JPWO2021005972A1 - - Google Patents

Info

Publication number
JPWO2021005972A1
JPWO2021005972A1 JP2021530552A JP2021530552A JPWO2021005972A1 JP WO2021005972 A1 JPWO2021005972 A1 JP WO2021005972A1 JP 2021530552 A JP2021530552 A JP 2021530552A JP 2021530552 A JP2021530552 A JP 2021530552A JP WO2021005972 A1 JPWO2021005972 A1 JP WO2021005972A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021530552A
Other versions
JP7021721B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021005972A1 publication Critical patent/JPWO2021005972A1/ja
Application granted granted Critical
Publication of JP7021721B2 publication Critical patent/JP7021721B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021530552A 2019-07-10 2020-06-15 多層基板 Active JP7021721B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019128610 2019-07-10
JP2019128610 2019-07-10
PCT/JP2020/023357 WO2021005972A1 (ja) 2019-07-10 2020-06-15 多層基板

Publications (2)

Publication Number Publication Date
JPWO2021005972A1 true JPWO2021005972A1 (ja) 2021-01-14
JP7021721B2 JP7021721B2 (ja) 2022-02-17

Family

ID=74114228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021530552A Active JP7021721B2 (ja) 2019-07-10 2020-06-15 多層基板

Country Status (4)

Country Link
US (1) US12004290B2 (ja)
JP (1) JP7021721B2 (ja)
CN (1) CN216491173U (ja)
WO (1) WO2021005972A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022264725A1 (ja) 2021-06-16 2022-12-22 株式会社村田製作所 多層基板及び多層基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144452A (ja) * 1999-11-15 2001-05-25 Nec Corp 多層プリント基板
US20090211792A1 (en) * 2008-02-22 2009-08-27 Abrahamson Paul V Flexible Printed Circuit Assembly With Reduced Dielectric Loss
WO2016047540A1 (ja) * 2014-09-26 2016-03-31 株式会社村田製作所 伝送線路および電子機器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291806A (ja) 1992-04-08 1993-11-05 Nitto Denko Corp 高周波用回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144452A (ja) * 1999-11-15 2001-05-25 Nec Corp 多層プリント基板
US20090211792A1 (en) * 2008-02-22 2009-08-27 Abrahamson Paul V Flexible Printed Circuit Assembly With Reduced Dielectric Loss
WO2016047540A1 (ja) * 2014-09-26 2016-03-31 株式会社村田製作所 伝送線路および電子機器

Also Published As

Publication number Publication date
US12004290B2 (en) 2024-06-04
US20220053632A1 (en) 2022-02-17
JP7021721B2 (ja) 2022-02-17
CN216491173U (zh) 2022-05-10
WO2021005972A1 (ja) 2021-01-14

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