JPWO2021060562A1 - - Google Patents
Info
- Publication number
- JPWO2021060562A1 JPWO2021060562A1 JP2021548481A JP2021548481A JPWO2021060562A1 JP WO2021060562 A1 JPWO2021060562 A1 JP WO2021060562A1 JP 2021548481 A JP2021548481 A JP 2021548481A JP 2021548481 A JP2021548481 A JP 2021548481A JP WO2021060562 A1 JPWO2021060562 A1 JP WO2021060562A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019177171 | 2019-09-27 | ||
PCT/JP2020/036722 WO2021060562A1 (ja) | 2019-09-27 | 2020-09-28 | 硬化性組成物、硬化物、及び、硬化性組成物の使用方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021060562A1 true JPWO2021060562A1 (zh) | 2021-04-01 |
Family
ID=75165288
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021548481A Pending JPWO2021060562A1 (zh) | 2019-09-27 | 2020-09-28 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2021060562A1 (zh) |
KR (1) | KR20220068952A (zh) |
CN (1) | CN114402036B (zh) |
TW (1) | TW202120601A (zh) |
WO (1) | WO2021060562A1 (zh) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3272002B2 (ja) * | 1991-09-02 | 2002-04-08 | 昭和電工株式会社 | ポリオルガノシルセスキオキサンの製造方法 |
JP4734832B2 (ja) | 2003-05-14 | 2011-07-27 | ナガセケムテックス株式会社 | 光素子用封止材 |
JP2005263869A (ja) | 2004-03-16 | 2005-09-29 | Nagase Chemtex Corp | 光半導体封止用樹脂組成物 |
JP2006328231A (ja) | 2005-05-26 | 2006-12-07 | Nagase Chemtex Corp | 光素子用封止樹脂組成物 |
JP2010034414A (ja) * | 2008-07-30 | 2010-02-12 | Sekisui Chem Co Ltd | 熱硬化性ソルダーレジスト用組成物及び電子回路基板 |
JP5561189B2 (ja) * | 2011-01-27 | 2014-07-30 | Jsr株式会社 | 感放射線性組成物、硬化膜及びその形成方法 |
JP2013087215A (ja) * | 2011-10-19 | 2013-05-13 | Sumitomo Seika Chem Co Ltd | 紫外線吸収部材用組成物およびこれを用いた紫外線吸収部材 |
US9487627B2 (en) * | 2012-10-30 | 2016-11-08 | Lintec Corporation | Curable polysilsesquioxane compound, method for producing same, curable composition, cured product, and method for using curable composition or the like |
TWI678387B (zh) * | 2014-08-26 | 2019-12-01 | 日商琳得科股份有限公司 | 硬化性組合物、硬化性組合物之製造方法、硬化物、硬化性組合物之使用方法以及光裝置 |
TWI751997B (zh) * | 2015-12-22 | 2022-01-11 | 日商琳得科股份有限公司 | 硬化性組合物、硬化性組合物的製造方法、硬化物、硬化性組合物的使用方法以及光裝置 |
JP2019119804A (ja) * | 2018-01-05 | 2019-07-22 | スリーエム イノベイティブ プロパティズ カンパニー | 硬化性組成物及び光学部材 |
-
2020
- 2020-09-28 TW TW109133642A patent/TW202120601A/zh unknown
- 2020-09-28 KR KR1020217027785A patent/KR20220068952A/ko unknown
- 2020-09-28 WO PCT/JP2020/036722 patent/WO2021060562A1/ja active Application Filing
- 2020-09-28 JP JP2021548481A patent/JPWO2021060562A1/ja active Pending
- 2020-09-28 CN CN202080067177.7A patent/CN114402036B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
WO2021060562A1 (ja) | 2021-04-01 |
CN114402036B (zh) | 2023-11-21 |
TW202120601A (zh) | 2021-06-01 |
KR20220068952A (ko) | 2022-05-26 |
CN114402036A (zh) | 2022-04-26 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230630 |