JPWO2021025052A1 - - Google Patents
Info
- Publication number
- JPWO2021025052A1 JPWO2021025052A1 JP2021537341A JP2021537341A JPWO2021025052A1 JP WO2021025052 A1 JPWO2021025052 A1 JP WO2021025052A1 JP 2021537341 A JP2021537341 A JP 2021537341A JP 2021537341 A JP2021537341 A JP 2021537341A JP WO2021025052 A1 JPWO2021025052 A1 JP WO2021025052A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019145015 | 2019-08-07 | ||
| JP2019145015 | 2019-08-07 | ||
| PCT/JP2020/029981 WO2021025052A1 (en) | 2019-08-07 | 2020-08-05 | Large-size thin-film deposition substrate and method for manufacturing same, segmented thin-film deposition substrate and method for manufacturing same, and production management method and production management system for segmented thin-film deposition substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021025052A1 true JPWO2021025052A1 (en) | 2021-02-11 |
| JP7119233B2 JP7119233B2 (en) | 2022-08-16 |
Family
ID=74503016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021537341A Active JP7119233B2 (en) | 2019-08-07 | 2020-08-05 | Large film-formed substrate and manufacturing method thereof, divided film-formed substrate and manufacturing method thereof, production control method and production control system for divided film-formed substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7119233B2 (en) |
| TW (1) | TWI761900B (en) |
| WO (1) | WO2021025052A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11957759B1 (en) | 2022-09-07 | 2024-04-16 | Arvinas Operations, Inc. | Rapidly accelerated fibrosarcoma (RAF) degrading compounds and associated methods of use |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62137818A (en) * | 1985-12-12 | 1987-06-20 | Fuji Electric Co Ltd | Manufacture of semiconductor device |
| JP2002050554A (en) * | 2000-07-31 | 2002-02-15 | Shin Etsu Handotai Co Ltd | Wafer for inspection, method and apparatus for manufacturing the same |
| JP2002313853A (en) * | 2001-04-12 | 2002-10-25 | Seiko Instruments Inc | Wafer marking device for semiconductor device |
| JP2005150496A (en) * | 2003-11-18 | 2005-06-09 | Toppan Printing Co Ltd | Anisotropic transparent solid material, spherical surface acoustic wave element and its manufacturing method |
| JP2009105210A (en) * | 2007-10-23 | 2009-05-14 | Toray Eng Co Ltd | Chip id marking method for semiconductor chip and marking device |
| JP2012104512A (en) * | 2010-11-05 | 2012-05-31 | Sharp Corp | Thin film solar cell module and method of manufacturing the same |
| WO2015025674A1 (en) * | 2013-08-20 | 2015-02-26 | 独立行政法人産業技術総合研究所 | Process substrate with crystal orientation mark, crystal orientation detection method, and crystal orientation mark reading device |
| US20180138396A1 (en) * | 2016-11-14 | 2018-05-17 | Everspin Technologies, Inc. | Method and apparatus for magnetic device alignment on an integrated circuit |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3891390B2 (en) * | 2000-09-28 | 2007-03-14 | 信越半導体株式会社 | Inspection wafer and inspection sample manufacturing method and manufacturing apparatus |
| JP3809353B2 (en) * | 2001-08-02 | 2006-08-16 | キヤノン株式会社 | Manufacturing method of workpiece with ID |
| EP2560048A4 (en) * | 2010-04-13 | 2017-08-23 | Asahi Kasei E-materials Corporation | Self-supporting film, self-supporting structure, method for manufacturing self-supporting film, and pellicle |
| JP6114411B2 (en) * | 2013-03-14 | 2017-04-12 | エーエスエムエル ネザーランズ ビー．ブイ． | Patterning device, marker forming method on substrate, and device manufacturing method |
| US10251382B2 (en) * | 2013-08-21 | 2019-04-09 | Navico Holding As | Wearable device for fishing |
| CN103962730B (en) * | 2014-04-29 | 2017-01-18 | 京东方科技集团股份有限公司 | Cutting method and device for flexible display panel and control device |
| US10106643B2 (en) * | 2015-03-31 | 2018-10-23 | 3M Innovative Properties Company | Dual-cure nanostructure transfer film |
| JP6876520B2 (en) * | 2016-06-24 | 2021-05-26 | キヤノントッキ株式会社 | Substrate sandwiching method, substrate sandwiching device, film forming method, film forming device, and electronic device manufacturing method, substrate mounting method, alignment method, substrate mounting device |
| KR102411710B1 (en) * | 2016-09-29 | 2022-06-20 | 니폰 제온 가부시키가이샤 | Resin film, barrier film and conductive film, and manufacturing method thereof |
| JP6986393B2 (en) * | 2016-11-15 | 2021-12-22 | ビアメカニクス株式会社 | Substrate processing method |
-
2020
- 2020-08-05 JP JP2021537341A patent/JP7119233B2/en active Active
- 2020-08-05 WO PCT/JP2020/029981 patent/WO2021025052A1/en active Application Filing
- 2020-08-07 TW TW109126852A patent/TWI761900B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62137818A (en) * | 1985-12-12 | 1987-06-20 | Fuji Electric Co Ltd | Manufacture of semiconductor device |
| JP2002050554A (en) * | 2000-07-31 | 2002-02-15 | Shin Etsu Handotai Co Ltd | Wafer for inspection, method and apparatus for manufacturing the same |
| JP2002313853A (en) * | 2001-04-12 | 2002-10-25 | Seiko Instruments Inc | Wafer marking device for semiconductor device |
| JP2005150496A (en) * | 2003-11-18 | 2005-06-09 | Toppan Printing Co Ltd | Anisotropic transparent solid material, spherical surface acoustic wave element and its manufacturing method |
| JP2009105210A (en) * | 2007-10-23 | 2009-05-14 | Toray Eng Co Ltd | Chip id marking method for semiconductor chip and marking device |
| JP2012104512A (en) * | 2010-11-05 | 2012-05-31 | Sharp Corp | Thin film solar cell module and method of manufacturing the same |
| WO2015025674A1 (en) * | 2013-08-20 | 2015-02-26 | 独立行政法人産業技術総合研究所 | Process substrate with crystal orientation mark, crystal orientation detection method, and crystal orientation mark reading device |
| US20180138396A1 (en) * | 2016-11-14 | 2018-05-17 | Everspin Technologies, Inc. | Method and apparatus for magnetic device alignment on an integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202111459A (en) | 2021-03-16 |
| WO2021025052A1 (en) | 2021-02-11 |
| TWI761900B (en) | 2022-04-21 |
| JP7119233B2 (en) | 2022-08-16 |
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