JPWO2021006055A1 - - Google Patents

Info

Publication number
JPWO2021006055A1
JPWO2021006055A1 JP2021530593A JP2021530593A JPWO2021006055A1 JP WO2021006055 A1 JPWO2021006055 A1 JP WO2021006055A1 JP 2021530593 A JP2021530593 A JP 2021530593A JP 2021530593 A JP2021530593 A JP 2021530593A JP WO2021006055 A1 JPWO2021006055 A1 JP WO2021006055A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021530593A
Other versions
JPWO2021006055A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021006055A1 publication Critical patent/JPWO2021006055A1/ja
Publication of JPWO2021006055A5 publication Critical patent/JPWO2021006055A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25Constructional features of resonators using surface acoustic waves
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02543Characteristics of substrate, e.g. cutting angles
    • H03H9/02551Characteristics of substrate, e.g. cutting angles of quartz substrates
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02015Characteristics of piezoelectric layers, e.g. cutting angles
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02228Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02543Characteristics of substrate, e.g. cutting angles
    • H03H9/02559Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02543Characteristics of substrate, e.g. cutting angles
    • H03H9/02574Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/64Filters using surface acoustic waves
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/64Filters using surface acoustic waves
    • H03H9/6423Means for obtaining a particular transfer characteristic
    • H03H9/6433Coupled resonator filters
    • H03H9/6483Ladder SAW filters

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2021530593A 2019-07-05 2020-06-25 Pending JPWO2021006055A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019126540 2019-07-05
PCT/JP2020/025013 WO2021006055A1 (ja) 2019-07-05 2020-06-25 弾性波装置、高周波フロントエンド回路及び通信装置

Publications (2)

Publication Number Publication Date
JPWO2021006055A1 true JPWO2021006055A1 (ja) 2021-01-14
JPWO2021006055A5 JPWO2021006055A5 (ja) 2022-03-17

Family

ID=74115210

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021530593A Pending JPWO2021006055A1 (ja) 2019-07-05 2020-06-25

Country Status (4)

Country Link
JP (1) JPWO2021006055A1 (ja)
KR (1) KR20220008345A (ja)
CN (1) CN113940002A (ja)
WO (1) WO2021006055A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015012005A1 (ja) * 2013-07-25 2015-01-29 日本碍子株式会社 複合基板及びその製法
US20170222622A1 (en) * 2016-01-28 2017-08-03 Triquint Semiconductor, Inc. Surface acoustic wave device having a piezoelectric layer on a quartz substrate and methods of manufacturing thereof
WO2018043610A1 (ja) * 2016-09-02 2018-03-08 株式会社村田製作所 弾性波フィルタ装置、高周波フロントエンド回路及び通信装置
WO2018070369A1 (ja) * 2016-10-11 2018-04-19 京セラ株式会社 弾性波装置
WO2018097016A1 (ja) * 2016-11-25 2018-05-31 国立大学法人東北大学 弾性波デバイス
JP2019036963A (ja) * 2017-08-18 2019-03-07 スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. キャリアアグリゲーションシステム用の弾性表面波デバイスを備えたフィルタ
JP2019080313A (ja) * 2017-10-23 2019-05-23 コーボ ユーエス,インコーポレイティド 誘導sawデバイスのための水晶方位

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10924085B2 (en) 2016-10-17 2021-02-16 Qorvo Us, Inc. Guided acoustic wave device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015012005A1 (ja) * 2013-07-25 2015-01-29 日本碍子株式会社 複合基板及びその製法
US20170222622A1 (en) * 2016-01-28 2017-08-03 Triquint Semiconductor, Inc. Surface acoustic wave device having a piezoelectric layer on a quartz substrate and methods of manufacturing thereof
WO2018043610A1 (ja) * 2016-09-02 2018-03-08 株式会社村田製作所 弾性波フィルタ装置、高周波フロントエンド回路及び通信装置
WO2018070369A1 (ja) * 2016-10-11 2018-04-19 京セラ株式会社 弾性波装置
WO2018097016A1 (ja) * 2016-11-25 2018-05-31 国立大学法人東北大学 弾性波デバイス
JP2019036963A (ja) * 2017-08-18 2019-03-07 スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. キャリアアグリゲーションシステム用の弾性表面波デバイスを備えたフィルタ
JP2019080313A (ja) * 2017-10-23 2019-05-23 コーボ ユーエス,インコーポレイティド 誘導sawデバイスのための水晶方位

Also Published As

Publication number Publication date
WO2021006055A1 (ja) 2021-01-14
US20220131517A1 (en) 2022-04-28
CN113940002A (zh) 2022-01-14
KR20220008345A (ko) 2022-01-20

Similar Documents

Publication Publication Date Title
BR112021017339A2 (ja)
BR112021018450A2 (ja)
BR112021017939A2 (ja)
BR112021017892A2 (ja)
AU2020104490A4 (ja)
BR112021017738A2 (ja)
BR112021017782A2 (ja)
BR112021018168A2 (ja)
BR112021017728A2 (ja)
JPWO2021079830A1 (ja)
BR112021017234A2 (ja)
BR112021017355A2 (ja)
BR112021017173A2 (ja)
BR112021018102A2 (ja)
BR112021017083A2 (ja)
BR112021017637A2 (ja)
BR112021018452A2 (ja)
BR112021018250A2 (ja)
BR112021018093A2 (ja)
BR112021018084A2 (ja)
BR112021017703A2 (ja)
BR112021018484A2 (ja)
BR112021017732A2 (ja)
JPWO2021006056A1 (ja)
BR112021017949A2 (ja)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211224

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211224

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230221

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230424

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230801

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231101

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20231110

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20240126