JPWO2021024361A1 - - Google Patents

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Publication number
JPWO2021024361A1
JPWO2021024361A1 JP2021538575A JP2021538575A JPWO2021024361A1 JP WO2021024361 A1 JPWO2021024361 A1 JP WO2021024361A1 JP 2021538575 A JP2021538575 A JP 2021538575A JP 2021538575 A JP2021538575 A JP 2021538575A JP WO2021024361 A1 JPWO2021024361 A1 JP WO2021024361A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021538575A
Other versions
JP7240506B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021024361A1 publication Critical patent/JPWO2021024361A1/ja
Application granted granted Critical
Publication of JP7240506B2 publication Critical patent/JP7240506B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/20—Responsive to malfunctions or to light source life; for protection
    • H05B47/29—Circuits providing for substitution of the light source in case of its failure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H05B47/155—Coordinated control of two or more light sources

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021538575A 2019-08-05 2019-08-05 光源装置 Active JP7240506B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/030772 WO2021024361A1 (ja) 2019-08-05 2019-08-05 光源装置

Publications (2)

Publication Number Publication Date
JPWO2021024361A1 true JPWO2021024361A1 (ja) 2021-02-11
JP7240506B2 JP7240506B2 (ja) 2023-03-15

Family

ID=74502559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021538575A Active JP7240506B2 (ja) 2019-08-05 2019-08-05 光源装置

Country Status (5)

Country Link
US (1) US11844167B2 (ja)
EP (1) EP4013205A4 (ja)
JP (1) JP7240506B2 (ja)
CN (1) CN114223321B (ja)
WO (1) WO2021024361A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261410A (ja) * 2005-03-17 2006-09-28 Matsushita Electric Ind Co Ltd 部品装着ヘッド及び部品装着方法
JP2008205226A (ja) * 2007-02-21 2008-09-04 Matsushita Electric Ind Co Ltd 電子部品実装用装置における撮像用の照明装置
JP2011100929A (ja) * 2009-11-09 2011-05-19 Hitachi High-Technologies Corp Ｌｅｄ駆動回路、発光装置、画像検査装置、分析装置、ｌｅｄ駆動回路の故障検査方法
JP2013191771A (ja) * 2012-03-14 2013-09-26 Fuji Mach Mfg Co Ltd 部品装着装置
WO2014049768A1 (ja) * 2012-09-27 2014-04-03 富士機械製造株式会社 部品実装機の稼働状況監視システム
WO2015068305A1 (ja) * 2013-11-11 2015-05-14 富士機械製造株式会社 部品装着装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08105722A (ja) * 1994-10-06 1996-04-23 Advantest Corp デバイス外観検査用照明器及びこの照明器を用いたデバイス外観自動検査装置
JP4253292B2 (ja) * 2002-03-01 2009-04-08 シャープ株式会社 発光装置並びに該発光装置を用いた表示装置及び読み取り装置
JP6279708B2 (ja) * 2014-02-25 2018-02-14 富士機械製造株式会社 部品装着装置
JP7002831B2 (ja) 2016-06-07 2022-01-20 株式会社Fuji 部品実装機
JP6744999B2 (ja) * 2017-09-28 2020-08-19 株式会社Ｆｕｊｉ 部品装着機

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261410A (ja) * 2005-03-17 2006-09-28 Matsushita Electric Ind Co Ltd 部品装着ヘッド及び部品装着方法
JP2008205226A (ja) * 2007-02-21 2008-09-04 Matsushita Electric Ind Co Ltd 電子部品実装用装置における撮像用の照明装置
JP2011100929A (ja) * 2009-11-09 2011-05-19 Hitachi High-Technologies Corp Ｌｅｄ駆動回路、発光装置、画像検査装置、分析装置、ｌｅｄ駆動回路の故障検査方法
JP2013191771A (ja) * 2012-03-14 2013-09-26 Fuji Mach Mfg Co Ltd 部品装着装置
WO2014049768A1 (ja) * 2012-09-27 2014-04-03 富士機械製造株式会社 部品実装機の稼働状況監視システム
WO2015068305A1 (ja) * 2013-11-11 2015-05-14 富士機械製造株式会社 部品装着装置

Also Published As

Publication number Publication date
US11844167B2 (en) 2023-12-12
EP4013205A1 (en) 2022-06-15
EP4013205A4 (en) 2022-08-10
WO2021024361A1 (ja) 2021-02-11
CN114223321B (zh) 2023-07-11
CN114223321A (zh) 2022-03-22
US20220338332A1 (en) 2022-10-20
JP7240506B2 (ja) 2023-03-15

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