JPWO2021039053A1 - - Google Patents
Info
- Publication number
- JPWO2021039053A1 JPWO2021039053A1 JP2021542037A JP2021542037A JPWO2021039053A1 JP WO2021039053 A1 JPWO2021039053 A1 JP WO2021039053A1 JP 2021542037 A JP2021542037 A JP 2021542037A JP 2021542037 A JP2021542037 A JP 2021542037A JP WO2021039053 A1 JPWO2021039053 A1 JP WO2021039053A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/055—Etched foil electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019154763 | 2019-08-27 | ||
JP2019154763 | 2019-08-27 | ||
PCT/JP2020/024179 WO2021039053A1 (ja) | 2019-08-27 | 2020-06-19 | コンデンサ、接続構造及びコンデンサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021039053A1 true JPWO2021039053A1 (ja) | 2021-03-04 |
JP7028374B2 JP7028374B2 (ja) | 2022-03-02 |
Family
ID=74685835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021542037A Active JP7028374B2 (ja) | 2019-08-27 | 2020-06-19 | コンデンサ、接続構造及びコンデンサの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11972909B2 (ja) |
JP (1) | JP7028374B2 (ja) |
CN (1) | CN114365249A (ja) |
WO (1) | WO2021039053A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024009824A1 (ja) * | 2022-07-06 | 2024-01-11 | 株式会社村田製作所 | 固体電解コンデンサ及びコンデンサアレイ |
TW202405840A (zh) * | 2022-07-06 | 2024-02-01 | 日商村田製作所股份有限公司 | 固體電解電容器 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5057942A (ja) * | 1973-09-26 | 1975-05-20 | ||
JP2008105087A (ja) * | 2006-10-27 | 2008-05-08 | Honda Motor Co Ltd | 鉄部材とアルミニウム部材の接合方法及び鉄−アルミニウム接合体 |
JP2008130722A (ja) * | 2006-11-20 | 2008-06-05 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ内蔵回路基板とその製造方法 |
JP2008282835A (ja) * | 2007-05-08 | 2008-11-20 | Showa Denko Kk | コンデンサ用電極シートおよびその製造方法 |
WO2009001780A1 (ja) * | 2007-06-22 | 2008-12-31 | Rohm Co., Ltd. | 半導体装置およびその製造方法 |
JP2012224897A (ja) * | 2011-04-18 | 2012-11-15 | Sumitomo Chemical Co Ltd | アルミニウム材 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10154709A (ja) | 1996-09-25 | 1998-06-09 | Toshiba Corp | 半導体装置の製造方法 |
JP3439064B2 (ja) | 1997-03-27 | 2003-08-25 | 三洋電機株式会社 | 固体電解コンデンサ |
JP2004281750A (ja) | 2003-03-17 | 2004-10-07 | Nippon Chemicon Corp | 固体電解コンデンサアレイ |
JP2007251101A (ja) * | 2006-03-20 | 2007-09-27 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ内蔵回路基板およびそれを用いたインターポーザおよびパッケージ |
US10340092B2 (en) * | 2006-06-15 | 2019-07-02 | Murata Manufacturing Co., Ltd. | Solid electrolytic capacitor |
US20110050334A1 (en) | 2009-09-02 | 2011-03-03 | Qualcomm Incorporated | Integrated Voltage Regulator with Embedded Passive Device(s) |
JP5445673B2 (ja) * | 2010-04-21 | 2014-03-19 | 株式会社村田製作所 | 固体電解コンデンサ及びその製造方法 |
FR2972581B1 (fr) * | 2011-03-09 | 2015-01-02 | Commissariat Energie Atomique | Systeme d'equilibrage de charge pour batteries |
CN102148518B (zh) * | 2011-03-18 | 2013-06-26 | 清华大学深圳研究生院 | 二次电池组充放电动态回馈均衡装置及方法 |
WO2016181865A1 (ja) | 2015-05-12 | 2016-11-17 | 株式会社村田製作所 | コンデンサおよびその製造方法 |
CN109804446B (zh) * | 2016-10-06 | 2021-05-07 | 株式会社村田制作所 | 固体电解电容器 |
-
2020
- 2020-06-19 WO PCT/JP2020/024179 patent/WO2021039053A1/ja active Application Filing
- 2020-06-19 CN CN202080059825.4A patent/CN114365249A/zh active Pending
- 2020-06-19 JP JP2021542037A patent/JP7028374B2/ja active Active
-
2022
- 2022-02-08 US US17/666,961 patent/US11972909B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5057942A (ja) * | 1973-09-26 | 1975-05-20 | ||
JP2008105087A (ja) * | 2006-10-27 | 2008-05-08 | Honda Motor Co Ltd | 鉄部材とアルミニウム部材の接合方法及び鉄−アルミニウム接合体 |
JP2008130722A (ja) * | 2006-11-20 | 2008-06-05 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ内蔵回路基板とその製造方法 |
JP2008282835A (ja) * | 2007-05-08 | 2008-11-20 | Showa Denko Kk | コンデンサ用電極シートおよびその製造方法 |
WO2009001780A1 (ja) * | 2007-06-22 | 2008-12-31 | Rohm Co., Ltd. | 半導体装置およびその製造方法 |
JP2012224897A (ja) * | 2011-04-18 | 2012-11-15 | Sumitomo Chemical Co Ltd | アルミニウム材 |
Also Published As
Publication number | Publication date |
---|---|
US11972909B2 (en) | 2024-04-30 |
WO2021039053A1 (ja) | 2021-03-04 |
US20220165508A1 (en) | 2022-05-26 |
JP7028374B2 (ja) | 2022-03-02 |
CN114365249A (zh) | 2022-04-15 |
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