JPWO2021009854A1 - - Google Patents

Info

Publication number
JPWO2021009854A1
JPWO2021009854A1 JP2021532606A JP2021532606A JPWO2021009854A1 JP WO2021009854 A1 JPWO2021009854 A1 JP WO2021009854A1 JP 2021532606 A JP2021532606 A JP 2021532606A JP 2021532606 A JP2021532606 A JP 2021532606A JP WO2021009854 A1 JPWO2021009854 A1 JP WO2021009854A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021532606A
Other versions
JP7434323B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021009854A1 publication Critical patent/JPWO2021009854A1/ja
Application granted granted Critical
Publication of JP7434323B2 publication Critical patent/JP7434323B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/227—Driving means
    • B29C64/236—Driving means for motion in a direction within the plane of a layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/245—Platforms or substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021532606A 2019-07-16 2019-07-16 三次元造形機 Active JP7434323B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/027961 WO2021009854A1 (ja) 2019-07-16 2019-07-16 三次元造形機、および部品装着機

Publications (2)

Publication Number Publication Date
JPWO2021009854A1 true JPWO2021009854A1 (ja) 2021-01-21
JP7434323B2 JP7434323B2 (ja) 2024-02-20

Family

ID=74209740

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021532606A Active JP7434323B2 (ja) 2019-07-16 2019-07-16 三次元造形機
JP2021532666A Active JP7309878B2 (ja) 2019-07-16 2019-11-13 三次元造形機

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021532666A Active JP7309878B2 (ja) 2019-07-16 2019-11-13 三次元造形機

Country Status (4)

Country Link
US (2) US20220274336A1 (ja)
EP (2) EP4002962B1 (ja)
JP (2) JP7434323B2 (ja)
WO (2) WO2021009854A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3927135B1 (en) * 2019-02-14 2023-03-22 Fuji Corporation Component mounter
CN112959664A (zh) * 2021-02-01 2021-06-15 江西炫智教育科技有限公司 一种针对双头三维打印机的溶解取模辅助装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077674A (ja) * 2011-09-30 2013-04-25 Fuji Mach Mfg Co Ltd マルチディスペンサ装置
JP2014175331A (ja) * 2013-03-06 2014-09-22 Yamaha Motor Co Ltd 電子部品実装装置の部品供給方法および電子部品実装装置用部品供給装置
JP2015084388A (ja) * 2013-10-25 2015-04-30 シャープ株式会社 搭載部品収納治具、マルチ部品実装装置およびマルチ部品実装方法
US20170042034A1 (en) * 2014-04-21 2017-02-09 Cornell University System and methods for additive manufacturing of electromechanical assemblies
JP2017130553A (ja) * 2016-01-20 2017-07-27 株式会社ミマキエンジニアリング 電子素子設置基材の製造方法、電子部材の製造方法、及び造形装置
WO2018134873A1 (ja) * 2017-01-17 2018-07-26 ヤマハ発動機株式会社 被実装物作業装置
JP2018525523A (ja) * 2016-03-14 2018-09-06 ツェーエル・シュッツレヒツフェアヴァルトゥングス・ゲゼルシャフト・ミト・べシュレンクテル・ハフツング ３次元物体を付加製造するためのシステム
WO2019102522A1 (ja) * 2017-11-21 2019-05-31 株式会社Ｆｕｊｉ ３次元積層電子デバイスの製造方法及び３次元積層電子デバイス
WO2019133708A1 (en) * 2017-12-28 2019-07-04 Applied Materials, Inc. Additive manufacturing with powder dispensing
JP2019111776A (ja) * 2017-12-26 2019-07-11 前田建設工業株式会社 積層複合構造物の造形装置及び造形方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869658A (ja) 1981-10-15 1983-04-25 Dainippon Printing Co Ltd 枚葉紙の矯正装置
AU2287001A (en) * 1999-12-21 2001-07-03 Speedline Technologies, Inc. High speed electronic assembly system and method
JP2005322702A (ja) * 2004-05-07 2005-11-17 Matsushita Electric Ind Co Ltd メンテナンス装置
JP2006066811A (ja) * 2004-08-30 2006-03-09 Toshiba Corp はんだ印刷用マスク、部品実装方法
JP5008579B2 (ja) 2008-01-29 2012-08-22 富士機械製造株式会社 電子部品の実装方法、装置及びライン
JP4883071B2 (ja) * 2008-10-03 2012-02-22 パナソニック株式会社 電子部品実装システム
JP2010147267A (ja) * 2008-12-19 2010-07-01 Renesas Technology Corp 半導体集積回路装置および半導体集積回路装置の製造方法
JP6272346B2 (ja) * 2013-11-07 2018-01-31 富士機械製造株式会社 対基板作業装置および対基板作業ライン
US10667403B2 (en) * 2014-09-19 2020-05-26 Fuji Corporation Manufacturing apparatus for performing additive manufacturing of an electrical device
JP6512448B2 (ja) * 2015-11-30 2019-05-15 清水建設株式会社 建物の応答推定方法
EP3419402B1 (en) * 2016-02-17 2021-10-27 Fuji Corporation Work apparatus and production line
DE102016221821A1 (de) * 2016-11-08 2018-05-09 Robert Bosch Gmbh Verfahren und Vorrichtung zur additiven Fertigung eines dreidimensionalen Werkstücks
JP6677183B2 (ja) * 2017-01-25 2020-04-08 オムロン株式会社 制御装置
JP2018182050A (ja) 2017-04-12 2018-11-15 株式会社村田製作所 回路基板の製造方法、および、回路基板
JP6971142B2 (ja) * 2017-12-20 2021-11-24 株式会社Fuji 基板生産ラインおよび情報管理装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077674A (ja) * 2011-09-30 2013-04-25 Fuji Mach Mfg Co Ltd マルチディスペンサ装置
JP2014175331A (ja) * 2013-03-06 2014-09-22 Yamaha Motor Co Ltd 電子部品実装装置の部品供給方法および電子部品実装装置用部品供給装置
JP2015084388A (ja) * 2013-10-25 2015-04-30 シャープ株式会社 搭載部品収納治具、マルチ部品実装装置およびマルチ部品実装方法
US20170042034A1 (en) * 2014-04-21 2017-02-09 Cornell University System and methods for additive manufacturing of electromechanical assemblies
JP2017130553A (ja) * 2016-01-20 2017-07-27 株式会社ミマキエンジニアリング 電子素子設置基材の製造方法、電子部材の製造方法、及び造形装置
JP2018525523A (ja) * 2016-03-14 2018-09-06 ツェーエル・シュッツレヒツフェアヴァルトゥングス・ゲゼルシャフト・ミト・べシュレンクテル・ハフツング ３次元物体を付加製造するためのシステム
WO2018134873A1 (ja) * 2017-01-17 2018-07-26 ヤマハ発動機株式会社 被実装物作業装置
WO2019102522A1 (ja) * 2017-11-21 2019-05-31 株式会社Ｆｕｊｉ ３次元積層電子デバイスの製造方法及び３次元積層電子デバイス
JP2019111776A (ja) * 2017-12-26 2019-07-11 前田建設工業株式会社 積層複合構造物の造形装置及び造形方法
WO2019133708A1 (en) * 2017-12-28 2019-07-04 Applied Materials, Inc. Additive manufacturing with powder dispensing

Also Published As

Publication number Publication date
EP4002962B1 (en) 2024-08-28
EP4000930A1 (en) 2022-05-25
EP4000930A4 (en) 2022-09-14
WO2021009854A1 (ja) 2021-01-21
JP7434323B2 (ja) 2024-02-20
JP7309878B2 (ja) 2023-07-18
US20220274336A1 (en) 2022-09-01
US20220264777A1 (en) 2022-08-18
JPWO2021009940A1 (ja) 2021-01-21
WO2021009940A1 (ja) 2021-01-21
EP4002962A1 (en) 2022-05-25
EP4002962A4 (en) 2022-07-20

Similar Documents

Publication Publication Date Title
BR112019017762A2 (ja)
BR112019016141A2 (ja)
BR112021017738A2 (ja)
AU2020104490A5 (ja)
BR112021008711A2 (ja)
BR112019016138A2 (ja)
BR112019016142A2 (ja)
BR112021018452A2 (ja)
BR112021018584A2 (ja)
BR112021015080A2 (ja)
BR112021012348A2 (ja)
BR112021013944A2 (ja)
BR112021013128A2 (ja)
JPWO2021009940A1 (ja)
JPWO2021019684A1 (ja)
BR112021018484A2 (ja)
BR112021016821A2 (ja)
BR112021016996A2 (ja)
BR112021017010A2 (ja)
AT524962A5 (ja)
BR102019023359A2 (ja)
BR112019016136A2 (ja)
BR112021013854A2 (ja)
BR112021016784A2 (ja)
BR112021016979A2 (ja)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211103

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220823

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20221013

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230419

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20230419

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20230427

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20230616

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240207

R150 Certificate of patent or registration of utility model

Ref document number: 7434323

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150