7188615B2 (ja) 2022-12-13

Family

ID=75848329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554819A Active JP7188615B2 (ja) 2019-11-05 2020-07-27 搬送車システム

Country Status (6)

Country Link
US (1) US20220375774A1 (ja)
EP (1) EP4057325A4 (ja)
JP (1) JP7188615B2 (ja)
KR (1) KR102627684B1 (ja)
CN (1) CN114365271A (ja)
WO (1) WO2021090542A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196856A (ja) * 1985-02-27 1986-09-01 株式会社ダイフク 搬送車
JPH05310323A (ja) * 1991-03-15 1993-11-22 Shinko Electric Co Ltd クリーンルーム用の無人搬送装置
JP2015533026A (ja) * 2012-10-31 2015-11-16 株式会社ダイフク ウェハパージ可能な天井保管装置（ａｐｐａｒａｔｕｓｆｏｒｓｔｏｃｋｉｎｇａｎｄｐｕｒｇｉｎｇｗａｆｅｒａｔｃｅｉｌｉｎｇ）
JP2016096192A (ja) * 2014-11-12 2016-05-26 株式会社ダイフク 物品搬送設備
JP2017159975A (ja) * 2016-03-07 2017-09-14 株式会社ダイフク 容器搬送設備

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5700119B2 (ja) * 2011-05-25 2015-04-15 村田機械株式会社 ロードポート装置、搬送システム、及びコンテナ搬出方法
KR101822009B1 (ko) * 2014-02-07 2018-03-08 무라다기카이가부시끼가이샤 퍼지 장치 및 퍼지 방법
KR20170058393A (ko) * 2014-09-25 2017-05-26 무라다기카이가부시끼가이샤 퍼지 장치 및 퍼지 방법
KR101691607B1 (ko) * 2015-08-26 2016-12-30 (주)젠스엠 퍼지 기능을 갖는 웨이퍼 용기 이송 장치
US10643877B2 (en) * 2015-08-27 2020-05-05 Murata Machinery, Ltd. Retrieving device and storing device
WO2017212841A1 (ja) * 2016-06-08 2017-12-14 村田機械株式会社 容器保管装置及び容器保管方法
KR101841925B1 (ko) 2017-07-28 2018-03-26 크린팩토메이션 주식회사 웨이퍼 내장 풉에 대한 지상 퍼지 스테이션
KR102391970B1 (ko) * 2017-09-08 2022-04-28 무라다기카이가부시끼가이샤 보관 시스템과 보관 시스템에서의 퍼지 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61196856A (ja) * 1985-02-27 1986-09-01 株式会社ダイフク 搬送車
JPH05310323A (ja) * 1991-03-15 1993-11-22 Shinko Electric Co Ltd クリーンルーム用の無人搬送装置
JP2015533026A (ja) * 2012-10-31 2015-11-16 株式会社ダイフク ウェハパージ可能な天井保管装置（ａｐｐａｒａｔｕｓｆｏｒｓｔｏｃｋｉｎｇａｎｄｐｕｒｇｉｎｇｗａｆｅｒａｔｃｅｉｌｉｎｇ）
JP2016096192A (ja) * 2014-11-12 2016-05-26 株式会社ダイフク 物品搬送設備
JP2017159975A (ja) * 2016-03-07 2017-09-14 株式会社ダイフク 容器搬送設備

Also Published As

Publication number Publication date
CN114365271A (zh) 2022-04-15
EP4057325A1 (en) 2022-09-14
US20220375774A1 (en) 2022-11-24
JP7188615B2 (ja) 2022-12-13
WO2021090542A1 (ja) 2021-05-14
EP4057325A4 (en) 2023-11-22
TW202120415A (zh) 2021-06-01
KR20220050211A (ko) 2022-04-22
KR102627684B1 (ko) 2024-01-23

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