JPWO2021005913A1 - - Google Patents

Info

Publication number
JPWO2021005913A1
JPWO2021005913A1 JP2021530524A JP2021530524A JPWO2021005913A1 JP WO2021005913 A1 JPWO2021005913 A1 JP WO2021005913A1 JP 2021530524 A JP2021530524 A JP 2021530524A JP 2021530524 A JP2021530524 A JP 2021530524A JP WO2021005913 A1 JPWO2021005913 A1 JP WO2021005913A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021530524A
Other languages
Japanese (ja)
Other versions
JP7521814B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021005913A1 publication Critical patent/JPWO2021005913A1/ja
Application granted granted Critical
Publication of JP7521814B2 publication Critical patent/JP7521814B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
JP2021530524A 2019-07-08 2020-05-29 硬化性組成物、硬化物、オーバーコート膜、並びにフレキシブル配線板及びその製造方法 Active JP7521814B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019126907 2019-07-08
JP2019126907 2019-07-08
PCT/JP2020/021411 WO2021005913A1 (ja) 2019-07-08 2020-05-29 硬化性組成物、硬化物、オーバーコート膜、並びにフレキシブル配線板及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2021005913A1 true JPWO2021005913A1 (zh) 2021-01-14
JP7521814B2 JP7521814B2 (ja) 2024-07-24

Family

ID=74114003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021530524A Active JP7521814B2 (ja) 2019-07-08 2020-05-29 硬化性組成物、硬化物、オーバーコート膜、並びにフレキシブル配線板及びその製造方法

Country Status (5)

Country Link
JP (1) JP7521814B2 (zh)
KR (1) KR20220033490A (zh)
CN (1) CN114072444B (zh)
TW (1) TWI753456B (zh)
WO (1) WO2021005913A1 (zh)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000171973A (ja) 1998-12-08 2000-06-23 Ngk Spark Plug Co Ltd 感光性樹脂組成物及びソルダーレジスト用感光性樹脂組成物
AU2003221053A1 (en) 2002-03-29 2003-10-27 Taiyo Ink Manufacturing Co., Ltd. Unsaturated polybranched compounds, curable compositions containing the same and cured articles thereof
JP2007131833A (ja) 2005-10-13 2007-05-31 Hitachi Chem Co Ltd 変性エポキシ樹脂及びその製造方法、並びに、感光性樹脂組成物及びこれを用いた感光性エレメント
WO2011074469A1 (ja) * 2009-12-14 2011-06-23 太陽ホールディングス株式会社 ソルダーレジストインキ組成物及びその硬化物
US20120305295A1 (en) * 2010-02-03 2012-12-06 Showa Denko K.K. Thermosetting composition
EP3395900B1 (en) 2015-12-25 2021-09-22 Nippon Polytech Corp. Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same
KR102265094B1 (ko) 2016-03-23 2021-06-15 한국공항공사 로드 블럭 및 이를 포함하는 차량 차단 시스템
WO2017170795A1 (ja) 2016-03-30 2017-10-05 東洋インキＳｃホールディングス株式会社 樹脂組成物および電子素子

Also Published As

Publication number Publication date
CN114072444A (zh) 2022-02-18
TWI753456B (zh) 2022-01-21
KR20220033490A (ko) 2022-03-16
JP7521814B2 (ja) 2024-07-24
WO2021005913A1 (ja) 2021-01-14
CN114072444B (zh) 2024-07-09
TW202106740A (zh) 2021-02-16

Similar Documents

Publication Publication Date Title
BR112019017762A2 (zh)
BR112021017339A2 (zh)
BR112021018450A2 (zh)
BR112019016141A2 (zh)
BR112021017939A2 (zh)
BR112021017738A2 (zh)
BR112021017892A2 (zh)
BR112021017782A2 (zh)
AU2020104490A5 (zh)
BR112021017637A2 (zh)
BR112021008711A2 (zh)
BR112019016142A2 (zh)
BR112019016138A2 (zh)
BR112021018168A2 (zh)
BR112021017728A2 (zh)
BR112021018452A2 (zh)
BR112021017355A2 (zh)
BR112021017703A2 (zh)
BR112021017173A2 (zh)
BR112021018102A2 (zh)
BR112021018584A2 (zh)
BR112021017083A2 (zh)
BR112021015080A2 (zh)
BR112021012348A2 (zh)
BR112021018250A2 (zh)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230412

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240227

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240410

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240625

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240704

R150 Certificate of patent or registration of utility model

Ref document number: 7521814

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150