JPWO2021020215A1 - - Google Patents

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Publication number
JPWO2021020215A1
JPWO2021020215A1 JP2021536965A JP2021536965A JPWO2021020215A1 JP WO2021020215 A1 JPWO2021020215 A1 JP WO2021020215A1 JP 2021536965 A JP2021536965 A JP 2021536965A JP 2021536965 A JP2021536965 A JP 2021536965A JP WO2021020215 A1 JPWO2021020215 A1 JP WO2021020215A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021536965A
Other languages
Japanese (ja)
Other versions
JP7279794B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021020215A1 publication Critical patent/JPWO2021020215A1/ja
Application granted granted Critical
Publication of JP7279794B2 publication Critical patent/JP7279794B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2021536965A 2019-07-31 2020-07-20 現像装置及び現像方法 Active JP7279794B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019141323 2019-07-31
JP2019141323 2019-07-31
PCT/JP2020/028120 WO2021020215A1 (ja) 2019-07-31 2020-07-20 現像装置及び現像方法

Publications (2)

Publication Number Publication Date
JPWO2021020215A1 true JPWO2021020215A1 (zh) 2021-02-04
JP7279794B2 JP7279794B2 (ja) 2023-05-23

Family

ID=74229618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021536965A Active JP7279794B2 (ja) 2019-07-31 2020-07-20 現像装置及び現像方法

Country Status (5)

Country Link
JP (1) JP7279794B2 (zh)
KR (1) KR20220037468A (zh)
CN (1) CN114144733A (zh)
TW (1) TWI837401B (zh)
WO (1) WO2021020215A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118790A (ja) * 1999-08-12 2001-04-27 Tokyo Electron Ltd 現像装置、基板処理装置及び現像方法
JP2001160532A (ja) * 1999-12-02 2001-06-12 Tokyo Electron Ltd 基板処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148231A (ja) * 1995-11-16 1997-06-06 Dainippon Screen Mfg Co Ltd 回転式基板処理装置
JP2008210872A (ja) * 2007-02-23 2008-09-11 Sokudo:Kk 基板現像方法と現像装置と基板処理装置
JP6303968B2 (ja) 2014-10-10 2018-04-04 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118790A (ja) * 1999-08-12 2001-04-27 Tokyo Electron Ltd 現像装置、基板処理装置及び現像方法
JP2001160532A (ja) * 1999-12-02 2001-06-12 Tokyo Electron Ltd 基板処理装置

Also Published As

Publication number Publication date
JP7279794B2 (ja) 2023-05-23
CN114144733A (zh) 2022-03-04
TWI837401B (zh) 2024-04-01
WO2021020215A1 (ja) 2021-02-04
KR20220037468A (ko) 2022-03-24
TW202121501A (zh) 2021-06-01

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